Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | P2RX7 | Q99572 | 1/20 | 0.34 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.33 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.32 |
| ▸ | CETP | P11597 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5347783 | 0.87 | P2RX7 (0.35) | P2RX7CYP2D6CYP2C19CETP | |
| SCHEMBL17147582 | 0.84 | P2RX7 (0.34) | P2RX7CYP2D6CYP2C19CETP | |
| SCHEMBL10175353 | 0.82 | USP2 (0.33) | P2RX7CYP2C19 | |
| SCHEMBL200228 | 0.82 | CYP2C19 (0.40) | P2RX7CYP2D6CYP2C19CETP | |
| SCHEMBL203304 | 0.81 | P2RX7 (0.36) | P2RX7CYP2D6CYP2C19CETP | |
| SCHEMBL13744776 | 0.80 | HTT (0.32) | CYP2D6CYP2C19HTT | |
| SCHEMBL201163 | 0.79 | CYP2D6 (0.38) | P2RX7CYP2D6CYP2C19CETP | |
| SCHEMBL14628487 | 0.79 | P2RX7 (0.36) | P2RX7CYP2D6CYP2C19CETP | |
| SCHEMBL4253408 | 0.79 | P2RX7 (0.36) | P2RX7CYP2D6CYP2C19CETP | |
| SCHEMBL472017 | 0.79 | P2RX7 (0.34) | P2RX7CYP2D6CYP2C19CETP |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114402258-A | Radiation-sensitive resin composition | 日本瑞翁株式会社 | 2022-04-26 | — | — | CN | disclosed |
| US-11169440-B2 | Radiation-sensitive resin composition and electronic component | ZEON CORPORATION (JP) | 2021-11-09 | — | — | US | disclosed |
| EP-3345970-B1 | RESIN COMPOSITION | ZEON CORP (JP) | 2021-07-28 | — | — | EP | disclosed |
| EP-3434731-B1 | RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE | ZEON CORP (JP) | 2021-06-09 | — | — | EP | disclosed |
| US-10775697-B2 | Radiation-sensitive resin composition, resin film, and electronic device | ZEON CORPORATION (JP) | 2020-09-15 | — | — | US | disclosed |
| US-10622527-B2 | Infrared LED | ZEON CORPORATION (JP) | 2020-04-14 | — | — | US | disclosed |
| US-10446690-B2 | Method of production of semiconductor device | TOHOKU UNIVERSITY (JP) | 2019-10-15 | — | — | US | disclosed |
| EP-3121652-B1 | RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT | ZEON CORP (JP) | 2019-09-04 | — | — | EP | disclosed |
| US-20190221729-A1 | INFRARED LED | ZEON CORPORATION (JP) | 2019-07-18 | — | — | US | disclosed |
| EP-3486957-A1 | INFRARED LED | Zeon Corporation (JP) | 2019-05-22 | — | — | EP | disclosed |
| US-20040106740-A1 | Resin film and applications thereof | JSR CORPORATION (JP) | 2004-06-03 | — | — | US | disclosed |
| EP-1416528-A2 | Method of forming cavity between multilayered wirings | JSR Corporation (JP) | 2004-05-06 | — | — | EP | disclosed |
| US-20040072094-A1 | Radiation sensitive resin composition | JSR CORPORATION (JP) | 2004-04-15 | — | — | US | disclosed |
| EP-1195397-B1 | Composition of cyclic olefin addition copolymer and cross-linked material | JSR CORP (JP) | 2004-04-14 | — | — | EP | disclosed |
| US-6623907-B2 | Chemical amplified photoresist | JSR CORPORATION (JP) | 2003-09-23 | — | — | US | disclosed |
| CN-1347939-A | Cycloolefen addition copolymer composition and cross-linked material | JSR CORP (JP) | 2002-05-08 | — | — | CN | disclosed |
| US-20020042461-A1 | Composition of cyclic olefin addition copolymer and cross-linked material | JSR CORPORATION (JP) | 2002-04-11 | — | — | US | disclosed |
| EP-1195397-A1 | Composition of cyclic olefin addition copolymer and cross-linked material | JSR Corporation (JP) | 2002-04-10 | — | — | EP | disclosed |
| US-20010023050-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2001-09-20 | — | — | US | disclosed |
| EP-1122605-A2 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |