Propylene Glycol

Propylene Glycol

SCHEMBL443947

CC(O)CO.CCCCOC(=O)CC.CCOCC

nearest known ligand 0.55

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

SLC5A2

The experimentally established mechanism targets of Propylene Glycol. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.55
ALDH1A1 P00352 1/20 0.41
MAPT P10636 1/20 0.40
ATM Q13315 1/20 0.39
HTT P42858 1/20 0.39
KDM4E B2RXH2 1/20 0.38
DUSP3 P51452 1/20 0.38
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
LMNA P02545 1/20 0.38
DGKA P23743 1/20 0.38
HPGD P15428 1/20 0.37
TSHR P16473 1/20 0.37
RAD52 P43351 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Propylene Glycol SCHEMBL8961545 0.94 NAAA (0.66) NAAAMAPTKDM4EDUSP3MEN1
Propylene Glycol SCHEMBL5144291 0.93 NAAA (0.62) NAAAALDH1A1MAPTATMHTT
Propylene Glycol SCHEMBL445696 0.90 NAAA (0.44) NAAAALDH1A1MAPTKDM4EDUSP3
Propylene Glycol SCHEMBL7037542 0.89 MAPT (0.46) NAAAALDH1A1MAPTATMKDM4E
Propylene Glycol SCHEMBL2266764 0.89 MAPT (0.50) NAAAALDH1A1MAPTKDM4EDUSP3
Ether SCHEMBL181381 0.86 NAAA (0.62) NAAAALDH1A1ATMHTTDGKA
Acetic Acid Butyl Ester SCHEMBL107642 0.85 ALDH1A1 (0.62) ALDH1A1MAPTATMLMNAHPGD
Ethyl Propionate SCHEMBL104601 0.84 MGAM (0.43) NAAAALDH1A1MAPTKDM4EDUSP3
Propylene Glycol SCHEMBL10559512 0.83 MAPT (0.51) NAAAMAPTKDM4EDUSP3MEN1
Propylene Glycol SCHEMBL28409524 0.82 NAAA (0.50) NAAAALDH1A1MAPTKDM4EDUSP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 230 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US claimed
US-20250180989-A1 COMPOSITION FOR PRETREATMENT NISSAN CHEMICAL CORPORATION (JP) 2025-06-05 US disclosed
WO-2025071108-A1 RESIN COMPOSITION FOR ANTI-REFLECTIVE FILM, ANTI-REFLECTIVE FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2025-04-03 WO disclosed
CN-118830065-A Pretreatment composition 日产化学株式会社 2024-10-22 CN disclosed
WO-2024158178-A1 THERMOSETTING RESIN COMPOSITION, CURED FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2024-08-02 WO disclosed
CN-118344798-A Aqueous 2K coating composition 巴斯夫涂料有限公司 2024-07-16 CN disclosed
WO-2024147537-A1 RESIN COMPOSITION FOR ANTI-REFLECTION FILM, ANTI-REFLECTION FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2024-07-11 WO disclosed
CN-109976097-B Method of forming micropattern and substrate processing apparatus 三星电子株式会社 2024-06-18 CN disclosed
CN-110007563-B Negative photosensitive resin composition, spacer, protective film, and liquid crystal display element 奇美实业股份有限公司 2024-04-02 CN disclosed
CN-111324013-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-12-01 CN disclosed
US-20030064303-A1 Composition having refractive index sensitively changeable by radiation and method for forming refractive index pattern JSR CORPORATION (JP) 2003-04-03 US disclosed
US-20030054284-A1 Radiation-sensitive composition, insulating film and organic el display element JSR CORPORATION (JP) 2003-03-20 US disclosed
EP-1235104-A1 COMPOSITION HAVING REFRACTIVE INDEX SENSITIVELY CHANGEABLE BY RADIATION AND METHOD FOR FORMING REFRACTIVE INDEX PATTERN JSR Corporation (JP) 2002-08-28 EP disclosed
US-6399267-B1 COPOLYMER CONTAINING UNSATURATED CARBOXY ACID OR ANHYDRIDE AND MONOMER OF EPOXY CONTAINING ACRYLIC ESTER JSR CORPORATION (JP) 2002-06-04 US disclosed
US-20020055059-A1 Radiation sensitive resin composition, cathode separator and el display device JSR CORPORATION (JP) 2002-05-09 US disclosed
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US disclosed
EP-1193557-A1 Use of a radiation sensitive resin composition for the formation of cathode separator, cathode separator and electroluminescent display device JSR Corporation (JP) 2002-04-03 EP disclosed
US-20010044075-A1 Radiation sensitive resin composition for forming barrier ribs for an EL display element, barrier rib and EL display element JSR CORPORATION (JP) 2001-11-22 US disclosed
EP-1150165-A1 Radiation sensitive resin composition for forming barrier ribs for an el display element, barrier ribs and el display element JSR Corporation (JP) 2001-10-31 EP disclosed
EP-1057859-A2 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR Corporation (JP) 2000-12-06 EP disclosed