SCHEMBL446841

SCHEMBL446841

CCOc1cccc(OCC)c1C(=O)P(=O)(C(=O)c1c(OCC)cccc1OCC)C(C)CC

nearest known ligand 0.43

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 3/20 0.43
KDM4E B2RXH2 1/20 0.43
KMT2A Q03164 1/20 0.43
GLA P06280 1/20 0.41
HCRTR1 O43613 2/20 0.41
SMN1; SMN2 Q16637 1/20 0.39
GAA P10253 2/20 0.38
PTGS1 P23219 1/20 0.38
PTGS2 P35354 1/20 0.38
KCNK3 O14649 1/20 0.37
KCNK9 Q9NPC2 1/20 0.37
MRGPRX4 Q96LA9 1/20 0.37
MAPT P10636 1/20 0.37
MAPK1 P28482 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5996241 0.94 SMN1; SMN2 (0.47) L3MBTL1KDM4EKMT2AGLASMN1; SMN2
SCHEMBL5995649 0.93 L3MBTL1 (0.39) L3MBTL1KDM4EKMT2AGLAHCRTR1
SCHEMBL5997055 0.90 TAS1R3 (0.38) L3MBTL1KDM4EKMT2AGLAHCRTR1
SCHEMBL5997621 0.89 SMN1; SMN2 (0.43) KDM4ESMN1; SMN2KCNK3KCNK9MAPT
SCHEMBL5996657 0.87 RXFP1 (0.39) L3MBTL1KDM4EKMT2AGLAHCRTR1
SCHEMBL443439 0.86 CA12 (0.47) KDM4ESMN1; SMN2MAPT
SCHEMBL5996474 0.80 ALDH1A1 (0.43) KDM4ESMN1; SMN2MAPT
SCHEMBL5996509 0.80 TAS1R3 (0.46) KDM4ESMN1; SMN2MAPTMAPK1
SCHEMBL5995696 0.79 CA12 (0.41) SMN1; SMN2GAAMAPTMAPK1
SCHEMBL5996288 0.79 CA12 (0.41) SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 192 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026105802-A1 RESIN COMPOSITION, DRY FILM, AND CURED PRODUCT 太陽ホールディングス株式会社 2026-05-21 WO disclosed
US-12624140-B2 Composition containing compound having polyoxyalkylene chain RESONAC CORPORATION (JP) 2026-05-12 US disclosed
EP-4711396-A1 CURABLE COMPOSITION Tokyo University of Science (JP) 2026-03-18 EP disclosed
US-20260060900-A1 DENTAL COMPOSITE RESIN KIT SHOFU INC. (JP) 2026-03-05 US disclosed
US-12492275-B2 Photo-curable compositions containing high refractive index monomers for use in 3D printing applications ARKEMA FRANCE (FR) 2025-12-09 US disclosed
US-20250346702-A1 COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER RESONAC CORP (JP) 2025-11-13 US disclosed
US-20250304748-A1 RESIN COMPOSITION, DRY FILM, AND CURED PRODUCT TAIYO HOLDINGS CO., LTD. (JP) 2025-10-02 US disclosed
US-20250297092-A1 COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ESTER-BASED THIXOTROPY-IMPARTING AGENT RESONAC CORPORATION (JP) 2025-09-25 US disclosed
CN-112920735-B Laminate body 日东电工株式会社 2025-06-13 CN disclosed
EP-3542775-B1 COMPOSITION WITH EXCELLENT STORAGE STABILITY USING HIGHLY BASIC FILLER SHOFU INC (JP) 2025-04-02 EP disclosed
EP-2395063-A2 Pressure-sensitive adhesive composition and acrylic pressure-sensitive adhesive tape Nitto Denko Corporation (JP) 2011-12-14 EP disclosed
EP-2385089-A1 Acrylic pressure-sensitive adhesive composition and acrylic pressure-sensitive adhesive tape Nitto Denko Corporation (JP) 2011-11-09 EP disclosed
US-20110250433-A1 ACRYLIC PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2011-10-13 US disclosed
US-20110250446-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND ACRYLIC PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2011-10-13 US disclosed
US-20110251351-A1 ACRYLIC PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND ACRYLIC PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2011-10-13 US disclosed
US-20110070434-A1 ACRYLIC PRESSURE-SENSITIVE ADHESIVE, ACRYLIC PRESSURE-SENSITIVE ADHESIVE LAYER AND ACRYLIC PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET NITTO DENKO CORPORATION (JP) 2011-03-24 US disclosed
EP-2256174-A1 ACRYLIC ADHESIVE, ACRYLIC ADHESIVE LAYER, AND ACRYLIC ADHESIVE TAPE OR SHEET Nitto Denko Corporation (JP) 2010-12-01 EP disclosed
US-20100196704-A1 COMPOSITE FILM NITTO DENKO CORPORATION (JP) 2010-08-05 US disclosed
EP-2186849-A1 COMPOSITE FILM Nitto Denko Corporation (JP) 2010-05-19 EP disclosed
US-5942290-A MOLECULAR COMPLEX OF A MONO-, BIS- OR TRIACYLPHOSPHINE OXIDE ASSOCIATED WITH AN ALPHA-HYDROXY KETONE IN CRYSTALLINE FORM BY WAY OF HYDROGEN BONDING; PHOTOGRAPHIC PRODUCTION OF RELIEF IMAGES CIBA SPECIALTY CHEMICALS CORPORATION (US) 1999-08-24 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260060900-A1 DENTAL COMPOSITE RESIN KIT BOLA2; BOLA2B, LBR, COL2A1 L3MBTL1 362/4885KDM4E 997/4885KMT2A 939/4885
US-12624140-B2 Composition containing compound having polyoxyalkylene chain PIEZO1, HVCN1, TAF11 L3MBTL1 2580/4885KDM4E 1548/4885KMT2A 3677/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.