SCHEMBL338081

SCHEMBL338081

COC(=O)c1cc(-c2ccc(C(=O)O)c(C(=O)OC)c2)ccc1C(=O)O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CFD P00746 1/20 0.50
CA12 O43570 2/20 0.48
CA1 P00915 2/20 0.48
CA2 P00918 2/20 0.48
CA7 P43166 2/20 0.48
CA9 Q16790 2/20 0.48
CA14 Q9ULX7 2/20 0.48
PDK2 Q15119 1/20 0.48
PDK4 Q16654 1/20 0.48
KDM4E B2RXH2 5/20 0.48
RXFP1 Q9HBX9 2/20 0.48
GFER P55789 1/20 0.48
KMT2A Q03164 1/20 0.48
NR4A2 P43354 2/20 0.46
CYP1A2 P05177 1/20 0.46
CYP2D6 P10635 1/20 0.46
CYP2C9 P11712 1/20 0.46
CYP2C19 P33261 1/20 0.46
MCL1 Q07820 4/20 0.46
GAA P10253 3/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL29809457 0.98 CFD (0.49) CFDCA12CA1CA2CA7
SCHEMBL6516527 0.96 CFD (0.47) CFDCA12CA1CA2CA7
SCHEMBL1709647 0.96 CFD (0.47) CFDCA12CA1CA2CA7
Water SCHEMBL15136858 0.94 CFD (0.46) CFDCA12CA1CA2CA7
SCHEMBL27552364 0.93 NR4A2 (0.56) KDM4EKMT2ANR4A2MCL1GAA
SCHEMBL13941279 0.92 CFD (0.50) CFDCA12CA1CA2CA7
SCHEMBL15136227 0.90 MCL1 (0.61) CFDCA12CA1CA2CA7
SCHEMBL29733451 0.90 CA12 (0.53) CA12CA1CA2CA7CA9
SCHEMBL6466451 0.90 CA12 (0.53) CA12CA1CA2CA7CA9
SCHEMBL9813479 0.88 CA12 (0.52) CA12CA1CA2CA7CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12630675-B2 Polyimide resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-05-19 US disclosed
US-12584015-B2 Polyimide resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-24 US disclosed
US-12577399-B2 Resin composition, resin molded article and method for producing same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-17 US disclosed
US-20260015501-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED PRODUCT, METAL FOIL LAMINATED BOARD, BONDING SHEET, FILAMENT, AND MATERIAL FOR THREE-DIMENSIONAL FABRICATION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-01-15 US disclosed
US-20250388735-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY, AND CONSTITUTING MEMBER OF IC SOCKET FOR INSPECTION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-12-25 US disclosed
EP-3936571-B1 FLAME-RETARDANT POLYIMIDE MOLDING MATERIAL AND MOLDED OBJECT MITSUBISHI GAS CHEMICAL CO (JP) 2025-12-17 EP disclosed
EP-3940017-B1 POLYIMIDE RESIN COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2025-12-03 EP disclosed
US-12466935-B2 Flame-retardant polyimide shaping material and shaped body MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-11-11 US disclosed
US-12447717-B2 Multilayered body and method for manufacturing same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-21 US disclosed
EP-4632008-A1 RESIN COMPOSITION AND MOLDED BODY MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-15 EP disclosed
US-8097693-B2 Endless tubular polyimide film GUNZE LIMITED (JP) 2012-01-17 US disclosed
US-20070178264-A1 Endless tubular polyimide film GUNZE LIMITED (JP) 2007-08-02 US disclosed
EP-1721924-A1 ENDLESS TUBULAR POLYIMIDE FILM GUNZE LIMITED (JP) 2006-11-15 EP disclosed
US-6962726-B2 Method for preparing substrate for flexible print wiring board, and substrate for flexible print wiring board UNITIKA LTD. (JP) 2005-11-08 US disclosed
EP-1292177-A1 METHOD FOR PREPARING SUBSTRATE FOR FLEXIBLE PRINT WIRING BOARD AND SUBSTRATE FOR FLEXIBLE PRINT WIRING BOARD UNITIKA LTD. (JP) 2003-03-12 EP disclosed
US-6133407-A LOW VISCOSITY SOLUTION CONTAINING HIGH CONCENTRATION OF SALT OF AROMATIC DIAMINE AND AROMATIC TETRACARBOXYLIC ACID AND/OR ITS DIESTER WHICH UNDERGOES IMIDATION UPON HEATING UNITKA LTD. (JP) 2000-10-17 US disclosed
EP-0887364-A2 Polyimide precursor solution, coating film obtained therefrom, and process for producing polyimide coating film UNITIKA LTD. (JP) 1998-12-30 EP disclosed
US-5847071-A Photosensitive resin composition HITACHI, CHEMICAL CO., LTD. (JP) 1998-12-08 US disclosed
US-5668248-A POLYAMIC ACID ESTERS HITACHI CHEMICAL CO., LTD. (JP) 1997-09-16 US disclosed
US-5472823-A Polyamic acids HITACHI CHEMICAL CO., LTD. (JP) 1995-12-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12577399-B2 Resin composition, resin molded article and method for producing same SEM1, WDR1, RER1 CFD 3004/4885CA12 1978/4885CA1 668/4885
US-12630675-B2 Polyimide resin composition SOD1, AOC2, GPX1 CFD 1778/4885CA12 580/4885CA1 152/4885
US-12584015-B2 Polyimide resin composition PSMA1, SEM1, RIF1 CFD 3525/4885CA12 1282/4885CA1 475/4885
US-20250388735-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY, AND CONSTITUTING MEMBER OF IC SOCKET FOR INSPECTION TAS1R1, PBRM1, TAF1 CFD 3661/4885CA12 1734/4885CA1 816/4885
US-20260015501-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED PRODUCT, METAL FOIL LAMINATED BOARD, BONDING SHEET, FILAMENT, AND MATERIAL FOR THREE-DIMENSIONAL FABRICATION TRA2B, TERB1, MALT1 CFD 2834/4885CA12 1282/4885CA1 683/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.