SCHEMBL36243

SCHEMBL36243

CCCCOC(C)(OCCCC)C(OCCCC)(OCCCC)C(Nc1nc(N)nc(N)n1)(OCCCC)OCCCC

nearest known ligand 0.33

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CDK1 P06493 1/20 0.33
CCNB1 P14635 1/20 0.33
CCNA2 P20248 1/20 0.33
CDK2 P24941 1/20 0.33
CCNA1 P78396 1/20 0.33
PIN1 Q13526 1/20 0.33
TLR8 Q9NR97 1/20 0.31
TLR7 Q9NYK1 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5157470 0.77 CDK1 (0.38) CDK1CCNB1CCNA2CDK2CCNA1
SCHEMBL4452232 0.75 CDK1 (0.32) CDK1CCNB1CCNA2CDK2CCNA1
SCHEMBL1012240 0.71 CDK1 (0.31) CDK1CCNB1CCNA2CDK2CCNA1
SCHEMBL16423545 0.71 CDK1 (0.34) CDK1CCNB1CCNA2CDK2CCNA1
SCHEMBL8854656 0.67 HSD17B10 (0.35) CDK1CCNB1CCNA2CDK2CCNA1
SCHEMBL16423542 0.67 CDK1 (0.38) CDK1CCNB1CCNA2CDK2CCNA1
SCHEMBL10603018 0.66 TLR8 (0.38) TLR8TLR7
SCHEMBL5792612 0.66 CDK1 (0.32) CDK1CCNB1CCNA2CDK2CCNA1
SCHEMBL8216983 0.65 CDK1 (0.37) CDK1CCNB1CCNA2CDK2CCNA1
SCHEMBL8426395 0.65 TLR8 (0.40) TLR8TLR7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 255 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12527163-B2 Method for producing light-emitting elements CENTRAL GLASS COMPANY, LIMITED (JP) 2026-01-13 US disclosed
US-20260003277-A1 NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-20260003283-A1 PHOTOSENSITIVE COMPOSITION, METHOD FOR FORMING PATTERNED SILICON-CONTAINING RESIN FILM, AND SILICON-CONTAINING RESIN TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-20260003282-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-20260003284-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED SILICON-CONTAINING RESIN FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
EP-4667537-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-12-24 EP disclosed
US-20250382500-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO LTD (JP) 2025-12-18 US disclosed
US-20250355354-A1 RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO LTD (JP) 2025-11-20 US disclosed
US-12460031-B2 Photosensitive resin composition, method for producing cured product of fluororesin, fluororesin, fluororesin film, bank and display element CENTRAL GLASS COMPANY, LIMITED (JP) 2025-11-04 US disclosed
US-12422750-B2 Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device FUJIFILM CORPORATION (JP) 2025-09-23 US disclosed
US-20090189317-A1 METHOD OF FORMING RESIST PATTERN BY NANOIMPRINT LITHOGRAPHY TOKYO OHKA KOGYO CO., LTD (JP) 2009-07-30 US disclosed
US-20090162785-A1 POLYMER COMPOUND, NEGATIVE RESIST COMPOSITION, AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-06-25 US disclosed
US-20090142693-A1 NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-06-04 US disclosed
US-20090142698-A1 NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD (JP) 2009-06-04 US disclosed
US-20090111054-A1 NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2009-04-30 US disclosed
US-20090081590-A1 NEGATIVE RESIST COMPOSITION AND PROCESS FOR FORMING RESIST PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 2009-03-26 US disclosed
US-20090035697-A1 NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKAKOGYO CO.,LTD. (JP) 2009-02-05 US disclosed
US-20090011199-A1 Fluorine-Containing Compound, Fluorine-Containing Polymer, Negative-Type Resist Composition, and Patterning Process Using Same CENTRAL GLASS COMPANY, LIMITED (JP) 2009-01-08 US disclosed
US-20080124648-A1 Resist Pattern Forming Method, Supercritical Processing Solution For Lithography Process, And Antireflection Film Forming Method NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 2008-05-29 US disclosed
US-20080118871-A1 Resist Pattern Forming Method NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 2008-05-22 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260003282-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM H1-4, H1-10, H1-0 CDK1 141/4885CCNB1 5/4885CCNA2 37/4885
US-20260003284-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED SILICON-CONTAINING RESIN FILM ASH2L, SEM1, COL1A1 CDK1 3362/4885CCNB1 458/4885CCNA2 588/4885
US-20260003277-A1 NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM H1-4, H1-10, H1-0 CDK1 602/4885CCNB1 7/4885CCNA2 98/4885
US-20090011199-A1 Fluorine-Containing Compound, Fluorine-Containing Polymer, Negative-Type Resist Composition, and Patterning Process Using Same FGFR2, RTF1, ADGRF1 CDK1 1168/4885CCNB1 494/4885CCNA2 359/4885
US-20260003283-A1 PHOTOSENSITIVE COMPOSITION, METHOD FOR FORMING PATTERNED SILICON-CONTAINING RESIN FILM, AND SILICON-CONTAINING RESIN RARA, COL1A1, TAS1R1 CDK1 3193/4885CCNB1 1887/4885CCNA2 2053/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.