Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 6/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.38 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.37 |
| ▸ | PRMT5 | O14744 | 2/20 | 0.36 |
| ▸ | WDR77 | Q9BQA1 | 2/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | TP53 | P04637 | 2/20 | 0.34 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.34 |
| ▸ | LMNA | P02545 | 2/20 | 0.34 |
| ▸ | HTT | P42858 | 2/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | CRHBP | P24387 | 1/20 | 0.34 |
| ▸ | CRHR2 | Q13324 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | RGS12 | O14924 | 1/20 | 0.33 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.33 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10439388 | 0.85 | TSHR (0.41) | TSHRALDH1A1TP53HIF1ACYP3A4 | |
| SCHEMBL9696933 | 0.81 | MEN1 (0.42) | TSHRALDH1A1PRMT5WDR77MAPT | |
| SCHEMBL23443041 | 0.79 | TSHR (0.44) | TSHRALDH1A1TP53HIF1ACYP3A4 | |
| SCHEMBL13779731 | 0.79 | TSHR (0.44) | TSHRALDH1A1TP53HIF1ACYP3A4 | |
| SCHEMBL95157 | 0.79 | TSHR (0.64) | TSHRALDH1A1KDM4EMAPTTP53 | |
| SCHEMBL13907638 | 0.79 | KDM4E (0.49) | TSHRALDH1A1KDM4EPRMT5WDR77 | |
| SCHEMBL22560135 | 0.79 | TSHR (0.41) | TSHRALDH1A1PRMT5WDR77TP53 | |
| SCHEMBL22845686 | 0.79 | KDM4E (0.43) | ALDH1A1KDM4EPRMT5WDR77MAPT | |
| SCHEMBL12190123 | 0.78 | TSHR (0.39) | TSHRALDH1A1TP53HIF1ACYP3A4 | |
| SCHEMBL16838537 | 0.78 | TSHR (0.44) | TSHRALDH1A1TP53HIF1ACYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 105 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116577965-B | Negative photosensitive solid adhesive film and preparation method thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-116577965-A | Negative photosensitive solid adhesive film and preparation method thereof | 明士(北京)新材料开发有限公司 | 2023-08-11 | — | — | CN | claimed |
| CN-116333303-B | Anti-mould-pressing alkaline aqueous development photosensitive adhesive film and application thereof | 明士(北京)新材料开发有限公司 | 2023-08-04 | — | — | CN | claimed |
| CN-116333303-A | Anti-mould-pressing alkaline aqueous development photosensitive adhesive film and application thereof | 明士(北京)新材料开发有限公司 | 2023-06-27 | — | — | CN | claimed |
| CN-115407610-B | Photosensitive resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-05-16 | — | — | CN | claimed |
| CN-115407610-A | Photosensitive resin composition and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-11-29 | — | — | CN | claimed |
| CN-114995060-B | Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-11-01 | — | — | CN | claimed |
| CN-114995060-A | Negative photosensitive resin composition capable of being cured at low temperature and preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2022-09-02 | — | — | CN | claimed |
| CN-114280887-A | Negative photosensitive solid glue film developed by alkaline water system and preparation method thereof | 明士(北京)新材料开发有限公司 | 2022-04-05 | — | — | CN | claimed |
| CN-122085600-A | Negative photosensitive resin composition and preparation method and application thereof | — | 2026-05-26 | — | — | CN | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-7563557-B2 | Polyamide | ASAHI KASEI EMD CORPORATION (JP) | 2009-07-21 | — | — | US | disclosed |
| US-20070248910-A1 | heat resistant; low residual stress after curing; electronic insulation; semiconductor; a phthalic acid having an amine or imide group and an aromatic tetracarboxylic acid and a diamino siloxane or polysiloxane; tetracarboxybiphenyl; 5-aminoisophthalic acid; cured relief pattern; polyamide-imide precurso | ASAHI KASEI EMD CORPORATION (JP) | 2007-10-25 | — | — | US | disclosed |
| US-7282323-B2 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-10-16 | — | — | US | disclosed |
| EP-1775316-A1 | POLYAMIDE | Asahi Kasei EMD Corporation (JP) | 2007-04-18 | — | — | EP | disclosed |
| US-20050244739-A1 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2005-11-03 | — | — | US | disclosed |
| EP-1536286-A1 | HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2005-06-01 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | TSHR 3312/4885ALDH1A1 3316/4885KDM4E 295/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | TSHR 2388/4885ALDH1A1 413/4885KDM4E 1832/4885 |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | RER1, ASIC1, FRG1 | TSHR 1401/4885ALDH1A1 2344/4885KDM4E 419/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.