SCHEMBL461968

SCHEMBL461968

Oc1ccccc1-c1nc2ccccc2[nH]1

nearest known ligand 0.79

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
F7 P08709 1/20 0.79
RAB9A P51151 9/20 0.64
NPC1 O15118 9/20 0.64
ALDH1A1 P00352 6/20 0.64
KDM4E B2RXH2 6/20 0.64
SMN1; SMN2 Q16637 5/20 0.64
NPSR1 Q6W5P4 3/20 0.64
PKM P14618 2/20 0.64
HSD17B10 Q99714 2/20 0.64
ABCB11 O95342 1/20 0.64
TP53 P04637 1/20 0.64
HPGD P15428 5/20 0.64
GAA P10253 4/20 0.64
GLA P06280 2/20 0.64
MAPT P10636 2/20 0.64
L3MBTL1 Q9Y468 1/20 0.64
GPR55 Q9Y2T6 1/20 0.64
HTT P42858 1/20 0.64
GUSB P08236 1/20 0.61
PDE5A O76074 1/20 0.61

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29578227 1.00 F7 (0.79) F7RAB9ANPC1ALDH1A1KDM4E
SCHEMBL8624096 0.98 F7 (0.77) F7RAB9ANPC1ALDH1A1KDM4E
SCHEMBL28161199 0.88 F7 (0.82) F7RAB9ANPC1ALDH1A1KDM4E
SCHEMBL2784089 0.87 RAB9A (0.67) F7RAB9ANPC1ALDH1A1KDM4E
SCHEMBL227743 0.86 NPC1 (0.78) F7RAB9ANPC1ALDH1A1KDM4E
SCHEMBL12471581 0.84 AMY1A (0.66) F7RAB9ANPC1ALDH1A1KDM4E
SCHEMBL30900824 0.84 AMY1A (0.66) F7RAB9ANPC1ALDH1A1KDM4E
SCHEMBL31429538 0.84 AMY1A (0.64) F7RAB9ANPC1ALDH1A1KDM4E
SCHEMBL7396100 0.84 AMY1A (0.64) F7RAB9ANPC1ALDH1A1KDM4E
SCHEMBL31429678 0.83 GUSB (0.65) F7RAB9ANPC1ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1405 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US claimed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO claimed
WO-2025100081-A1 COMPOSITION, EPOXY RESIN COMPOSITION, FILM, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-05-15 WO claimed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO claimed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO claimed
CN-117820797-A Injection molding-grade high-transparency TPE material and preparation method thereof 广东弘超橡塑实业有限公司 2024-04-05 CN claimed
CN-111856638-B Optical filter, preparation method thereof and camera module 欧菲影像技术(广州)有限公司 2024-01-26 CN claimed
CN-117288627-A High-flux evaluation method for corrosion inhibitor of common metal material 北京科技大学 2023-12-26 CN claimed
CN-115215585-B Resin asphalt mixture for ultra-long tunnel and preparation method thereof 江苏长路智造科技有限公司 2023-02-24 CN claimed
CN-115594637-A Dehydroabietic acid group 5-bromo-2-hydroxyphenyl benzimidazole functional fluorescent probe and preparation method and application thereof 南京林业大学(CN) 2023-01-13 CN claimed
EP-1607446-A1 ORGANIC/INORGANIC HYBRID MATERIAL, COMPOSITION FOR SYNTHESIZING THE SAME AND PROCESS FOR PRODUCING THE HYBRID MATERIAL SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (JP) 2005-12-21 EP claimed
EP-1511799-B1 FLAT FILM CONDUCTORS COMPRISING THERMOPLASTIC POLYURETHANE BASF AG (DE) 2005-09-28 EP claimed
US-20050187320-A1 Flat film conductors comprising thermoplastic polyurethane BASF AKTIENGESELLSCHAFT (DE) 2005-08-25 US claimed
US-20040265253-A1 Organic-inorganic hybrid material, composition for synthesizing the same, and manufacturing method of the same SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 2004-12-30 US claimed
US-20040001970-A1 Organic electroluminescent materials and devices made from such materials TSINGHUA UNIVERSITY (CN) 2004-01-01 US claimed
EP-0700917-A2 New organometallic complexes for use in light emitting devices MOTOROLA, INC. (US) 1996-03-13 EP claimed
EP-0296752-B1 ENHANCED CHEMILUMINESCENT REACTION AND DIAGNOSTIC ASSAY BTG INTERNATIONAL LIMITED (GB) 1992-03-25 EP claimed
US-5043266-A Immunoassay, reaction between a dihydrophthalazinedione (luminol) and hydrogen peroxide, peroxidase enzyme NATIONAL RESEARCH DEVELOPMENT CORPORATION (GB) 1991-08-27 US claimed
EP-0296752-A1 Enhanced chemiluminescent reaction and diagnostic assay BTG INTERNATIONAL LIMITED (GB) 1988-12-28 EP claimed
US-4707297-A Removable guidepath for automated guidance vehicles BELL & HOWELL COMPANY (US) 1987-11-17 US claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L F7 2043/4885RAB9A 4543/4885NPC1 4813/4885
US-20040265253-A1 Organic-inorganic hybrid material, composition for synthesizing the same, and manufacturing method of the same CAD, ILK, AOC1 F7 646/4885RAB9A 3430/4885NPC1 4798/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.