SCHEMBL4272491

SCHEMBL4272491

OCCOc1ccc(-c2cccc3c2C(c2ccc(OCCO)cc2)c2ccccc2-3)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 2/20 0.45
ESR2 Q92731 2/20 0.45
ALDH1A1 P00352 1/20 0.45
RECQL P46063 1/20 0.45
GPR174 Q9BXC1 1/20 0.43
GAA P10253 1/20 0.40
FFAR4 Q5NUL3 4/20 0.39
PDK2 Q15119 1/20 0.36
NR1I2 O75469 1/20 0.36
CHRNB4 P30926 1/20 0.35
CHRNA3 P32297 1/20 0.35
CHRNA7 P36544 1/20 0.35
HRH3 Q9Y5N1 3/20 0.34
KCNH2 Q12809 1/20 0.34
CYP19A1 P11511 1/20 0.33
ALOX5AP P20292 1/20 0.33
FEN1 P39748 1/20 0.33
CYP3A4 P08684 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
PPARG P37231 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL577071 0.88 ALDH1A1 (0.53) ESR1ESR2ALDH1A1RECQLGPR174
SCHEMBL30985950 0.88 ALDH1A1 (0.53) ESR1ESR2ALDH1A1RECQLGPR174
SCHEMBL5813609 0.86 ESR1 (0.40) ESR1ESR2ALDH1A1GPR174FFAR4
SCHEMBL8681925 0.84 ESR1 (0.44) ESR1ESR2ALDH1A1RECQLGPR174
SCHEMBL2481498 0.83 ESR1 (0.41) ESR1ESR2ALDH1A1RECQLGPR174
SCHEMBL5171759 0.83 THRB (0.53) ESR1ESR2ALDH1A1GPR174GAA
SCHEMBL8686830 0.82 ESR1 (0.43) ESR1ESR2ALDH1A1RECQLGPR174
SCHEMBL29586924 0.82 ALDH1A1 (0.44) ESR1ESR2ALDH1A1RECQLGPR174
SCHEMBL4385697 0.81 NPC1 (0.51) ALDH1A1GAACYP3A4SMN1; SMN2
SCHEMBL9069717 0.81 TDP1 (0.49) ESR1ESR2ALDH1A1GPR174GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3181639-A1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY THEREOF Kaneka Corporation (JP) 2017-06-21 EP claimed
WO-2022073343-A1 SYNTHESIS METHOD FOR 9,9-BIS[4-(2-HYDROXYETHOXY)PHENYL]FLUORENE 浙江中欣氟材股份有限公司 2022-04-14 WO disclosed
JP-2009242461-A POLYESTER RESIN, POLYESTER WATER DISPERSION, AND POLYESTER FILM WITH COAT GOO CHEMICAL CO LTD 2009-10-22 JP disclosed
US-6187493-B1 CHARGE GENERATING MATERIAL AND ELECTRON TRANSFER MATERIAL UNIFORMLY DISPERSED WITHIN COMPATIBLE POLYESTER BINDER; PHOTOSENSITIVITY, WEAR RESISTANCE, ADHESION TO ELECTROCONDUCTIVE SUBSTRATE KYOCERA MITA CORPORATION (JP) 2001-02-13 US disclosed
US-5780194-A PHOTOSENSITIVE LAYER OF POLYESTER BINDING RESIN, ELECTRIC CHARGE GENERATING MATERIAL, AND HOLE TRANSFERRING MATERIAL MITA INDUSTRIAL CO., LTD. (JP) 1998-07-14 US disclosed
EP-0738934-A2 Electrophotosensitive material MITA INDUSTRIAL CO., LTD. (JP) 1996-10-23 EP disclosed