SCHEMBL3970341

SCHEMBL3970341

CS(C)(OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)c1ccc([N+](=O)[O-])c2ccccc12

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MMP1 P03956 2/20 0.38
MMP2 P08253 2/20 0.38
MMP9 P14780 2/20 0.38
MMP8 P22894 2/20 0.38
MMP13 P45452 2/20 0.38
KMT2A Q03164 4/20 0.37
MEN1 O00255 3/20 0.37
CTSB P07858 2/20 0.37
CA2 P00918 2/20 0.36
TDP1 Q9NUW8 2/20 0.36
HSD11B1 P28845 1/20 0.34
POLB P06746 1/20 0.33
ATM Q13315 1/20 0.33
ABCC9 O60706 1/20 0.33
ABCC8 Q09428 1/20 0.33
KCNJ11 Q14654 1/20 0.33
KCNJ8 Q15842 1/20 0.33
CA1 P00915 1/20 0.33
AR P10275 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3968808 0.99 MMP1 (0.38) MMP1MMP2MMP9MMP8MMP13
SCHEMBL2519055 0.87 CTSB (0.41) KMT2AMEN1CTSBTDP1POLB
SCHEMBL3965723 0.86 CA2 (0.37) MMP1MMP2MMP9MMP8MMP13
SCHEMBL3973438 0.85 CA2 (0.37) MMP1MMP2MMP9MMP8MMP13
SCHEMBL3974482 0.82 CYP1A2 (0.34) MMP1MMP2MMP9MMP8MMP13
SCHEMBL3970515 0.81 CA1 (0.35) MMP1MMP2MMP9MMP8MMP13
SCHEMBL3114242 0.78 CA1 (0.41) KMT2AMEN1CA2CA1ALDH1A1
SCHEMBL3974776 0.78 IMPDH2 (0.37) CA2HSD11B1ABCC9ABCC8KCNJ11
SCHEMBL3972693 0.77 IMPDH2 (0.36) CA2HSD11B1ABCC9ABCC8KCNJ11
SCHEMBL3114547 0.77 CA1 (0.40) KMT2AMEN1CA2CA1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7531286-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2009-05-12 US disclosed
US-7510817-B2 Photoresist polymer compositions JSR CORPORATION (JP) 2009-03-31 US disclosed
US-20070248911-A1 Pattern forming method and bilayer film IWASAWA HARUO 2007-10-25 US disclosed
EP-1641848-B1 PHOTORESIST POLYMER COMPOSITIONS JSR CORP (JP) 2007-08-22 EP disclosed
US-7244549-B2 Pattern forming method and bilayer film JSR CORPORATION (JP) 2007-07-17 US disclosed
US-7202016-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2007-04-10 US disclosed
US-20060257781-A1 Photoacid generator, and a polymer with units of 2-alkyladamantyl (meth)acrylate, 3-hydroxyadamantyl (meth)acrylate, 1-alkylcyclopentyl (meth)acrylate or 7-oxo-3,8-methano-6-oxabicyclo(3.2.1)octan-4-yl (meth)acrylate, made with a chain transfer agent; e.g. RAFT polymer; narrow polydispersity FREESLATE, INC. 2006-11-16 US disclosed
US-7078148-B2 Photoresist with improved sensitivity and resolution to deep ultraviolet rays/excimer lasers; semiconductors; integrated circuits JSR CORPORATION (JP) 2006-07-18 US disclosed
EP-1641849-A1 PHOTORESIST POLYMERS AND COMPOSITIONS HAVING ACRYLIC- OR METHACRYLIC-BASED POLYMERIC RESIN PREPARED BY A LIVING FREE RADICAL PROCESS Symyx Technologies, Inc. (US) 2006-04-05 EP disclosed
EP-1641848-A1 PHOTORESIST POLYMER COMPOSITIONS JSR Corporation (JP) 2006-04-05 EP disclosed
US-20030203309-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2003-10-30 US disclosed
US-20030191268-A1 Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin composition IWASAWA HARUO (JP) 2003-10-09 US disclosed
US-20030073040-A1 Pattern forming method and bilayer film JSR CORPORATION (JP) 2003-04-17 US disclosed
US-6531260-B2 Photoresist JSR CORPORATION (JP) 2003-03-11 US disclosed
US-6482568-B1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-11-19 US disclosed
US-20020058201-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1193558-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-04-03 EP disclosed
US-20010041769-A1 Polysiloxane, method of manufacturing same, silicon-containingalicyclic compouns, and radiation-sensitive resin composition JSR CORPORATION (JP) 2001-11-15 US disclosed
EP-1142928-A1 Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin compounds JSR Corporation (JP) 2001-10-10 EP disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed