SCHEMBL36378

SCHEMBL36378

CCCCOCN(COCCCC)C(N)=O

nearest known ligand 0.41

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.41
ALDH1A1 P00352 1/20 0.40
CES2 O00748 2/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
ATM Q13315 1/20 0.38
CYP3A4 P08684 1/20 0.36
MAPT P10636 1/20 0.36
RAB9A P51151 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
ADRB2 P07550 1/20 0.36
ADRB1 P08588 1/20 0.36
ADRB3 P13945 1/20 0.36
ZDHHC20 Q5W0Z9 1/20 0.36
HPGD P15428 2/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL897003 0.90 TSHR (0.42) TSHRALDH1A1CES2MEN1KMT2A
SCHEMBL36699 0.87 HSD17B10 (0.33) CA1CA2
SCHEMBL11669711 0.83 CES2 (0.46) TSHRCES2MEN1KMT2ACYP3A4
SCHEMBL11670661 0.83 CES2 (0.46) TSHRCES2MEN1KMT2ACYP3A4
SCHEMBL216906 0.83 TSHR (0.44) TSHRALDH1A1CES2MEN1KMT2A
SCHEMBL11029014 0.82 TSHR (0.50) TSHRALDH1A1CES2MEN1KMT2A
SCHEMBL36656 0.78 ALOX15 (0.40) TSHRALDH1A1TDP1CYP3A4
SCHEMBL9972945 0.78 TSHR (0.40) TSHRALDH1A1CES2MEN1KMT2A
SCHEMBL16361836 0.78 CES2 (0.42) TSHRALDH1A1CES2MEN1KMT2A
SCHEMBL14678852 0.78 TSHR (0.45) TSHRALDH1A1CES2MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 298 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260147276-A1 NEGATIVE RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2026-05-28 US disclosed
US-12527163-B2 Method for producing light-emitting elements CENTRAL GLASS COMPANY, LIMITED (JP) 2026-01-13 US disclosed
US-20260003284-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED SILICON-CONTAINING RESIN FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-20260003277-A1 NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-20260003282-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-20260003283-A1 PHOTOSENSITIVE COMPOSITION, METHOD FOR FORMING PATTERNED SILICON-CONTAINING RESIN FILM, AND SILICON-CONTAINING RESIN TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
EP-4667537-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-12-24 EP disclosed
US-20250382500-A1 PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE TOKYO OHKA KOGYO CO LTD (JP) 2025-12-18 US disclosed
US-20250370338-A1 NEGATIVE RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-12-04 US disclosed
US-20250355354-A1 RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO LTD (JP) 2025-11-20 US disclosed
US-20030022095-A1 Negative type radiation sensitive resin composition JSR CORPORATION (JP) 2003-01-30 US disclosed
EP-0065388-B1 COATING COMPOSITION TORAY INDUSTRIES, INC. (JP) 1985-08-28 EP disclosed
US-4439557-A SILYL SUBSTITUTED ACRYLATES, CURING CATALYST TORAY INDUSTRIES, INCORPORATED (JP) 1984-03-27 US disclosed
EP-0065388-A1 Coating composition TORAY INDUSTRIES, INC. (JP) 1982-11-24 EP disclosed
US-4250124-A FIREPROOFING TEXTILES; REACTION OF AN HYDROXY-CONTAINING COMPOUND AND A 2-SUBSTITUTED-2-OXO-OXA-PHOSPHOLANE HOECHST AKTIENGESELLSCHAFT (DE) 1981-02-10 US disclosed
US-4244893-A FIREPROOFING; FINISHES FOR TEXTILES HOECHST AKTIENGESELLSCHAFT (DE) 1981-01-13 US disclosed
US-4220610-A Organic phosphorus compounds with 2-hydroxyalkyl-phosphonic acid groups HOECHST AKTIENGESELLSCHAFT (DE) 1980-09-02 US disclosed
US-4209581-A UREA OR THIOUREA RESIN WITH N-ALKYLOL ACRYLAMIDE TOKYO OHKA KOGYO KABUSHIKI KAISHA (JP) 1980-06-24 US disclosed
US-4163034-A DECYCLIZATION, ESTERIFICATION; FIREPROOFING HOECHST AG. (DE) 1979-07-31 US disclosed
US-4096208-A FIREPROOFING AGENTS HOECHST AKTIENGESELLSCHAFT (DT) 1978-06-20 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260003282-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM H1-4, H1-10, H1-0 TSHR 1049/4885ALDH1A1 1668/4885CES2 1566/4885
US-20260147276-A1 NEGATIVE RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN RFC1, RFC2, RFC4 TSHR 4670/4885ALDH1A1 2990/4885CES2 910/4885
US-20260003284-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED SILICON-CONTAINING RESIN FILM ASH2L, SEM1, COL1A1 TSHR 2611/4885ALDH1A1 188/4885CES2 2551/4885
US-20260003277-A1 NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM H1-4, H1-10, H1-0 TSHR 1112/4885ALDH1A1 2163/4885CES2 1596/4885
US-20260003283-A1 PHOTOSENSITIVE COMPOSITION, METHOD FOR FORMING PATTERNED SILICON-CONTAINING RESIN FILM, AND SILICON-CONTAINING RESIN RARA, COL1A1, TAS1R1 TSHR 925/4885ALDH1A1 269/4885CES2 3301/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.