Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC9A1 | P19634 | 7/20 | 0.51 |
| ▸ | POLB | P06746 | 2/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.47 |
| ▸ | ATM | Q13315 | 1/20 | 0.47 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.47 |
| ▸ | CYP4Z1 | Q86W10 | 6/20 | 0.46 |
| ▸ | APAF1 | O14727 | 1/20 | 0.44 |
| ▸ | DGAT1 | O75907 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.43 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.43 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.43 |
| ▸ | MAPT | P10636 | 1/20 | 0.43 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.43 |
| ▸ | THPO | P40225 | 1/20 | 0.43 |
| ▸ | HCAR3 | P49019 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22032189 | 0.87 | SLC9A1 (0.50) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL1652528 | 0.84 | SLC9A1 (0.53) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL11407750 | 0.82 | HCAR3 (0.55) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL31066856 | 0.82 | SLC9A1 (0.55) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL11402863 | 0.81 | HCAR3 (0.56) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL1866263 | 0.80 | SLC9A1 (0.52) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL9091544 | 0.80 | POLB (0.55) | SLC9A1POLBMAPK1ATMKEAP1 | |
| SCHEMBL10919575 | 0.78 | ALDH1A1 (0.65) | MAPK1ALDH1A1CYP1A2CYP3A4MAPT | |
| SCHEMBL7380423 | 0.78 | POLB (0.43) | SLC9A1POLBMAPK1ATMCYP4Z1 | |
| SCHEMBL7048241 | 0.77 | SLC9A1 (0.48) | SLC9A1POLBMAPK1ATMKEAP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 96 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8864860-B2 | Polishing composition | FUJIMI INCORPORATED (JP) | 2014-10-21 | — | — | US | claimed |
| US-4212754-A | LIGANDS CONTAINING AMINE, HYDROXY, OXAZOLINE, AND IMIDAZOLINE GROUPS | MOBIL OIL CORPORATION (US) | 1980-07-15 | — | — | US | claimed |
| US-12630742-B2 | Polishing composition using polishing particles containing basic substance and having high water affinity | NISSAN CHEMICAL CORPORATION (JP) | 2026-05-19 | — | — | US | disclosed |
| US-20260042978-A1 | PROCESSING SOLUTION FOR SEMICONDUCTOR DEVICE | TOKYO OHKA KOGYO CO LTD (JP) | 2026-02-12 | — | — | US | disclosed |
| US-20260028553-A1 | PROCESSING SOLUTION, METHOD FOR MANUFACTURING PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TOKYO OHKA KOGYO CO LTD (JP) | 2026-01-29 | — | — | US | disclosed |
| US-12493244-B2 | Photosensitive resin composition, photosensitive dry film, and pattern formation method | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-12-09 | — | — | US | disclosed |
| US-20250270474-A1 | PROCESSING SOLUTION, METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-08-28 | — | — | US | disclosed |
| US-20250270480-A1 | PROCESSING SOLUTION, METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-08-28 | — | — | US | disclosed |
| US-20250201546-A1 | METHOD FOR PROCESSING SUBSTRATE, KIT FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-06-19 | — | — | US | disclosed |
| CN-114600045-B | Photosensitive resin composition, photosensitive dry film and pattern forming method | 信越化学工业株式会社 | 2025-05-09 | — | — | CN | disclosed |
| US-20250140549-A1 | PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD, (JP) | 2025-05-01 | — | — | US | disclosed |
| US-20130026044-A1 | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2013-01-31 | — | — | US | disclosed |
| EP-2551722-A1 | Chemically amplified positive resist composition and patterning process | Shin-Etsu Chemical Co., Ltd. (JP) | 2013-01-30 | — | — | EP | disclosed |
| US-20120153218-A1 | POLISHING COMPOSITION | FUJIMI INCORPORATED (JP) | 2012-06-21 | — | — | US | disclosed |
| US-20090179172-A1 | POLISHING COMPOSITION | FUJIMI INCORPORATED (JP) | 2009-07-16 | — | — | US | disclosed |
| US-20090173910-A1 | POLISHING COMPOSITION | FUJIMI INCORPORATED (JP) | 2009-07-09 | — | — | US | disclosed |
| CN-101469252-A | Polishing composition | FUJIMI INC (JP) | 2009-07-01 | — | — | CN | disclosed |
| CN-101469253-A | Grinding composition | FUJIMI INC (JP) | 2009-07-01 | — | — | CN | disclosed |
| US-20040148867-A1 | Chelating resin particle consisting of aminocarboxylic acid, aminophosphonic acid, and/or iminodiacetic acid group; inorganic particle and anionic surfactant; chemical mechanical polishing | SUMITOMO CHEMICAL COMPANY, LIMITED | 2004-08-05 | — | — | US | disclosed |
| US-4212754-A | LIGANDS CONTAINING AMINE, HYDROXY, OXAZOLINE, AND IMIDAZOLINE GROUPS | MOBIL OIL CORPORATION (US) | 1980-07-15 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260028553-A1 | PROCESSING SOLUTION, METHOD FOR MANUFACTURING PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TET2, TET1, KDM2A | SLC9A1 2539/4885POLB 3699/4885MAPK1 1109/4885 |
| US-20260042978-A1 | PROCESSING SOLUTION FOR SEMICONDUCTOR DEVICE | TWF2, DSTYK, WNK1 | SLC9A1 121/4885POLB 1833/4885MAPK1 188/4885 |
| US-12630742-B2 | Polishing composition using polishing particles containing basic substance and having high water affinity | POLR1A, PRMT1, SRRM2 | SLC9A1 1600/4885POLB 116/4885MAPK1 425/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.