Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADORA2A | P29274 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.40 |
| ▸ | MAPT | P10636 | 3/20 | 0.40 |
| ▸ | HPGD | P15428 | 2/20 | 0.40 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.40 |
| ▸ | SIRT1 | Q96EB6 | 1/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.35 |
| ▸ | POLB | P06746 | 1/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.35 |
| ▸ | DHFR | P00374 | 1/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
| ▸ | HTR1A | P08908 | 1/20 | 0.34 |
| ▸ | HTR3A | P46098 | 1/20 | 0.34 |
| ▸ | TUBB4A | P04350 | 1/20 | 0.33 |
| ▸ | TUBB | P07437 | 1/20 | 0.33 |
| ▸ | TUBA3C | P0DPH7 | 1/20 | 0.33 |
| ▸ | TUBA1B | P68363 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1533966 | 0.84 | MAPT (0.43) | ADORA2AMAPTHPGDHSD17B10CYP3A4 | |
| SCHEMBL10032936 | 0.77 | ADORA2A (0.44) | ADORA2AALDH1A1MAPTHPGDKDM4E | |
| SCHEMBL7059068 | 0.75 | RHEB (0.39) | ADORA2AALDH1A1MAPTHPGDKDM4E | |
| SCHEMBL810752 | 0.72 | SLC6A4 (0.58) | ADORA2AALDH1A1MAPTHPGDKDM4E | |
| SCHEMBL9486336 | 0.69 | HTR1A (0.39) | ALDH1A1MAPTHPGDKDM4ESIRT1 | |
| SCHEMBL28163071 | 0.69 | RHEB (0.36) | ADORA2AALDH1A1MAPTHPGDKDM4E | |
| SCHEMBL11546 | 0.69 | MAPT (0.56) | ADORA2AALDH1A1MAPTHPGDKDM4E | |
| SCHEMBL29613097 | 0.69 | MAPT (0.56) | ADORA2AALDH1A1MAPTHPGDKDM4E | |
| SCHEMBL26253981 | 0.69 | SIRT1 (0.50) | ALDH1A1MAPTHPGDKDM4ESIRT1 | |
| SCHEMBL433052 | 0.68 | DHFR (0.46) | ADORA2AALDH1A1MAPTHPGDKDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11827789-B2 | Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof | RESONAC CORPORATION (JP) | 2023-11-28 | — | — | US | disclosed |
| US-11331888-B2 | Composite film for electronic devices using high frequency band signals, printed wiring board and manufacturing method therefor | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-05-17 | — | — | US | disclosed |
| US-10544305-B2 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-01-28 | — | — | US | disclosed |
| EP-3553816-A1 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Hitachi Chemical Co., Ltd. (JP) | 2019-10-16 | — | — | EP | disclosed |
| US-20190283373-A1 | COMPOSITE FILM FOR ELECTRONIC DEVICES USING HIGH FREQUENCY BAND SIGNALS, PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR | RESONAC CORPORATION (JP) | 2019-09-19 | — | — | US | disclosed |
| US-20190284395-A1 | THERMOSETTING RESIN COMPOSITION, INTERLAYER INSULATION RESIN FILM, COMPOSITE FILM, PRINTED WIRING BOARD, AND PRODUCTION METHOD THEREOF | RESONAC CORPORATION (JP) | 2019-09-19 | — | — | US | disclosed |
| EP-2716793-B1 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME | HITACHI CHEMICAL CO LTD (JP) | 2019-04-10 | — | — | EP | disclosed |
| US-20180327593-A1 | THERMOSETTING RESIN COMPOSITION, RESIN FILM FOR INTERLAYER INSULATION, COMPOSITE FILM, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SAME | RESONAC CORPORATION (JP) | 2018-11-15 | — | — | US | disclosed |
| US-20140151091-A1 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME, AND MULTILAYER CIRCUIT BOARD AND PRODUCTION METHOD FOR SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-06-05 | — | — | US | disclosed |
| US-20120305291-A1 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-12-06 | — | — | US | disclosed |
| US-20120178332-A1 | Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method Thereof | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2012-07-12 | — | — | US | disclosed |
| EP-2057486-A2 | APODISED ZONE PLATE AND NONLINEAR CHIRP SIGNAL | The Medway NHS Trust (GB) | 2009-05-13 | — | — | EP | disclosed |
| US-7517553-B2 | Adhesive aid composition | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2009-04-14 | — | — | US | disclosed |
| US-7384683-B2 | Substrate for flexible printed wiring board and method for manufacturing the same | UNITIKA LTD. (JP) | 2008-06-10 | — | — | US | disclosed |
| WO-2008032034-A2 | APODISED ZONE PLATE AND NONLINEAR CHIRP SIGNAL | THE MEDWAY NHS TRUST (GB) | 2008-03-20 | — | — | WO | disclosed |
| US-20070071984-A1 | Substrate for flexible printed wiring board and method for manufacturing the same | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2007-03-29 | — | — | US | disclosed |
| US-20070026227-A1 | Adhesive aid composition | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2007-02-01 | — | — | US | disclosed |
| EP-1666556-A1 | ADHESIVE AID COMPOSITION | Nippon Kayaku Kabushiki Kaisha (JP) | 2006-06-07 | — | — | EP | disclosed |
| EP-1667501-A1 | SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME | UNITIKA LTD. (JP) | 2006-06-07 | — | — | EP | disclosed |