Known targets — ChEMBL curated mechanism
AGTR1DHFRGABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTNR3C2PBP2XPTGS1PTGS2VKORC1blablaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAftsImrcAmrcBmrdApbp1apbp1bpbp2apbp2bpbp3polthyA
The experimentally established mechanism targets of Potassium Ion. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL438395 | 0.79 | — | — | |
| SCHEMBL9751336 | 0.79 | ALDH1A1 (0.42) | — | |
| SCHEMBL653171 | 0.67 | — | — | |
| SCHEMBL673134 | 0.67 | — | — | |
| Potassium Ion SCHEMBL4362484 | 0.67 | — | — | |
| Potassium Ion SCHEMBL31530665 | 0.67 | CA1 (0.60) | — | |
| Potassium Ion SCHEMBL11792253 | 0.67 | CA1 (0.60) | — | |
| SCHEMBL17164897 | 0.65 | — | — | |
| Potassium Ion SCHEMBL3113223 | 0.65 | — | — | |
| SCHEMBL6281253 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7563315-B2 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | OMG Electronic Chemicals, Inc. (US) | 2009-07-21 | — | — | US | claimed |
| US-20060226115-A1 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | MACDERMID, INCORPORATED | 2006-10-12 | — | — | US | claimed |
| US-6946027-B2 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | ELECTROCHEMICALS, INC. (US) | 2005-09-20 | — | — | US | claimed |
| US-20040159264-A1 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | MACDERMID, INCORPORATED | 2004-08-19 | — | — | US | claimed |
| US-20030213553-A1 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | MACDERMID, INCORPORATED | 2003-11-20 | — | — | US | claimed |
| US-7563315-B2 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | OMG Electronic Chemicals, Inc. (US) | 2009-07-21 | — | — | US | disclosed |
| US-20060226115-A1 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | MACDERMID, INCORPORATED | 2006-10-12 | — | — | US | disclosed |
| US-7108795-B2 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | ELECTROCHEMICALS, INC. (US) | 2006-09-19 | — | — | US | disclosed |
| US-20050238811-A1 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | MACDERMID, INCORPORATED | 2005-10-27 | — | — | US | disclosed |
| US-6946027-B2 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | ELECTROCHEMICALS, INC. (US) | 2005-09-20 | — | — | US | disclosed |
| US-20040159264-A1 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | MACDERMID, INCORPORATED | 2004-08-19 | — | — | US | disclosed |
| US-6716281-B2 | ADHESION PROMOTER COMPREISING OXIDIZER, PH ADJUSTER, TOPOGRAPHY MODIFIER; AND COATING STABILIZER COMPRISING 2-MERCAPTOTHIAZOLINE OR 2-MERCAPTOIMIDAZOLINE DERIVATIVE | ELECTROCHEMICALS, INC. | 2004-04-06 | — | — | US | disclosed |
| US-20030213553-A1 | Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates | MACDERMID, INCORPORATED | 2003-11-20 | — | — | US | disclosed |