SCHEMBL4539686

SCHEMBL4539686

O=S(=O)(c1ccc(Sc2ccc(S(=O)(=O)c3ccccc3-c3ccccc3)cc2)cc1)c1ccccc1-c1ccccc1

nearest known ligand 0.45

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 1/20 0.45
PTGS2 P35354 2/20 0.44
NAMPT P43490 2/20 0.44
AKR1B1 P15121 1/20 0.44
MMP8 P22894 5/20 0.43
MMP13 P45452 5/20 0.43
MMP1 P03956 4/20 0.43
MMP2 P08253 4/20 0.43
MMP9 P14780 4/20 0.43
MMP12 P39900 4/20 0.43
MMP14 P50281 4/20 0.43
MMP16 P51512 4/20 0.43
MMP3 P08254 4/20 0.43
HTR6 P50406 6/20 0.42
KMT2A Q03164 1/20 0.41
CASP1 P29466 1/20 0.40
KDM4E B2RXH2 1/20 0.38
APEX1 P27695 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9242466 0.85 HTR6 (0.55) HSD11B1PTGS2NAMPTAKR1B1MMP8
SCHEMBL15418953 0.84 PTGS2 (0.55) PTGS2MMP8MMP13MMP1MMP2
SCHEMBL8844836 0.81 HTR6 (0.55) HSD11B1PTGS2NAMPTAKR1B1MMP8
SCHEMBL28175716 0.81 LMNA (0.55) HSD11B1PTGS2NAMPTAKR1B1MMP8
SCHEMBL3297607 0.81 HSD11B1 (0.63) HSD11B1PTGS2NAMPTAKR1B1MMP8
SCHEMBL20379701 0.81 HTR6 (0.56) HSD11B1PTGS2NAMPTAKR1B1MMP8
SCHEMBL5161585 0.81 PTGS2 (0.54) HSD11B1PTGS2NAMPTAKR1B1MMP8
SCHEMBL28049491 0.81 PTGS2 (0.46) HSD11B1PTGS2NAMPTAKR1B1MMP8
SCHEMBL31463127 0.79 AKR1B1 (0.56) HSD11B1PTGS2NAMPTAKR1B1HTR6
Ethylenediamine SCHEMBL28210540 0.77 HTR6 (0.52) HSD11B1PTGS2NAMPTAKR1B1MMP8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110885401-B Copolymer, curable resin composition containing same, and cured product thereof 株式会社大赛璐 2023-06-13 CN disclosed
CN-111484820-B Photocurable adhesive composition and photocurable adhesive tape 3M创新有限公司 2022-03-29 CN disclosed
CN-113166373-A Epoxy resin photosensitive composition for optical waveguide, photosensitive film for optical waveguide, and opto-electric hybrid board 日东电工株式会社 2021-07-23 CN disclosed
CN-106536654-B Adhesive, adhesive body, and method for producing adhesive body 株式会社可乐丽 2021-01-08 CN disclosed
CN-105375232-B Method for manufacturing connection structure and anisotropic conductive adhesive film 迪睿合株式会社 2020-09-22 CN disclosed
CN-111484820-A Photocurable adhesive composition and photocurable adhesive tape 3M创新有限公司 2020-08-04 CN disclosed
CN-110885401-A Copolymer, curable resin composition containing same, and cured product thereof 株式会社大赛璐 2020-03-17 CN disclosed
US-7534820-B2 Photocuring resin composition containing organic polymer having epoxy group and/or oxetane group-containing silicon group at end, and method for producing same KANEKA CORPORATION (JP) 2009-05-19 US disclosed
US-20070066699-A1 Photocuring composition containing organic polymer having epoxy group and/or oxethane group-containing silicon group at end, and method for producing same KANEKA CORPORATION 2007-03-22 US disclosed
EP-1679328-A1 PHOTOCURING RESIN COMPOSITION CONTAINING ORGANIC POLYMER HAVING EPOXY GROUP AND/OR OXETHANE GROUP-CONTAINING SILICON GROUP AT END, AND METHOD FOR PRODUCING SAME KANEKA CORPORATION (JP) 2006-07-12 EP disclosed
EP-0869393-B1 Positive photosensitive composition FUJI PHOTO FILM CO LTD (JP) 2000-05-31 EP disclosed
US-6037098-A AROMATIC SULFONIC ACID GENERATED FROM A SULFONIUM COMPOUND TO ENHANCE RESIN ALKALINE SOLUBILITY; REDUCED DIFFUSIBILITY OF ACID IN FILM, I.E., UNIFORM LINE WIDTH; HIGH PHOTOSENSITIVITY AND PHOTODECOMPOSITION EFFICIENCY FUJI PHOTO FILM CO., LTD. (JP) 2000-03-14 US disclosed
EP-0869393-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 1998-10-07 EP disclosed