SCHEMBL3481591

SCHEMBL3481591

Cc1ccc([SiH](O)c2ccccc2)cc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACHE P22303 3/20 0.48
LMNA P02545 3/20 0.48
TSHR P16473 1/20 0.48
ALOX12 P18054 1/20 0.48
CES2 O00748 1/20 0.43
CES1 P23141 1/20 0.43
SMN1; SMN2 Q16637 3/20 0.42
ALDH1A1 P00352 2/20 0.42
HPGD P15428 2/20 0.41
TDP1 Q9NUW8 2/20 0.40
NPC1 O15118 3/20 0.39
RAB9A P51151 3/20 0.39
MEN1 O00255 3/20 0.39
KMT2A Q03164 3/20 0.39
SRD5A2 P31213 1/20 0.38
MAPT P10636 2/20 0.36
CYP2D6 P10635 1/20 0.36
HIF1A Q16665 1/20 0.36
AKR1C3 P42330 1/20 0.36
POLB P06746 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31187417 0.89 ACHE (0.50) ACHELMNATSHRALOX12CES2
SCHEMBL118540 0.84 TSHR (0.40) ACHELMNATSHRALOX12CES2
SCHEMBL3481666 0.81 ACHE (0.38) ACHELMNATSHRALOX12CES2
SCHEMBL6669960 0.81 TSHR (0.38) ACHELMNATSHRALOX12CES2
SCHEMBL9622609 0.81 TSHR (0.38) ACHELMNATSHRALOX12CES2
SCHEMBL4631055 0.81 TSHR (0.38) ACHELMNATSHRALOX12CES2
SCHEMBL2455761 0.79 ACHE (0.53) ACHELMNATSHRALOX12CES2
SCHEMBL7825995 0.79 ACHE (0.53) ACHELMNATSHRALOX12CES2
SCHEMBL12191027 0.77 ACHE (0.50) ACHELMNATSHRALOX12CES2
SCHEMBL5596457 0.75 ALDH1A1 (0.34) TSHRALDH1A1TDP1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed