SCHEMBL436482

SCHEMBL436482

COc1ccc(CNc2cc(C(C)=O)ccn2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CLK4 Q9HAZ1 7/20 0.55
VNN1 O95497 4/20 0.52
DYRK1A Q13627 4/20 0.52
KDM4E B2RXH2 2/20 0.51
ASPH Q12797 2/20 0.51
KDM8 Q8N371 2/20 0.51
CLK1 P49759 1/20 0.51
ALDH1A1 P00352 2/20 0.49
NR3C2 P08235 1/20 0.49
MAPK10 P53779 1/20 0.49
SMN1; SMN2 Q16637 1/20 0.49
L3MBTL1 Q9Y468 1/20 0.49
KDM1A O60341 1/20 0.47
HDAC1 Q13547 1/20 0.47
HDAC2 Q92769 1/20 0.47
HDAC8 Q9BY41 1/20 0.47
HDAC6 Q9UBN7 1/20 0.47
HDAC5 Q9UQL6 1/20 0.47
RIOX2 Q8IUF8 1/20 0.47
MAP2K7 O14733 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27766207 0.87 CLK4 (0.53) CLK4VNN1DYRK1AKDM4EASPH
SCHEMBL8422251 0.79 MEN1 (0.68) CLK4DYRK1AKDM4ECLK1ALDH1A1
SCHEMBL28131061 0.78 CLK4 (0.57) CLK4DYRK1AKDM4EASPHKDM8
SCHEMBL3923979 0.77 CLK4 (0.53) CLK4VNN1DYRK1AKDM4EASPH
SCHEMBL3159168 0.77 CLK4 (0.56) CLK4DYRK1ACLK1NR3C2
SCHEMBL34462952 0.76 KDM5A (0.68) CLK4VNN1DYRK1AALDH1A1NR3C2
SCHEMBL439371 0.76 CLK4 (0.66) CLK4VNN1DYRK1AKDM4ECLK1
SCHEMBL8224486 0.76 CLK4 (0.54) CLK4DYRK1ACLK1ALDH1A1SMN1; SMN2
SCHEMBL12640029 0.76 NPC1 (0.51) ALDH1A1SMN1; SMN2
SCHEMBL17393176 0.76 CLK4 (0.54) CLK4DYRK1ACLK1NR3C2HDAC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 621 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20040253547-A1 Pattern formation method MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 2004-12-16 US claimed
US-6569596-B1 Photoresists comprising N-(ethylsulfonyloxy)succinimide, novolaks, curing agents and an acid generators such as alpha -(hexylsulfonyloxyimino)-4-methoxybenzyl cyanide; integrated circuits; semiconductors SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2003-05-27 US claimed
US-6235446-B1 MIXTURE OF P-HYDROXYSTYRENE, ACRYLATED ESTER JSR CORPORATION (JP) 2001-05-22 US claimed
US-5994022-A BECOMES SOLUBLE IN ALKALI DEVELOPING SOLUTION BY ACTION OF AN ACID JSR CORPORATION (JP) 1999-11-30 US claimed
US-5916728-A RESIN WHICH IS CONVERTED TO ALKALI-SOLUBLE FROM ALKALI-INSOLUBLE OR ALKALI-SLIGHTLY SOLUBLE BY THE ACTION OF AN ACID, ACID GENERATOR AND TERTIARY AMINE COMPOUND HAVING AN ALIPHATIC HYDROXYL GROUP. SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-06-29 US claimed
US-20260077385-A1 FILM FORMING METHOD, CURABLE COMPOSITION, AND ARTICLE MANUFACTURING METHOD CANON KABUSHIKI KAISHA (JP) 2026-03-19 US disclosed
US-12570872-B2 Acrylic polymerized polysiloxane, composition comprising the same, and cured film produced using the same MERCK PATENT GMBH (DE) 2026-03-10 US disclosed
US-20260042932-A1 COMPOSITION, PATTERN FORMING METHOD, AND ARTICLE MANUFACTURING METHOD CANON KK (JP) 2026-02-12 US disclosed
US-12529144-B2 Composition, method of producing substrate, and polymer JSR CORPORATION (JP) 2026-01-20 US disclosed
US-20250362597-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-11-27 US disclosed
US-12449731-B2 Photosensitive resin composition, method for producing resist pattern film, and method for producing plated formed product ISR CORPORATION (JP) 2025-10-21 US disclosed
US-20250321485-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-10-16 US disclosed
EP-0856773-A1 Chemical amplification type positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-08-05 EP disclosed
EP-0843220-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-05-20 EP disclosed
EP-0831371-A2 Positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-03-25 EP disclosed
US-5679495-A TERPOLYMER PHOTORESIST CONTAINING VINYLPHENOL DERIVATIVE, TERT-BUTYL (METH)ACRYLATE, AND A UNIT TO REDUCE ALKALINE SOLUBILITY; DRY ETCH RESISTANCE JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-10-21 US disclosed
EP-0793144-A2 Radiation sensitive composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1997-09-03 EP disclosed
EP-0660187-B1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO LTD (JP) 1997-03-05 EP disclosed
US-5556734-A RESISTS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-09-17 US disclosed
EP-0660187-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-06-28 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260077385-A1 FILM FORMING METHOD, CURABLE COMPOSITION, AND ARTICLE MANUFACTURING METHOD EEF1D, RHOA, YWHAH CLK4 3538/4885VNN1 4681/4885DYRK1A 2003/4885
US-20260042932-A1 COMPOSITION, PATTERN FORMING METHOD, AND ARTICLE MANUFACTURING METHOD SMCHD1, PIM1, PIM2 CLK4 3032/4885VNN1 4164/4885DYRK1A 3066/4885
US-12570872-B2 Acrylic polymerized polysiloxane, composition comprising the same, and cured film produced using the same SMC1A, SMC2, SMC3 CLK4 4210/4885VNN1 3617/4885DYRK1A 4555/4885
US-12529144-B2 Composition, method of producing substrate, and polymer SCO2, AOC2, PUF60 CLK4 578/4885VNN1 2291/4885DYRK1A 988/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.