SCHEMBL3783784

SCHEMBL3783784

C=Cc1ccccc1OC(C)(C)CC

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.35
FBP1 P09467 1/20 0.35
HPGD P15428 2/20 0.33
TSHR P16473 1/20 0.33
MAPK1 P28482 1/20 0.33
HSD17B10 Q99714 1/20 0.33
HTT P42858 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
MEN1 O00255 2/20 0.31
KMT2A Q03164 2/20 0.31
CYP3A4 P08684 1/20 0.31
PLIN1 O60240 1/20 0.30
LMNA P02545 1/20 0.30
POLB P06746 1/20 0.30
MAPT P10636 1/20 0.30
PLIN5 Q00G26 1/20 0.30
ABHD5 Q8WTS1 1/20 0.30
NFE2L2 Q16236 2/20 0.30
ACHE P22303 1/20 0.30
TRPA1 O75762 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14092265 0.84 HPGD (0.35) ALDH1A1FBP1HPGDTSHRMAPK1
SCHEMBL5348549 0.82 CNR1 (0.38) ALDH1A1FBP1HTTMEN1KMT2A
SCHEMBL187272 0.81 ALDH1A1 (0.45) ALDH1A1FBP1HPGDTSHRMAPK1
SCHEMBL30414461 0.81 ALDH1A1 (0.45) ALDH1A1FBP1HPGDTSHRMAPK1
Methane SCHEMBL1904173 0.79 ALDH1A1 (0.43) ALDH1A1FBP1HPGDTSHRMAPK1
SCHEMBL9777100 0.77 FBP1 (0.36) ALDH1A1FBP1HPGDHSD17B10HTT
SCHEMBL6286654 0.76 HPGD (0.38) ALDH1A1HPGDTSHRMAPK1HSD17B10
SCHEMBL28560205 0.75 MAPK1 (0.45) ALDH1A1FBP1HPGDTSHRMAPK1
SCHEMBL27834941 0.75 ALDH1A1 (0.35) ALDH1A1FBP1MEN1KMT2ACYP3A4
SCHEMBL6877807 0.74 FBP1 (0.34) ALDH1A1FBP1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 97 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8357750-B2 Adhesive composition and film adhesive TOKYO OHKA KOGYO CO., LTD. (JP) 2013-01-22 US claimed
US-20100331477-A1 ADHESIVE COMPOSITION AND FILM ADHESIVE TOKYO OHKA KOGYO CO., LTD. (JP) 2010-12-30 US claimed
JP-6032836-A None JP disclosed
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof NOTARK CORPORATION (US) 2026-02-10 US disclosed
US-20250367910-A1 LAMINATES BASED ON COPOLYMERS OF DIISOALKENYLARENES NOTARK CORPORATION (US) 2025-12-04 US disclosed
US-12447719-B2 Metal-clad laminate, wiring board, resin-including metal foil, and resin composition PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-10-21 US disclosed
US-12312452-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-05-27 US disclosed
US-12233621-B2 Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-02-25 US disclosed
WO-2024219272-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME 日本化薬株式会社 2024-10-24 WO disclosed
US-12109779-B2 Copper-clad laminate, wiring board, and copper foil with resin PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-10-08 US disclosed
EP-1378795-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-01-07 EP disclosed
US-20030118934-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-06-26 US disclosed
US-20030118934-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-06-26 US disclosed
JP-2003146927-A METHOD FOR PRODUCING tert-AMYLOXYSTYRENE HOKKO CHEM IND CO LTD 2003-05-21 JP disclosed
JP-2003131384-A RESIST MATERIAL AND PATTERN FORMING METHOD SHIN ETSU CHEM CO LTD 2003-05-09 JP disclosed
EP-1308782-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-05-07 EP disclosed
EP-1308782-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-05-07 EP disclosed
EP-1205517-A1 LOW-HYGROSCOPICITY LOW-BIREFRINGENCE RESIN COMPOSITIONS, MOLDING MATERIAL OBTAINED THEREFROM, SHEET OR FILM, AND OPTICAL PART HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-05-15 EP disclosed
JP-H0632836-A POLY@(3754/24)3-METHYL-4-T-BUTOXYSTYRENE0 AND ITS PRODUCTION SHIN ETSU CHEM CO LTD 1994-02-08 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 ALDH1A1 438/4885FBP1 2334/4885HPGD 1608/4885
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof DSG1, CDH1, CAD ALDH1A1 480/4885FBP1 3736/4885HPGD 2672/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.