Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 15/20 | 0.48 |
| ▸ | FAAH | O00519 | 6/20 | 0.48 |
| ▸ | HSP90AA1 | P07900 | 6/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.38 |
| ▸ | PKM | P14618 | 3/20 | 0.38 |
| ▸ | HTT | P42858 | 2/20 | 0.38 |
| ▸ | ATM | Q13315 | 2/20 | 0.38 |
| ▸ | LMNA | P02545 | 2/20 | 0.38 |
| ▸ | CCR6 | P51684 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.33 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.33 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.33 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30540113 | 0.88 | MGLL (0.49) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL486519 | 0.88 | MGLL (0.49) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL10382629 | 0.82 | — | — | |
| SCHEMBL10440247 | 0.79 | LTA4H (0.37) | LMNA | |
| SCHEMBL1119476 | 0.79 | MAOA (0.37) | ALDH1A1LMNAMEN1KMT2ATDP1 | |
| SCHEMBL8432977 | 0.76 | GRM5 (0.45) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL27928060 | 0.76 | HTT (0.40) | FAAHALDH1A1HTTATMLMNA | |
| SCHEMBL9716877 | 0.72 | POLB (0.40) | ALDH1A1TDP1 | |
| SCHEMBL1119438 | 0.72 | MAOB (0.38) | ALDH1A1ATMLMNAMEN1HPGD | |
| SCHEMBL29720375 | 0.70 | MAOB (0.41) | HSP90AA1ALDH1A1ATMLMNAMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260071011-A1 | COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2026-03-12 | — | — | US | disclosed |
| US-20250326929-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-10-23 | — | — | US | disclosed |
| US-20250287499-A1 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2025-09-11 | — | — | US | disclosed |
| US-20250188263-A1 | RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-06-12 | — | — | US | disclosed |
| WO-2025105440-A1 | CURABLE COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND MOLDED ARTICLE | 株式会社レゾナック | 2025-05-22 | — | — | WO | disclosed |
| WO-2025105439-A1 | CURABLE COMPOSITION FOR PREPREG, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2025-05-22 | — | — | WO | disclosed |
| EP-4527860-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | Resonac Corporation (JP) | 2025-03-26 | — | — | EP | disclosed |
| WO-2025033356-A1 | ADHESIVE FILM, ADHESIVE FILM WITH METAL LAYER, MEMBER FOR WIRING FORMATION, METHOD FOR FORMING WIRING LAYER, AND WIRING FORMING MEMBER | 株式会社レゾナック | 2025-02-13 | — | — | WO | disclosed |
| WO-2025033357-A1 | ADHESIVE FILM, ADHESIVE FILM WITH METAL LAYER, WIRING FORMATION MEMBER, FORMATION METHOD FOR WIRING LAYER, AND WIRED MEMBER | 株式会社レゾナック | 2025-02-13 | — | — | WO | disclosed |
| EP-4488336-A1 | RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Resonac Corporation (JP) | 2025-01-08 | — | — | EP | disclosed |
| EP-2412743-B1 | THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME | HITACHI CHEMICAL CO LTD (JP) | 2020-08-19 | — | — | EP | disclosed |
| US-20190169432-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATED BOARD, PRINTED WIRING BOARD, AND HIGH-SPEED COMMUNICATION-COMPATIBLE MODULE | RESONAC CORPORATION (JP) | 2019-06-06 | — | — | US | disclosed |
| EP-3467038-A1 | THERMOSETTING RESIN COMPOSITIN, PREPREG, LAMINATED BOARD, PRINTED WIRING BOARD, AND HIGH-SPEED COMMUNICATION-COMPATIBLE MODULE | Hitachi Chemical Company, Ltd. (JP) | 2019-04-10 | — | — | EP | disclosed |
| US-10119047-B2 | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-11-06 | — | — | US | disclosed |
| US-20150203715-A1 | Thermosetting Resin Composition, and Prepreg, Insulating Film With Support, Laminate Plate, and Printed Wiring Board, Each Obtained Using Same | RESONAC CORPORATION (JP) | 2015-07-23 | — | — | US | disclosed |
| US-8735733-B2 | Resin composition, prepreg laminate obtained with the same and printed-wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-05-27 | — | — | US | disclosed |
| EP-2666825-A1 | RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND PREPREG USING SAME | Hitachi Chemical Co., Ltd. (JP) | 2013-11-27 | — | — | EP | disclosed |
| US-20120247820-A1 | RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD | RESONAC CORPORATION (JP) | 2012-10-04 | — | — | US | disclosed |
| US-20120077401-A1 | RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-29 | — | — | US | disclosed |
| EP-2412743-A1 | THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME | Hitachi Chemical Company, Ltd. (JP) | 2012-02-01 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260071011-A1 | COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | CD79B, C1R, TGFBR1 | MGLL 3867/4885FAAH 4069/4885HSP90AA1 3849/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.