SCHEMBL4811317

SCHEMBL4811317

CCOC(=O)CCCCCCCC(Br)C(Br)CC(Br)C(Br)CC(Br)C(Br)CC

nearest known ligand 0.45

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 3/20 0.45
CYP3A4 P08684 2/20 0.45
TSHR P16473 2/20 0.45
ATM Q13315 1/20 0.45
CYP1A2 P05177 1/20 0.44
KMT2A Q03164 2/20 0.44
ALDH1A1 P00352 3/20 0.42
ALOX15 P16050 2/20 0.42
HSD17B10 Q99714 1/20 0.42
DGKA P23743 1/20 0.41
GAA P10253 1/20 0.40
ZDHHC7 Q9NXF8 1/20 0.40
ENPP2 Q13822 3/20 0.40
TRPV1 Q8NER1 1/20 0.40
MAPT P10636 1/20 0.39
POLB P06746 1/20 0.39
USP2 O75604 1/20 0.38
LMNA P02545 1/20 0.38
PAM P19021 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4807413 0.90 DGKA (0.53) TDP1CYP3A4TSHRATMKMT2A
SCHEMBL11274184 0.87 DGKA (0.56) TDP1CYP3A4TSHRATMKMT2A
SCHEMBL4804388 0.85 L3MBTL1 (0.48) TDP1CYP3A4TSHRATMKMT2A
SCHEMBL8103969 0.81 TDP1 (0.49) TDP1CYP3A4TSHRATMCYP1A2
SCHEMBL15009773 0.80 CYP1A2 (0.50) TDP1CYP3A4TSHRATMCYP1A2
SCHEMBL10578789 0.80 CYP1A2 (0.50) TDP1CYP3A4TSHRATMCYP1A2
SCHEMBL2715956 0.80 CYP1A2 (0.50) TDP1CYP3A4TSHRATMCYP1A2
SCHEMBL4806898 0.80 FFAR4 (0.50) TDP1TSHRKMT2AALDH1A1ALOX15
SCHEMBL10937797 0.78 ALDH1A1 (0.48) TSHRALDH1A1ZDHHC7
SCHEMBL9489696 0.78 ZDHHC7 (0.51) TDP1CYP3A4TSHRATMCYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7357291-B2 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2008-04-15 US disclosed
US-20060071051-A1 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2006-04-06 US disclosed
US-6881278-B2 Flux for solder paste SHOWA DENKO K.K. (JP) 2005-04-19 US disclosed
US-20030200836-A1 Flux for solder paste SHOWA DENKO K.K. 2003-10-30 US disclosed
WO-2003064102-A1 SOLDER METAL, SOLDERING FLUX AND SOLDER PASTE SHOWA DENKO K.K. (JP) 2003-08-07 WO disclosed
US-20020046627-A1 Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product SHOWA DENKO K.K. (JP) 2002-04-25 US disclosed
US-20010042779-A1 Solder paste SHOWA DENKO KABUSHIKI KAISHA (JP) 2001-11-22 US disclosed