SCHEMBL3850604

SCHEMBL3850604

COc1cc(N)ccc1C(=O)Nc1ccc(N)cc1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.61
NPC1 O15118 4/20 0.57
RAB9A P51151 4/20 0.57
NFKB1 P19838 1/20 0.57
NFKB2 Q00653 1/20 0.57
RELA Q04206 1/20 0.57
L3MBTL1 Q9Y468 1/20 0.57
SMN1; SMN2 Q16637 3/20 0.55
KMT2A Q03164 7/20 0.54
MEN1 O00255 5/20 0.54
MAPT P10636 4/20 0.54
MAPK1 P28482 2/20 0.54
HSD17B10 Q99714 2/20 0.54
POLB P06746 3/20 0.52
AHR P35869 1/20 0.52
KCNK3 O14649 1/20 0.51
KCNK9 Q9NPC2 1/20 0.51
NR1H4 Q96RI1 1/20 0.51
LMNA P02545 2/20 0.50
KLKB1 P03952 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29530877 1.00 ALDH1A1 (0.61) ALDH1A1NPC1RAB9ANFKB1NFKB2
SCHEMBL25433307 0.93 NPC1 (0.67) ALDH1A1NPC1RAB9ANFKB1NFKB2
SCHEMBL25383722 0.93 NPC1 (0.64) ALDH1A1NPC1RAB9ANFKB1NFKB2
SCHEMBL11852488 0.85 MAPT (0.58) ALDH1A1NPC1RAB9ANFKB1NFKB2
SCHEMBL678394 0.84 MAPT (0.69) ALDH1A1NPC1RAB9ASMN1; SMN2KMT2A
SCHEMBL3850748 0.84 MAPT (0.63) ALDH1A1NPC1RAB9ASMN1; SMN2KMT2A
SCHEMBL10607641 0.84 RAB9A (0.62) NPC1RAB9ASMN1; SMN2KMT2AMEN1
SCHEMBL10426957 0.83 MEN1 (0.51) ALDH1A1NPC1RAB9ASMN1; SMN2KMT2A
SCHEMBL5679153 0.82 ALDH1A1 (0.67) ALDH1A1NPC1RAB9ASMN1; SMN2MAPT
SCHEMBL328279 0.82 ALDH1A1 (0.67) ALDH1A1NPC1RAB9ASMN1; SMN2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7579134-B2 cover layer comprises polyamic acid precursor curable to an adhesive polyimide base polymer and an ethylenically unsaturated photo-monomer; avoiding unwanted curling of a flexible printed circuit E. I. DUPONT DE NEMOURS AND COMPANY (US) 2009-08-25 US claimed
US-7338716-B2 Laminate and process for producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-03-04 US claimed
US-20060210819-A1 Polyimide composite coverlays and methods and compositions relating thereto U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2006-09-21 US claimed
US-20260107381-A1 SURFACE-TREATED COPPER FOIL DUPONT ELECTRONICS INC (US) 2026-04-16 US disclosed
US-12568577-B2 Flexible copper-clad laminate and printed circuit made therefrom DUPONT ELECTRONICS, INC 2026-03-03 US disclosed
US-20250297396-A1 ELECTRODEPOSITED COPPER FOIL WITH A PREFFERED ORIENTATION OF (200) CRYSTAL PLANE AND APPLICATIONS THEREOF U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2025-09-25 US disclosed
WO-2024214735-A1 POLYIMIDE RESIN AND ADHESIVE FILM 株式会社ピーアイ技術研究所 2024-10-17 WO disclosed
CN-117794048-A Metal-clad laminate, circuit board, electronic device, and electronic apparatus 日铁化学材料株式会社 2024-03-29 CN disclosed
CN-115971017-B Method for producing polyimide film, method for producing metal-clad laminate, and method for producing circuit board 日铁化学材料株式会社 2024-01-16 CN disclosed
CN-117279198-A Metal-clad laminate, circuit board, electronic device, and electronic apparatus 日铁化学材料株式会社 2023-12-22 CN disclosed
CN-117067718-A Metal-clad laminate and circuit board 日铁化学材料株式会社 2023-11-17 CN disclosed
US-20060292383-A1 Metal-coated substrate and manufacturing method of the same DOWA HOLDINGS CO., LTD. (JP) 2006-12-28 US disclosed
US-20060210819-A1 Polyimide composite coverlays and methods and compositions relating thereto U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2006-09-21 US disclosed
EP-1688247-A1 METAL-CLAD SUBSTRATE AND METHOD FOR PRODUCING SAME Dowa Mining Co., Ltd (JP) 2006-08-09 EP disclosed
US-20060093838-A1 Metal coated substrate and manufacturing method of the same DOWA MINING CO., LTD. (JP) 2006-05-04 US disclosed
US-20050061423-A1 Manufacturing method and manufacturing device of metal clad film DOWA MINING CO., LTD. (JP) 2005-03-24 US disclosed
EP-0297139-B1 FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION NIPPON STEEL CHEMICAL CO., LTD. (JP) 1990-12-27 EP disclosed
US-4939039-A Noncurlling, polyamideimides NIPPON STEEL CHEMICAL CO., LTD. (JP) 1990-07-03 US disclosed
US-4847353-A POLYAMIDEIMIDE COPOLYMERS NIPPON STEEL CHEMICAL CO., LTD. (JP) 1989-07-11 US disclosed
EP-0297139-A1 FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION NIPPON STEEL CHEMICAL CO., LTD. (JP) 1989-01-04 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260107381-A1 SURFACE-TREATED COPPER FOIL L1CAM, CD74, FCER2 ALDH1A1 1141/4885NPC1 500/4885RAB9A 4773/4885
US-12568577-B2 Flexible copper-clad laminate and printed circuit made therefrom L1CAM, FCER2, TMCO1 ALDH1A1 1579/4885NPC1 3063/4885RAB9A 4837/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.