Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACHE | P22303 | 2/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
| ▸ | AGXT | P21549 | 1/20 | 0.30 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.30 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.30 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL705459 | 0.91 | CYP19A1 (0.32) | ALDH1A1CYP19A1CYP2C9CYP2C19 | |
| SCHEMBL3482147 | 0.83 | ACHE (0.33) | ACHETDP1ALDH1A1POLBAGXT | |
| SCHEMBL3481807 | 0.83 | ACHE (0.36) | ACHETDP1ALDH1A1AGXT | |
| SCHEMBL8954017 | 0.82 | MAPT (0.38) | ACHETDP1ALDH1A1POLBCYP2C9 | |
| SCHEMBL3482299 | 0.82 | TP53 (0.34) | TDP1ALDH1A1 | |
| SCHEMBL704364 | 0.81 | LMNA (0.38) | ALDH1A1CYP19A1CYP2C9CYP2C19 | |
| SCHEMBL106488 | 0.81 | ACHE (0.35) | ACHETDP1ALDH1A1POLBAGXT | |
| SCHEMBL3871457 | 0.81 | ACHE (0.35) | ACHETDP1ALDH1A1POLBAGXT | |
| SCHEMBL3867721 | 0.81 | ACHE (0.35) | ACHETDP1ALDH1A1POLBAGXT | |
| SCHEMBL3481583 | 0.80 | CA1 (0.42) | ACHETDP1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |