Water

Water

SCHEMBL3310751

CC[N+](CC)(CCC(C)O)CCC(C)O.[OH-]

nearest known ligand 0.40

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ

The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.40
ALDH1A1 P00352 2/20 0.38
NFKB1 P19838 1/20 0.37
KCNA1 Q09470 1/20 0.37
KDM4E B2RXH2 1/20 0.35
PMP22 Q01453 1/20 0.35
ATM Q13315 1/20 0.35
TDP1 Q9NUW8 1/20 0.33
DNM1 Q05193 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL3304691 0.94 TSHR (0.40) TSHRALDH1A1NFKB1KCNA1KDM4E
Water SCHEMBL3312115 0.94 TSHR (0.40) TSHRALDH1A1NFKB1KCNA1KDM4E
Water SCHEMBL3312678 0.81 SLC22A1 (0.53) TSHRALDH1A1TDP1
Hydrochloric Acid SCHEMBL10718209 0.79 TSHR (0.44) TSHRALDH1A1TDP1
Water SCHEMBL3306110 0.77 SLC22A1 (0.57) TSHRALDH1A1DNM1
Water SCHEMBL1334084 0.77 TSHR (0.42) TSHRALDH1A1NFKB1KDM4EPMP22
Water SCHEMBL3302970 0.76 DNM1 (0.39) TSHRALDH1A1TDP1DNM1
Water SCHEMBL3305359 0.76 TSHR (0.38) TSHRALDH1A1TDP1
Tetrylammonium SCHEMBL28969146 0.74 TDP1 (0.59) TSHRALDH1A1NFKB1KCNA1KDM4E
Water SCHEMBL10626861 0.74 TSHR (0.42) TSHRALDH1A1NFKB1KCNA1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8349207-B2 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device JSR CORPORATION (JP) 2013-01-08 US disclosed
US-20100099260-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHNG AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2010-04-22 US disclosed
EP-2131389-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE JSR Corporation (JP) 2009-12-09 EP disclosed
US-20040077512-A1 Cleaning agent for a semi-conductor substrate WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2004-04-22 US disclosed
US-6716803-B2 HAVING COPPER WIRINGS ON ITS SURFACE, COMPRISING A NONIONIC SURFACTANT, ESPECIALLY A POLYOXYALKYLENE COMPOUNDS CONTAINING AN ACETYLENIC GROUP. WAKO PURE CHEMCIAL INDUSTRIES, LTD. (JP) 2004-04-06 US disclosed
US-6534458-B1 This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same. control a speed of etching on WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2003-03-18 US disclosed
US-20020016272-A1 Cleaning agent for a semi-conductor substrate WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2002-02-07 US disclosed
US-6310019-B1 COMPRISING NONIONIC SURFACTANT; FOR CLEANING SURFACE HAVING COPPER WIRINGS; CORROSION RESISTANCE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2001-10-30 US disclosed