SCHEMBL483355

SCHEMBL483355

O=C(Nc1ccc(F)c([Ti](C2=CC=CC2)(C2=CC=CC2)c2c(F)ccc(NC(=O)c3ccccc3CCCc3ccccc3)c2F)c1F)c1ccccc1CCCc1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.39
ADRB2 P07550 1/20 0.39
HTT P42858 1/20 0.39
SLC16A3 O15427 7/20 0.39
LMNA P02545 2/20 0.39
KDM4E B2RXH2 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
OPRL1 P41146 1/20 0.38
NPC1 O15118 1/20 0.35
POLB P06746 1/20 0.34
RAB9A P51151 1/20 0.34
SLC6A5 Q9Y345 1/20 0.34
TP53 P04637 1/20 0.34
MAPT P10636 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL483000 0.90 ALDH1A1 (0.36) ALDH1A1ADRB2HTTSLC16A3LMNA
SCHEMBL483287 0.87 L3MBTL1 (0.35) ALDH1A1HTTSLC16A3LMNAKDM4E
SCHEMBL267592 0.84 PTPN1 (0.36) HTTSLC16A3LMNANPC1RAB9A
SCHEMBL482975 0.84 TP53 (0.34) ALDH1A1HTTLMNASMN1; SMN2NPC1
SCHEMBL266307 0.84 PTPN1 (0.36) HTTSLC16A3LMNANPC1RAB9A
SCHEMBL482956 0.82 RAB9A (0.53) ALDH1A1HTTLMNAKDM4ESMN1; SMN2
SCHEMBL5198749 0.81 SLC16A3 (0.37) SLC16A3RAB9A
SCHEMBL268803 0.81 HPGD (0.44) ALDH1A1SLC16A3LMNAKDM4ESMN1; SMN2
SCHEMBL483289 0.81 RECQL (0.39) ALDH1A1HTTLMNASMN1; SMN2NPC1
SCHEMBL482491 0.80 RAB9A (0.44) ALDH1A1HTTSMN1; SMN2NPC1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210197447-A1 Method for Making an Object PHOTOCENTRIC LIMITED (GB) 2021-07-01 US disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 EP disclosed
EP-1249731-A2 Photosensitive composition and negative working lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2002-10-16 EP disclosed
EP-1238801-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2002-09-11 EP disclosed
EP-0860741-B1 Photopolymerizable composition FUJI PHOTO FILM CO LTD (JP) 2001-05-16 EP disclosed
EP-1091247-A2 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 2001-04-11 EP disclosed
US-6153660-A VERY HIGH SENSITIVITY TO BEAMS IN THE VISIBLE REGION, PARTICULARLY TO VISIBLE RAYS AT 400 NM OR MORE SUCH AS RAYS AT 488 NM OR 532 NM CORRESPONDING TO THE OUTPUT OF AR+ LASER OR YAG-SHG LASER FUJI PHOTO FILM CO., LTD. (JP) 2000-11-28 US disclosed
US-6051367-A COMPRISING ONE OR MORE ADDITION-POLYMERIZABLE ETHYLENICALLY UNSATURATED COMPOUNDS AND A SPECIFIC OXIME ETHER COMPOUND; HIGH SENSITIVE TO ACTINIC RAYS RANGING FROM ULTRAVIOLET TO VISIBLE LIGHT, IMPROVED FILM STRENGTH FUJI PHOTO FILM CO., LTD. (JP) 2000-04-18 US disclosed
EP-0949540-A1 Method for producing lithographic printing plate suitable for laser scan exposure, and photopolymerizable composition FUJI PHOTO FILM CO., LTD (JP) 1999-10-13 EP disclosed
EP-0924570-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1999-06-23 EP disclosed
EP-0860741-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-08-26 EP disclosed
US-5026625-A Photoinitiators for polymerization of ethylenically unsaturated compounds CIBA-GEIGY CORPORATION (US) 1991-06-25 US disclosed