SCHEMBL4809286

SCHEMBL4809286

CCCCCC(Br)C(Br)CC(Br)C(Br)CCCCCCCC(=O)OC

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ZDHHC7 Q9NXF8 1/20 0.57
PPARG P37231 2/20 0.48
L3MBTL1 Q9Y468 1/20 0.48
LMNA P02545 2/20 0.47
POLB P06746 1/20 0.46
POLA1 P09884 1/20 0.46
DGKA P23743 1/20 0.46
TSHR P16473 1/20 0.45
PPARA Q07869 1/20 0.45
MAPT P10636 2/20 0.45
MAPK1 P28482 1/20 0.45
LCK P06239 1/20 0.44
PPARD Q03181 1/20 0.44
ZDHHC20 Q5W0Z9 1/20 0.44
ZDHHC2 Q9UIJ5 1/20 0.44
CA12 O43570 1/20 0.44
CA2 P00918 1/20 0.44
CA7 P43166 1/20 0.44
CA9 Q16790 1/20 0.44
CA14 Q9ULX7 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4804388 0.90 L3MBTL1 (0.48) ZDHHC7PPARGL3MBTL1LMNAPOLB
SCHEMBL5052870 0.90 ZDHHC7 (0.57) ZDHHC7PPARGL3MBTL1LMNAPOLB
SCHEMBL11456570 0.86 ZDHHC7 (0.56) ZDHHC7PPARGL3MBTL1LMNAPOLB
SCHEMBL9860092 0.86 ZDHHC7 (0.56) ZDHHC7PPARGL3MBTL1LMNAPOLB
SCHEMBL4807413 0.85 DGKA (0.53) ZDHHC7LMNADGKATSHRMAPT
SCHEMBL10622929 0.84 ZDHHC7 (0.53) ZDHHC7LMNADGKATSHRMAPT
SCHEMBL10622921 0.84 ZDHHC7 (0.53) ZDHHC7LMNADGKATSHRMAPT
SCHEMBL2834294 0.84 ZDHHC7 (0.50) ZDHHC7PPARGL3MBTL1LMNAPOLB
SCHEMBL18124155 0.83 ZDHHC7 (0.51) ZDHHC7PPARGL3MBTL1LMNAPOLB
SCHEMBL14947261 0.82 LMNA (0.53) ZDHHC7PPARGL3MBTL1LMNAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108349049-A Soldering paste water-soluble flux and soldering paste 三菱综合材料株式会社 2018-07-31 CN disclosed
CN-104349865-A Solder paste MITSUBISHI MATERIALS CORP 2015-02-11 CN disclosed
US-7357291-B2 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2008-04-15 US disclosed
US-20060071051-A1 Solder metal, soldering flux and solder paste SHOWA DENKO K.K. (JP) 2006-04-06 US disclosed
CN-1211183-C Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method SHOWA DENKO KK (JP) 2005-07-20 CN disclosed
US-6881278-B2 Flux for solder paste SHOWA DENKO K.K. (JP) 2005-04-19 US disclosed
US-20030200836-A1 Flux for solder paste SHOWA DENKO K.K. 2003-10-30 US disclosed
CN-1358123-A Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method SHOWA DENKO KK (JP) 2002-07-10 CN disclosed
US-20020046627-A1 Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product SHOWA DENKO K.K. (JP) 2002-04-25 US disclosed
US-20010042779-A1 Solder paste SHOWA DENKO KABUSHIKI KAISHA (JP) 2001-11-22 US disclosed