Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GPR3 | P46089 | 2/20 | 0.47 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.39 |
| ▸ | KCNH2 | Q12809 | 10/20 | 0.37 |
| ▸ | ACHE | P22303 | 5/20 | 0.37 |
| ▸ | CA1 | P00915 | 1/20 | 0.35 |
| ▸ | CA2 | P00918 | 1/20 | 0.35 |
| ▸ | CA5A | P35218 | 1/20 | 0.35 |
| ▸ | CA9 | Q16790 | 1/20 | 0.35 |
| ▸ | HSD11B1 | P28845 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Trifluoromethanesulfonic Acid SCHEMBL31028107 | 0.90 | KCNH2 (0.43) | GPR3PTPN1KCNH2HSD11B1 | |
| Trifluoromethanesulfonic Acid SCHEMBL36457 | 0.88 | GPR3 (0.47) | GPR3PTPN1KCNH2ACHECA1 | |
| Trifluoromethanesulfonic Acid SCHEMBL74504 | 0.87 | ALDH1A1 (0.39) | GPR3 | |
| Trifluoromethanesulfonic Acid SCHEMBL8088603 | 0.85 | GPR3 (0.44) | GPR3PTPN1KCNH2ACHECA1 | |
| SCHEMBL1593671 | 0.84 | GPR3 (0.34) | GPR3PTPN1CA1CA2CA5A | |
| Trifluoromethanesulfonic Acid SCHEMBL31155703 | 0.83 | GPR3 (0.50) | GPR3PTPN1KCNH2ACHECA1 | |
| Trifluoromethanesulfonic Acid SCHEMBL37032 | 0.83 | GPR3 (0.50) | GPR3PTPN1KCNH2ACHECA1 | |
| Trifluoromethanesulfonic Acid SCHEMBL2949122 | 0.83 | GPR3 (0.36) | GPR3KCNH2ACHECA1CA2 | |
| SCHEMBL270029 | 0.83 | CA1 (0.36) | GPR3PTPN1CA1CA2HSD11B1 | |
| Trifluoromethanesulfonic Acid SCHEMBL8100181 | 0.82 | GPR3 (0.35) | GPR3KCNH2ACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 463 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2469337-B1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | HITACHI CHEM DUPONT MICROSYS (JP) | 2014-01-22 | — | — | EP | claimed |
| EP-2469337-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2012-06-27 | — | — | EP | claimed |
| EP-4714988-A1 | FLUORINE-CONTAINING POLYMER, COMPOSITION FOR FORMING FLUORINE-CONTAINING RESIN FILM, FLUORINE-CONTAINING RESIN FILM, COMPOSITION FOR FORMING RESIST PATTERN, METHOD FOR FORMING RESIST PATTERN, COMPOSITION FOR FORMING RESIST UPPER LAYER FILM, METHOD FOR DECOMPOSING FLUORINE-CONTAINING POLYMER, FLUORINE-CONTAINING POLYMERIZABLE MONOMER, COMPOUND, AND METHOD FOR PRODUCING FLUORINE-CONTAINING POLYMERIZABLE MONOMER | Central Glass Company, Limited (JP) | 2026-03-25 | — | — | EP | disclosed |
| EP-4714990-A1 | COPOLYMER, POLYMER FOR WATER-REPELLENT AGENT, COMPOSITION FOR FORMING WATER-REPELLENT FILM, RESIN FILM, AND METHOD FOR FORMING RESIST PATTERN | Central Glass Company, Limited (JP) | 2026-03-25 | — | — | EP | disclosed |
| WO-2024248136-A1 | COPOLYMER, POLYMER FOR WATER-REPELLENT AGENT, COMPOSITION FOR FORMING WATER-REPELLENT FILM, RESIN FILM, AND METHOD FOR FORMING RESIST PATTERN | セントラル硝子株式会社 | 2024-12-05 | — | — | WO | disclosed |
| WO-2024248135-A1 | FLUORINE-CONTAINING POLYMER, COMPOSITION FOR FORMING FLUORINE-CONTAINING RESIN FILM, FLUORINE-CONTAINING RESIN FILM, COMPOSITION FOR FORMING RESIST PATTERN, METHOD FOR FORMING RESIST PATTERN, COMPOSITION FOR FORMING RESIST UPPER LAYER FILM, METHOD FOR DECOMPOSING FLUORINE-CONTAINING POLYMER, FLUORINE-CONTAINING POLYMERIZABLE MONOMER, COMPOUND, AND METHOD FOR PRODUCING FLUORINE-CONTAINING POLYMERIZABLE MONOMER | セントラル硝子株式会社 | 2024-12-05 | — | — | WO | disclosed |
| CN-118295209-A | Photoresist composition containing two sulfonium salts and preparation method and application thereof | 中国科学院化学研究所 | 2024-07-05 | — | — | CN | disclosed |
| EP-2584409-B1 | RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, POLYMERIC COMPOUND, AND COMPOUND | TOKYO OHKA KOGYO CO LTD (JP) | 2021-04-28 | — | — | EP | disclosed |
| EP-2060600-B1 | Resist composition, method of forming resist pattern, novel compound, and acid generator | TOKYO OHKA KOGYO CO LTD (JP) | 2017-12-27 | — | — | EP | disclosed |
| EP-2093213-B1 | Positive resist composition and method of forming a resist pattern using the same | TOKYO OHKA KOGYO CO LTD (JP) | 2017-10-04 | — | — | EP | disclosed |
| US-9618842-B2 | Resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-04-11 | — | — | US | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |
| EP-1736485-A1 | POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-12-27 | — | — | EP | disclosed |
| US-20060194140-A1 | Chemical amplification type positive resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-08-31 | — | — | US | disclosed |
| US-20060183876-A1 | Resin for resist positive resist composition and method of forming resist pattern | TOKYO OHKA KOGYO, C., LTD. (JP) | 2006-08-17 | — | — | US | disclosed |
| EP-1655315-A1 | RESIN FOR RESIST, POSITIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-05-10 | — | — | EP | disclosed |
| EP-1602977-A1 | Positive resist composition and compound used therein | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-12-07 | — | — | EP | disclosed |
| US-20050266340-A1 | Positive resist composition and compound used therein | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-12-01 | — | — | US | disclosed |
| US-20050227172-A1 | Process for producing photoresist composition, filtration device, application device, and photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-10-13 | — | — | US | disclosed |
| US-20050042540-A1 | Positive resist composition and method of forming resist pattern | TOKYO OHKA KOGYO CO., LTD. | 2005-02-24 | — | — | US | disclosed |