Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.40 |
| ▸ | ACHE | P22303 | 2/20 | 0.40 |
| ▸ | LMNA | P02545 | 2/20 | 0.40 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.40 |
| ▸ | HPGD | P15428 | 4/20 | 0.35 |
| ▸ | NPC1 | O15118 | 5/20 | 0.34 |
| ▸ | RAB9A | P51151 | 5/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.34 |
| ▸ | NFKB1 | P19838 | 2/20 | 0.34 |
| ▸ | NFKB2 | Q00653 | 2/20 | 0.34 |
| ▸ | RELA | Q04206 | 2/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.34 |
| ▸ | POLB | P06746 | 1/20 | 0.34 |
| ▸ | CES2 | O00748 | 1/20 | 0.33 |
| ▸ | CES1 | P23141 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 3/20 | 0.32 |
| ▸ | MEN1 | O00255 | 3/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.32 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.32 |
| ▸ | HKDC1 | Q2TB90 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetraphenylphosphonium SCHEMBL503790 | 0.98 | TSHR (0.42) | TSHRACHELMNAALOX12HPGD | |
| Tetraphenylphosphonium SCHEMBL23455574 | 0.96 | TSHR (0.40) | TSHRACHELMNAALOX12HPGD | |
| Tetraphenylphosphonium SCHEMBL31277980 | 0.96 | TSHR (0.40) | TSHRACHELMNAALOX12HPGD | |
| SCHEMBL4387940 | 0.94 | TSHR (0.42) | TSHRACHELMNAALOX12HPGD | |
| SCHEMBL29404005 | 0.87 | ACHE (0.53) | TSHRACHELMNAALOX12HPGD | |
| Hydrochloric Acid SCHEMBL7058630 | 0.84 | ACHE (0.50) | TSHRACHELMNAALOX12HPGD | |
| Bromide SCHEMBL7063570 | 0.84 | ACHE (0.50) | TSHRACHELMNAALOX12HPGD | |
| Iodide SCHEMBL7065210 | 0.84 | LMNA (0.50) | TSHRACHELMNAALOX12HPGD | |
| SCHEMBL7065118 | 0.83 | ACHE (0.43) | TSHRACHELMNAALOX12HPGD | |
| SCHEMBL5909841 | 0.82 | ACHE (0.53) | TSHRACHELMNAALOX12HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260098122-A1 | HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-09 | — | — | US | disclosed |
| EP-4700060-A1 | HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-02-25 | — | — | EP | disclosed |
| EP-4682185-A1 | THERMOSETTING BISCITRACONIMIDE RESIN COMPOSITION | Shin-Etsu Chemical Co., Ltd. (JP) | 2026-01-21 | — | — | EP | disclosed |
| US-20260015462-A1 | THERMOSETTING BISCITRACONIMIDE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-01-15 | — | — | US | disclosed |
| EP-4679461-A2 | RESIN COMPOSITION AND PRODUCTION METHOD OF THE SAME | AJINOMOTO CO., INC. (JP) | 2026-01-14 | — | — | EP | disclosed |
| US-20250388747-A1 | EPOXY RESIN COMPOSITION | SHINETSU CHEMICAL CO (JP) | 2025-12-25 | — | — | US | disclosed |
| EP-4667522-A1 | EPOXY RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-12-24 | — | — | EP | disclosed |
| US-20250382409-A1 | THERMOSETTING RESIN COMPOSITION AND USE THEREOF | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-12-18 | — | — | US | disclosed |
| EP-4663679-A1 | THERMOSETTING RESIN COMPOSITION AND USE THEREOF | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-17 | — | — | EP | disclosed |
| US-12378450-B2 | Adhesive for endoscope and cured product thereof, and endoscope and method for producing the same | FUJIFILM CORPORATION (JP) | 2025-08-05 | — | — | US | disclosed |
| US-20090141472-A1 | Adhesive composition for die bonding in semiconductor assembly, adhesive film prepared therefrom, device including the same, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-06-04 | — | — | US | disclosed |
| US-20090136748-A1 | Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-05-28 | — | — | US | disclosed |
| US-20090110940-A1 | Adhesive film composition, associated dicing die bonding film, die package, and associated methods | CHEIL INDUSTRIES, INC. (KR) | 2009-04-30 | — | — | US | disclosed |
| US-20070160935-A1 | Lithographic printing plate material for CTP | NIPPON PAINT CO., LTD. (JP) | 2007-07-12 | — | — | US | disclosed |
| US-20070099115-A1 | Photosensitive resin composition, image forming material and image forming method using thereof | NIPPON PAINT CO., LTD. (JP) | 2007-05-03 | — | — | US | disclosed |
| US-20070059637-A1 | Photosensitive resin composition | NIPPON PAINT CO., LTD. (JP) | 2007-03-15 | — | — | US | disclosed |
| US-20070059638-A1 | Photosensitive resin composition | NIPPON PAINT CO., LTD. (JP) | 2007-03-15 | — | — | US | disclosed |
| US-20060204819-A1 | Conductive epoxy resin composition and separator for fuel cell | NICHIAS CORPORATION (JP) | 2006-09-14 | — | — | US | disclosed |
| EP-1701400-A1 | Conductive epoxy resin composition and separator for fuel cell | NICHIAS CORPORATION (JP) | 2006-09-13 | — | — | EP | disclosed |
| JP-2005075955-A | CURING ACCELERATOR FOR EPOXY RESIN AND EPOXY RESIN COMPOSITION | HOKKO CHEM IND CO LTD | 2005-03-24 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20250388747-A1 | EPOXY RESIN COMPOSITION | EED, ELL, EPCAM | TSHR 4717/4885ACHE 2654/4885LMNA 2202/4885 |
| US-20260098122-A1 | HEAT-CURABLE RESIN COMPOSITION AND USES THEREOF | SEM1, EEF1A1, HEATR1 | TSHR 3989/4885ACHE 2890/4885LMNA 2938/4885 |
| US-20260015462-A1 | THERMOSETTING BISCITRACONIMIDE RESIN COMPOSITION | GABRE, MECP2, FHIT | TSHR 3582/4885ACHE 2584/4885LMNA 1133/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.