Water

Water

SCHEMBL3302970

CC[N+](C)(C)CCC(C)O.[OH-]

nearest known ligand 0.48

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ

The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 2/20 0.39
HTT P42858 1/20 0.39
KMT2A Q03164 1/20 0.39
TSHR P16473 3/20 0.38
HSP90AA1 P07900 2/20 0.37
RAD52 P43351 1/20 0.37
BBOX1 O75936 3/20 0.37
TDP1 Q9NUW8 1/20 0.32
PSMD14 O00487 1/20 0.31
PLA2G1B P04054 1/20 0.31
MMP2 P08253 1/20 0.31
ATG4B Q9Y4P1 1/20 0.31
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28230537 0.97 TSHR (0.40) DNM1HTTKMT2ATSHRHSP90AA1
Water SCHEMBL3303884 0.86 TSHR (0.37) TSHRTDP1ALDH1A1
Water SCHEMBL3305359 0.84 TSHR (0.38) TSHRRAD52BBOX1TDP1PSMD14
SCHEMBL4228555 0.81 DNM1 (0.40) DNM1HTTKMT2ATSHRHSP90AA1
Water SCHEMBL3306334 0.80 TSHR (0.37) TSHRTDP1ALDH1A1
Hydrochloric Acid SCHEMBL27958932 0.79 DNM1 (0.39) DNM1HTTKMT2ATSHRHSP90AA1
Water SCHEMBL3304691 0.76 TSHR (0.40) DNM1TSHRTDP1ALDH1A1
Water SCHEMBL3312115 0.76 TSHR (0.40) DNM1TSHRTDP1ALDH1A1
Water SCHEMBL3310751 0.76 TSHR (0.40) DNM1TSHRTDP1ALDH1A1
Water SCHEMBL28099726 0.76 TSHR (0.40) DNM1HTTKMT2ATSHRHSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10304694-B2 Semiconductor treatment composition and treatment method JSR CORPORATION (JP) 2019-05-28 US disclosed
US-20190122896-A1 SEMICONDUCTOR TREATMENT COMPOSITION JSR CORPORATION (JP) 2019-04-25 US disclosed
US-20180226267-A1 SEMICONDUCTOR TREATMENT COMPOSITION AND TREATMENT METHOD JSR CORPORATION (JP) 2018-08-09 US disclosed
US-8349207-B2 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device JSR CORPORATION (JP) 2013-01-08 US disclosed
US-20100099260-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHNG AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2010-04-22 US disclosed
EP-2131389-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE JSR Corporation (JP) 2009-12-09 EP disclosed
US-20040077512-A1 Cleaning agent for a semi-conductor substrate WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2004-04-22 US disclosed
US-6716803-B2 HAVING COPPER WIRINGS ON ITS SURFACE, COMPRISING A NONIONIC SURFACTANT, ESPECIALLY A POLYOXYALKYLENE COMPOUNDS CONTAINING AN ACETYLENIC GROUP. WAKO PURE CHEMCIAL INDUSTRIES, LTD. (JP) 2004-04-06 US disclosed
US-6534458-B1 This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same. control a speed of etching on WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2003-03-18 US disclosed
US-20020016272-A1 Cleaning agent for a semi-conductor substrate WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2002-02-07 US disclosed
US-6310019-B1 COMPRISING NONIONIC SURFACTANT; FOR CLEANING SURFACE HAVING COPPER WIRINGS; CORROSION RESISTANCE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2001-10-30 US disclosed