SCHEMBL3482147

SCHEMBL3482147

CCCO[Si](C)(OCCC)c1ccc(C)cc1

nearest known ligand 0.33

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ACHE P22303 2/20 0.33
TDP1 Q9NUW8 1/20 0.33
ESR1 P03372 1/20 0.32
ESR2 Q92731 1/20 0.32
ALDH1A1 P00352 1/20 0.31
POLB P06746 1/20 0.31
AGXT P21549 1/20 0.30
CYP19A1 P11511 1/20 0.30
CYP2C9 P11712 1/20 0.30
CYP2C19 P33261 1/20 0.30
AR P10275 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL705703 0.91 ESR1 (0.31) ESR1ESR2ALDH1A1CYP19A1CYP2C9
SCHEMBL3481700 0.83 ACHE (0.33) ACHETDP1ALDH1A1POLBAGXT
SCHEMBL3482055 0.83 ACHE (0.36) ACHETDP1ESR1ESR2ALDH1A1
SCHEMBL9804106 0.82 MAPT (0.38) ACHETDP1ALDH1A1POLBCYP2C9
SCHEMBL19809191 0.82 ESR1 (0.47) ACHETDP1ESR1ESR2ALDH1A1
SCHEMBL28062839 0.82 ALDH1A1 (0.34) TDP1ALDH1A1POLB
SCHEMBL3481566 0.82 TP53 (0.34) TDP1ALDH1A1
SCHEMBL28062851 0.82 MAPT (0.33) ALDH1A1CYP2C19
SCHEMBL3867721 0.81 ACHE (0.35) ACHETDP1ALDH1A1POLBAGXT
SCHEMBL3871457 0.81 ACHE (0.35) ACHETDP1ALDH1A1POLBAGXT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
EP-0310320-B1 Curable composition JAPAN SYNTHETIC RUBBER CO LTD (JP) 1994-12-28 EP disclosed
US-4923948-A Curable composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1990-05-08 US disclosed
EP-0310320-A2 Curable composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1989-04-05 EP disclosed