SCHEMBL3935601

SCHEMBL3935601

CCc1cc(Cc2cc(CC)c(N)c(CC)c2)ccc1N

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.44
POLB P06746 3/20 0.44
HTT P42858 1/20 0.44
MAPT P10636 3/20 0.44
GAA P10253 3/20 0.44
KDM4E B2RXH2 2/20 0.44
CYP3A4 P08684 2/20 0.44
MEN1 O00255 1/20 0.44
RAB9A P51151 1/20 0.44
KMT2A Q03164 1/20 0.44
CDC25B P30305 1/20 0.43
CASP6 P55212 1/20 0.43
RCE1 Q9Y256 1/20 0.43
TSHR P16473 2/20 0.42
HPGD P15428 1/20 0.42
ALOX15 P16050 1/20 0.42
HSD17B10 Q99714 1/20 0.42
DHFR P00374 3/20 0.41
BACE1 P56817 1/20 0.37
ATP4A P20648 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL237448 0.92 ALDH1A1 (0.50) ALDH1A1POLBHTTMAPTGAA
SCHEMBL27087996 0.88 ALDH1A1 (0.45) ALDH1A1POLBHTTMAPTGAA
SCHEMBL27087993 0.88 ALDH1A1 (0.45) ALDH1A1POLBHTTMAPTGAA
SCHEMBL6039307 0.87 DHFR (0.40) ALDH1A1POLBHTTMAPTGAA
SCHEMBL27497381 0.86 ALDH1A1 (0.47) ALDH1A1POLBMAPTGAAKDM4E
SCHEMBL48459 0.85 HTT (0.50) ALDH1A1POLBHTTMAPTDHFR
SCHEMBL8095527 0.85 ALDH1A1 (0.44) ALDH1A1POLBMAPTGAAKDM4E
SCHEMBL4996905 0.85 ALDH1A1 (0.54) ALDH1A1POLBMAPTGAAKDM4E
4,4'-Methylenedianiline SCHEMBL9344783 0.85 ALDH1A1 (0.54) ALDH1A1POLBMAPTGAAKDM4E
SCHEMBL9812330 0.83 THRB (0.40) ALDH1A1POLBMAPTGAAKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130165603-A1 Adhesive Composition And Adhesive Film Comprising The Same CHEIL INDUSTRIES, INC. (KR) 2013-06-27 US claimed
US-4716210-A Use of liquid, cold-hardening polyurethane-urea-forming components for corrosion-inhibiting, wear-resistant coatings on metal and plastics surfaces and moldings and on stone and concrete BAYER AKTIENGESELLSCHAFT (DE) 1987-12-29 US claimed
EP-0081729-B1 USE OF LIQUID COLD-SETTING POLYURETHANE FORMING COMPONENTS FOR CORROSION-RETARDANT AND WEAR-PROTECTING COATINGS OF METALLIC AND PLASTICS SURFACES AND MOULDED ARTICLES, AND OF STONE AND CONCRETE BAYER AG (DE) 1987-07-29 EP claimed
EP-0081729-A1 Use of liquid cold-setting polyurethane forming components for corrosion-retardant and wear-protecting coatings of metallic and plastics surfaces and moulded articles, and of stone and concrete BAYER AG (DE) 1983-06-22 EP claimed
US-9957425-B2 Adhesive composition for semiconductor and adhesive film including the same CHEIL INDUSTRIES, INC. (KR) 2018-05-01 US disclosed
US-9169425-B2 Adhesive film and electronic device including the same CHEIL INDUSTRIES, INC. (KR) 2015-10-27 US disclosed
US-9109147-B2 Adhesive composition for semiconductor and adhesive film comprising the same CHEIL INDUSTRIES, INC. (KR) 2015-08-18 US disclosed
US-8946343-B2 Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film CHEIL INDUSTRIES, INC. (KR) 2015-02-03 US disclosed
US-20140194555-A1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING THE SAME CHEIL INDUSTRIES, INC. (KR) 2014-07-10 US disclosed
US-20140186607-A1 ADHESIVE COMPOSITION FOR A SEMICONDUCTOR, ADHESIVE FILM PREPARED FROM THE COMPOSITION, AND SEMICONDUCTOR DEVICE CONNECTED BY THE FILM CHEIL INDUSTRIES, INC. (KR) 2014-07-03 US disclosed
US-20130281559-A1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME CHEIL INDUSTRIES, INC. (KR) 2013-10-24 US disclosed
US-20130165603-A1 Adhesive Composition And Adhesive Film Comprising The Same CHEIL INDUSTRIES, INC. (KR) 2013-06-27 US disclosed
EP-0862205-A1 Heat-resistant adhesive HITACHI CHEMICAL CO., LTD. (JP) 1998-09-02 EP disclosed
EP-0553612-B1 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO LTD (JP) 1996-08-21 EP disclosed
US-5510425-A AROMATIC POLYIMIDE-EPOXY COPOLYMER MODIFIED BY BISMALEIMIDE COMPOUND; FLEXIBILITY, PEELING STRENGTH; COLDSETTING RESINS, ADHESIVES HITACHI CHEMICAL COMPANY, LTD. (JP) 1996-04-23 US disclosed
US-5508357-A SOLUBILITY IN SOLVENT, LOW MELTING POINT HITACHI CHEMICAL COMPANY, LTD. (JP) 1996-04-16 US disclosed
EP-0553612-A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO., LTD. (JP) 1993-08-04 EP disclosed
US-4716210-A Use of liquid, cold-hardening polyurethane-urea-forming components for corrosion-inhibiting, wear-resistant coatings on metal and plastics surfaces and moldings and on stone and concrete BAYER AKTIENGESELLSCHAFT (DE) 1987-12-29 US disclosed
EP-0081729-B1 USE OF LIQUID COLD-SETTING POLYURETHANE FORMING COMPONENTS FOR CORROSION-RETARDANT AND WEAR-PROTECTING COATINGS OF METALLIC AND PLASTICS SURFACES AND MOULDED ARTICLES, AND OF STONE AND CONCRETE BAYER AG (DE) 1987-07-29 EP disclosed
EP-0081729-A1 Use of liquid cold-setting polyurethane forming components for corrosion-retardant and wear-protecting coatings of metallic and plastics surfaces and moulded articles, and of stone and concrete BAYER AG (DE) 1983-06-22 EP disclosed