SCHEMBL343609

SCHEMBL343609

Nc1cc(C(=O)O)cc2ccccc12

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.52
HPGD P15428 6/20 0.52
HSD17B10 Q99714 6/20 0.52
MEN1 O00255 4/20 0.52
KMT2A Q03164 4/20 0.52
KDM4E B2RXH2 4/20 0.52
CYP2C19 P33261 2/20 0.52
GLA P06280 2/20 0.52
CYP1A2 P05177 1/20 0.52
PTPN1 P18031 1/20 0.49
IDO1 P14902 1/20 0.48
MAPT P10636 4/20 0.45
THRB P10828 2/20 0.45
PKM P14618 1/20 0.45
GRIN2D O15399 1/20 0.45
GRIN2A Q12879 1/20 0.45
GRIN2C Q14957 1/20 0.45
GAA P10253 1/20 0.45
MGAM O43451 1/20 0.44
CYP2C9 P11712 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28375782 0.89 IDO1 (0.70) ALDH1A1HPGDHSD17B10MEN1KMT2A
SCHEMBL31061825 0.82 PTPN1 (0.50) ALDH1A1HPGDHSD17B10MEN1KMT2A
SCHEMBL28721557 0.81 GRIN2D (0.49) ALDH1A1HPGDHSD17B10MEN1KMT2A
SCHEMBL30363668 0.80 MEN1 (0.55) ALDH1A1HPGDHSD17B10MEN1KMT2A
SCHEMBL7554285 0.80 MEN1 (0.55) ALDH1A1HPGDHSD17B10MEN1KMT2A
SCHEMBL341301 0.79 PTPN1 (0.66) ALDH1A1HPGDHSD17B10MEN1KMT2A
SCHEMBL29397498 0.79 PTPN1 (0.66) ALDH1A1HPGDHSD17B10MEN1KMT2A
SCHEMBL8000087 0.79 ALDH1A1 (0.57) ALDH1A1HPGDHSD17B10MEN1KMT2A
SCHEMBL70654 0.78 PTPN1 (0.65) ALDH1A1HPGDHSD17B10MEN1KMT2A
SCHEMBL163552 0.78 MEN1 (0.53) ALDH1A1HPGDHSD17B10MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 242 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119781246-A Photosensitive polyimide resin composition, cured film, and preparation method and application thereof 吉林奥来德光电材料股份有限公司 2025-04-08 CN claimed
CN-115010924-B Photosensitive polyimide resin composition, polyimide resin film containing photosensitive polyimide resin composition and application of photosensitive polyimide resin composition 吉林奥来德光电材料股份有限公司 2023-10-13 CN claimed
CN-115010924-A Photosensitive polyimide resin composition, polyimide resin film containing same and application of polyimide resin film 吉林奥来德光电材料股份有限公司 2022-09-06 CN claimed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP claimed
CN-101250164-A Water-soluble triazine derivatives as well as preparation method and uses thereof CHINESE ACAD INST CHEMISTRY (CN) 2008-08-27 CN claimed
US-20060074105-A1 Substituted quinoline and quinazoline inhibitors of quinone reductase 2 SERENEX, INC. (US) 2006-04-06 US claimed
WO-2006034235-A2 SUBSTITUTED QUINOLINE AND QUINAZOLINE INHIBITORS OF QUINONE REDUCTASE 2 SERENEX, INC. (US) 2006-03-30 WO claimed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
EP-4636011-A1 POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-22 EP disclosed
EP-0790275-A1 PREFOAMED PARTICLES OF POLYPROPYLENE RESIN AND PROCESS FOR PRODUCING THE SAME KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1997-08-20 EP disclosed
EP-0776933-A1 Polybutene-1 resin composition and a method of accelerating the crystal transformation NEW JAPAN CHEMICAL CO.,LTD. (JP) 1997-06-04 EP disclosed
US-5491188-A ADDING DIAMIDE COMPOUNDS AS NUCLEATING AGENT TO PROPYLENE HOMO-, CO- AND TERPOLYMERS; FILTRATION MEMBRANES, PRINTING SHEETS NEW JAPAN CHEMICAL CO., LTD. (JP) 1996-02-13 US disclosed
CN-1098725-A Based on porous stretched article of acrylic resin and preparation method thereof NEW JAPAN CHEM CO LTD (JP) 1995-02-15 CN disclosed
EP-0632095-A2 Porous stretched article of polypropylene-based resin and process for its preparation NEW JAPAN CHEMICAL CO.,LTD. (JP) 1995-01-04 EP disclosed
EP-0557721-A2 Crystalline polypropylene resin composition and amide compounds NEW JAPAN CHEMICAL CO.,LTD. (JP) 1993-09-01 EP disclosed
CN-85107032-A The preparation of ruthenium complex and application 1987-04-01 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR ALDH1A1 3706/4885HPGD 3438/4885HSD17B10 4284/4885
US-20060074105-A1 Substituted quinoline and quinazoline inhibitors of quinone reductase 2 NQO2, QTRT1, QTRT2 ALDH1A1 867/4885HPGD 533/4885HSD17B10 419/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 ALDH1A1 3281/4885HPGD 4313/4885HSD17B10 4119/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.