SCHEMBL5033447

SCHEMBL5033447

C=Cc1ccc(-c2ccc(CCC)cc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 3/20 0.47
ALDH1A1 P00352 2/20 0.46
MCL1 Q07820 1/20 0.41
LPL P06858 1/20 0.41
LIPG Q9Y5X9 1/20 0.41
NISCH Q9Y2I1 1/20 0.40
HRH3 Q9Y5N1 1/20 0.39
MAPT P10636 2/20 0.39
NPC1 O15118 1/20 0.39
RAB9A P51151 1/20 0.39
GFER P55789 1/20 0.39
CA2 P00918 1/20 0.38
RARB P10826 2/20 0.38
KDM4E B2RXH2 1/20 0.38
MITF O75030 1/20 0.38
HPGD P15428 1/20 0.38
KLF5 Q13887 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
MEN1 O00255 1/20 0.37
TP53 P04637 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL52038 0.94 ALDH1A1 (0.52) THRBALDH1A1LPLLIPGCA2
SCHEMBL13196413 0.85 ALDH1A1 (0.38) THRBALDH1A1MCL1LPLLIPG
SCHEMBL21549782 0.85 HSD17B10 (0.56) THRBALDH1A1HRH3MAPTRAB9A
SCHEMBL17230051 0.83 RARB (0.43) THRBMCL1MAPTNPC1RAB9A
SCHEMBL24799855 0.83 RARB (0.43) THRBMCL1MAPTNPC1RAB9A
SCHEMBL4526640 0.83 ALDH1A1 (0.50) THRBALDH1A1MAPTCA2HPGD
SCHEMBL29113622 0.82 ACACB (0.44) THRBALDH1A1LPLLIPGCA2
SCHEMBL5034588 0.82 PTGS2 (0.49) THRBMCL1MAPTNPC1RAB9A
SCHEMBL29434161 0.82 PTGS2 (0.49) THRBMCL1MAPTNPC1RAB9A
SCHEMBL5034608 0.82 BCL2 (0.41) ALDH1A1MCL1LIPGTP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118179615-A Preparation method of modified cation exchange resin for caprolactam purification 衢州巨化锦纶有限责任公司 2024-06-14 CN claimed
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof NOTARK CORPORATION (US) 2026-02-10 US disclosed
US-20260035495-A1 FUNCTIONAL COPOLYMERS AND METHODS OF PREPARATION THEREOF Kraton Corporation (US) 2026-02-05 US disclosed
US-20250367910-A1 LAMINATES BASED ON COPOLYMERS OF DIISOALKENYLARENES NOTARK CORPORATION (US) 2025-12-04 US disclosed
US-12447719-B2 Metal-clad laminate, wiring board, resin-including metal foil, and resin composition PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-10-21 US disclosed
US-12312452-B2 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-05-27 US disclosed
US-12233621-B2 Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foil PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-02-25 US disclosed
WO-2024219272-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME 日本化薬株式会社 2024-10-24 WO disclosed
US-12109779-B2 Copper-clad laminate, wiring board, and copper foil with resin PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2024-10-08 US disclosed
US-11242425-B2 Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2022-02-08 US disclosed
US-20210246251-A1 RESIN COMPOSITION, PREPREG, RESIN-ADDED FILM, RESIN-ADDED METAL FOIL, METAL-CLAD LAYERED PLATE, AND WIRING PLATE PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2021-08-12 US disclosed
WO-2021079819-A1 COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN パナソニックIPマネジメント株式会社 2021-04-29 WO disclosed
WO-2021079817-A1 METAL CLAD LAMINATE, WIRING BOARD, RESIN-INCLUDING METAL FOIL, AND RESIN COMPOSITION パナソニックIPマネジメント株式会社 2021-04-29 WO disclosed
WO-2021060178-A1 RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-04-01 WO disclosed
WO-2021024923-A1 RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD パナソニックIPマネジメント株式会社 2021-02-11 WO disclosed
WO-2020230870-A1 COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SUBSTRATE USING SAID PLATE AND FOIL パナソニックIPマネジメント株式会社 2020-11-19 WO disclosed
WO-2020196759-A1 PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD パナソニックIPマネジメント株式会社 2020-10-01 WO disclosed
US-7402645-B2 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2008-07-22 US disclosed
US-20070155923-A1 Soluble polyfunctional vinyl aromatic polymer and method of producing the same NIPPON STEEL CHEMICAL CO., LTD. (JP) 2007-07-05 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260035495-A1 FUNCTIONAL COPOLYMERS AND METHODS OF PREPARATION THEREOF VCL, FGB, CDH1 THRB 491/4885ALDH1A1 303/4885MCL1 2913/4885
US-20260109853-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT OF SAME PSMA1, PSMB10, RAD51 THRB 4026/4885ALDH1A1 438/4885MCL1 3442/4885
US-12545780-B2 Flexible metal clad laminates and methods of preparation thereof DSG1, CDH1, CAD THRB 4061/4885ALDH1A1 480/4885MCL1 1331/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.