SCHEMBL449341

SCHEMBL449341

C=C(C)C(=O)OC1CC(=O)OC1(C)C

nearest known ligand 0.40

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.40
CYP3A4 P08684 1/20 0.40
HPGD P15428 1/20 0.40
HSD17B10 Q99714 1/20 0.40
ALDH1A1 P00352 3/20 0.39
LMNA P02545 1/20 0.39
TSHR P16473 1/20 0.33
MAOA P21397 1/20 0.33
GPX4 P36969 1/20 0.32
NPC1 O15118 1/20 0.32
POLB P06746 1/20 0.32
MAPT P10636 1/20 0.32
PKM P14618 1/20 0.32
HTT P42858 1/20 0.32
RECQL P46063 1/20 0.32
RAB9A P51151 1/20 0.32
ATM Q13315 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12227792 0.82 KDM4E (0.33) KDM4ECYP3A4HPGDHSD17B10ALDH1A1
SCHEMBL13817669 0.75 ALDH1A1 (0.40) KDM4ECYP3A4HPGDHSD17B10ALDH1A1
SCHEMBL449190 0.74 ALDH1A1 (0.37) KDM4ECYP3A4HPGDHSD17B10ALDH1A1
SCHEMBL1141893 0.72 OPRM1 (0.32)
SCHEMBL18022213 0.71 ALDH1A1 (0.36) ALDH1A1
SCHEMBL879071 0.71 LMNA (0.42) KDM4ECYP3A4ALDH1A1LMNATSHR
SCHEMBL28526874 0.70 ALDH1A1 (0.33) ALDH1A1
SCHEMBL10729783 0.70 ALDH1A1 (0.33) ALDH1A1
SCHEMBL18774894 0.70 ALDH1A1 (0.36) KDM4EALDH1A1GPX4NPC1POLB
SCHEMBL685129 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9862695-B2 Monomer having N-acyl carbamoyl group and lactone skeleton, and polymeric compound DAICEL CORPORATION (JP) 2018-01-09 US disclosed
US-9598520-B2 Radiation-sensitive resin composition, polymer and method for forming a resist pattern JSR CORPORATION (JP) 2017-03-21 US disclosed
US-20160060374-A1 MONOMER HAVING N-ACYL CARBAMOYL GROUP AND LACTONE SKELETON, AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2016-03-03 US disclosed
EP-2503392-B1 RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER AND RESIST PATTERN FORMATION METHOD JSR CORP (JP) 2015-04-15 EP disclosed
US-8815490-B2 Radiation-sensitive resin composition, polymer, and method for forming resist pattern JSR CORPORATION (JP) 2014-08-26 US disclosed
US-8637623-B2 Monomer having electron-withdrawing substituent and lactone skeleton, polymeric compound, and photoresist composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2014-01-28 US disclosed
US-8623590-B2 Pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-01-07 US disclosed
US-8507575-B2 Radiation-sensitive resin composition, polymer, and compound JSR CORPORATION (JP) 2013-08-13 US disclosed
US-20120295197-A1 RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER AND METHOD FOR FORMING A RESIST PATTERN JSR CORPORATION (JP) 2012-11-22 US disclosed
EP-2503392-A1 RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER AND RESIST PATTERN FORMATION METHOD JSR Corporation (JP) 2012-09-26 EP disclosed
US-20060160247-A1 Unsaturated carboxylic acid hemicacetal ester, polymeric compound and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-07-20 US disclosed
US-6806335-B2 FOR USE IN FINE PATTERNING OF SEMICONDUCTORS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-19 US disclosed
US-6692889-B1 COPOLYMERS CONTAINING DERIVATIZED ADAMANTANYL ACRYLATE FUNCTIONALITY; ETCHING RESISTANCE DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-02-17 US disclosed
US-20040006189-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. 2004-01-08 US disclosed
US-20030148210-A1 Polymer for photoresist and resin compositions therefor DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-08-07 US disclosed
US-6552143-B2 Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-04-22 US disclosed
US-20020169266-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-11-14 US disclosed
US-6440636-B1 HIGH ETCHING RESISTANCE, TRANSPARENCY, ALKALI SOLUBILITY, AND ADHESION; ACRYLIC ESTERS HAVING ADAMANTANE GROUP KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-27 US disclosed
EP-1172694-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1172384-A1 POLYMER FOR PHOTORESISTS AND RESIN COMPOSITIONS FOR PHOTORESISTS Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030148210-A1 Polymer for photoresist and resin compositions therefor LCP1, DOT1L, PRMT1 KDM4E 143/4885CYP3A4 2518/4885HPGD 1375/4885
US-20060160247-A1 Unsaturated carboxylic acid hemicacetal ester, polymeric compound and photoresist resin composition HCAR1, HCAR2, RARA KDM4E 3157/4885CYP3A4 465/4885HPGD 80/4885
US-20160060374-A1 MONOMER HAVING N-ACYL CARBAMOYL GROUP AND LACTONE SKELETON, AND POLYMERIC COMPOUND CNKSR1, NMRAL1, CCNA1 KDM4E 3086/4885CYP3A4 1338/4885HPGD 2983/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.