Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3153774 | 0.95 | LMNA (0.31) | LMNA | |
| SCHEMBL202655 | 0.88 | — | — | |
| SCHEMBL375678 | 0.87 | LMNA (0.36) | LMNA | |
| SCHEMBL1608991 | 0.83 | LMNA (0.33) | LMNA | |
| SCHEMBL3144976 | 0.83 | LMNA (0.36) | LMNA | |
| SCHEMBL2333238 | 0.82 | LMNA (0.33) | LMNA | |
| SCHEMBL3155553 | 0.82 | — | — | |
| SCHEMBL376087 | 0.81 | — | — | |
| SCHEMBL375780 | 0.81 | — | — | |
| SCHEMBL11212106 | 0.79 | LMNA (0.35) | LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7518009-B2 | Process for preparing mercaptoorganyl (alkoxysilanes) | EVONIK DEGUSSA GMBH (DE) | 2009-04-14 | — | — | US | claimed |
| US-20060252952-A1 | Process for preparing mercaptoorganyl (alkoxysilanes) | DEGUSSA AG (DE) | 2006-11-09 | — | — | US | claimed |
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12386259-B2 | Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-08-12 | — | — | US | disclosed |
| CN-120021354-A | Method for manufacturing circuit board | 味之素株式会社 | 2025-05-20 | — | — | CN | disclosed |
| US-12139635-B2 | Coatings for waterproofing electronic components | HENKEL AG & CO. KGAA (DE) | 2024-11-12 | — | — | US | disclosed |
| US-7019160-B2 | Process for the preparation of (mercaptoorganyl)alkoxysilanes | DEGUSSA AG (DE) | 2006-03-28 | — | — | US | disclosed |
| EP-1538152-B1 | Process for the preparation of (mercaptoorganyl)-alkoxysilanen | DEGUSSA (DE) | 2006-03-22 | — | — | EP | disclosed |
| US-20060052622-A1 | Process for the preparation of mercaptoorganyl (alkoxysilanes) | EVONIK DEGUSSA GMBH (DE) | 2006-03-09 | — | — | US | disclosed |
| US-20060052621-A1 | Process for producing mercaptoorganyl (alkoxysilane) | EVONIK DEGUSSA GMBH (DE) | 2006-03-09 | — | — | US | disclosed |
| US-6995280-B2 | Process for preparing (mercaptoorganyl)alkoxysilanes | DEGUSSA AG (DE) | 2006-02-07 | — | — | US | disclosed |
| US-20050124822-A1 | Process for the preparation of (mercaptoorganyl)alkoxysilanes | EVONIK OPERATIONS GMBH (DE) | 2005-06-09 | — | — | US | disclosed |
| US-20050124821-A1 | Process for preparing (mercaptoorganyl)alkoxysilanes | EVONIK OPERATIONS GMBH (DE) | 2005-06-09 | — | — | US | disclosed |
| EP-1538152-A1 | Process for the preparation of (mercaptoorganyl)-alkoxysilanen | Degussa AG (DE) | 2005-06-08 | — | — | EP | disclosed |
| EP-1529782-A1 | Process for preparing mercaptoorganyl alkoxy silanes | Degussa AG (DE) | 2005-05-11 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | LMNA 1962/4885 |
| US-20050124821-A1 | Process for preparing (mercaptoorganyl)alkoxysilanes | ADH1C, ADH1A, MPST | LMNA 3513/4885 |
| US-20050124822-A1 | Process for the preparation of (mercaptoorganyl)alkoxysilanes | MPST, ADH1A, ADH1C | LMNA 4012/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | LMNA 3565/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.