SCHEMBL3481489

SCHEMBL3481489

CCC[Si](C)(OC)c1ccccc1

nearest known ligand 0.33

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.33
ESR2 Q92731 1/20 0.33
TP53 P04637 1/20 0.31
CA4 P22748 1/20 0.31
MAPT P10636 1/20 0.31
KDM4E B2RXH2 1/20 0.31
ALDH1A1 P00352 1/20 0.31
GAA P10253 1/20 0.31
HPGD P15428 1/20 0.31
LTA4H P09960 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3481678 0.88 LTA4H (0.36) ESR1ESR2LTA4H
SCHEMBL5180277 0.86 LTA4H (0.37) ALDH1A1LTA4H
SCHEMBL12680254 0.85 ESR1 (0.34) ESR1ESR2TP53MAPTKDM4E
SCHEMBL13089509 0.83 ESR1 (0.33) ESR1ESR2CA4MAPTALDH1A1
SCHEMBL837628 0.83 ESR1 (0.35) ESR1ESR2TP53CA4MAPT
SCHEMBL13089524 0.82 ESR1 (0.31) ESR1ESR2
SCHEMBL13089537 0.82 MAPT (0.33) ESR1ESR2CA4MAPTALDH1A1
SCHEMBL4729166 0.82 ESR1 (0.32) ESR1ESR2TP53MAPT
SCHEMBL3482722 0.82 ESR1 (0.32) ESR1ESR2TP53MAPTKDM4E
SCHEMBL3481608 0.80 LMNA (0.35) ESR1ESR2TP53ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115181223-B Low-gloss matte auxiliary agent, preparation method thereof and molded body 铨盛聚碳科技股份有限公司 2023-08-29 CN claimed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed