SCHEMBL3724437

SCHEMBL3724437

CCN(CC)C(=O)c1cc2ccccc2o1

nearest known ligand 0.62

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.62
HPGD P15428 2/20 0.62
FLT3 P36888 1/20 0.59
MAPT P10636 4/20 0.59
KMT2A Q03164 5/20 0.58
MEN1 O00255 4/20 0.58
NPC1 O15118 5/20 0.58
RAB9A P51151 4/20 0.55
SMN1; SMN2 Q16637 1/20 0.55
TAS1R3 Q7RTX0 1/20 0.55
TAS1R1 Q7RTX1 1/20 0.55
TRPM8 Q7Z2W7 1/20 0.54
TSHR P16473 1/20 0.53
MAPK1 P28482 1/20 0.53
KDM4E B2RXH2 1/20 0.51
ATM Q13315 1/20 0.51
HDAC3 O15379 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2720459 0.84 TRPM8 (0.79) ALDH1A1HPGDMAPTKMT2AMEN1
SCHEMBL5160471 0.82 TAS1R3 (0.53) ALDH1A1HPGDFLT3MAPTKMT2A
SCHEMBL22325320 0.81 ALDH1A1 (0.68) ALDH1A1HPGDFLT3MAPTKMT2A
SCHEMBL28997586 0.80 NPC1 (0.81) ALDH1A1HPGDNPC1RAB9ASMN1; SMN2
SCHEMBL7239621 0.80 USP2 (0.69) ALDH1A1MAPTKMT2ANPC1RAB9A
SCHEMBL11399253 0.80 ALDH1A1 (0.58) ALDH1A1HPGDFLT3MAPTKMT2A
SCHEMBL10155752 0.80 FLT3 (0.67) ALDH1A1HPGDFLT3MAPTKMT2A
SCHEMBL4928095 0.79 OPRD1 (0.66) NPC1
SCHEMBL14052473 0.77 NPC1 (0.54) ALDH1A1HPGDMAPTKMT2AMEN1
SCHEMBL12095319 0.76 ALDH1A1 (0.61) ALDH1A1HPGDFLT3MAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8293846-B2 Composition for forming layer to be plated, method of producing metal pattern material, metal pattern material FUJIFILM CORPORATION (JP) 2012-10-23 US disclosed
US-20100080964-A1 COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed