Known targets — ChEMBL curated mechanism
ABCC9ABL1ACEACHEACVR1ADORA1ADORA2AADORA2BADORA3ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3AGTR1ALOX5ATP4AATP4BBCRBTKCACNA1ACACNA1BCACNA1CCACNA1DCACNA1ECACNA1FCACNA1GCACNA1HCACNA1ICACNA1SCACNA2D1CACNA2D2CACNA2D3CACNA2D4CACNB1CACNB2CACNB3CACNB4CACNG1CACNG2CACNG3CACNG4CACNG5CACNG6CACNG7CACNG8CALCRLCFBCHRM1CHRM2CHRM3CHRM4CHRM5CHRNA1CHRNB1CHRNDCHRNECHRNGCRBNCUL4ACXCR1CXCR2DDB1DDCDHFRDPP4DRD2DRD3DRD4EGFRERBB2ERBB4ESR1ESR2FDPSFKBP1AFLT1FLT3FLT4GARTGHSRGRIA1GRIA2GRIA3GRIA4GRIK1GRIK2GRIK3GRIK4GRIK5GRIN2AGSK3AGSK3BHDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HTR1AHTR1BHTR1DHTR1EHTR1FHTR2AHTR2BHTR2CHTR3AHTR3BHTR3CHTR3DHTR3EHTR4HTR5AHTR6HTR7IDH1IDH2IMPA1ITGA2BITGB3JAK1JAK2JAK3KCNJ11KCNK3KCNK9KDRKITMEN1METMMP1MMP13MMP7MMP8NANOD2NS5bODC1OPG057OPRD1OPRK1OPRM1PPARP1PARP2PDE3APDE3BPDE4APDE4BPDE4CPDE4DPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PKLRPPARDPPATPTGS1PTGS2RBX1ROCK1ROCK2RRM1RRM2RRM2BSCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASCNN1ASCNN1BSCNN1GSIGMAR1SLC10A2SLC5A2SLC6A2SLC6A3SLC6A4SLC9A3SYKTACR1THRATHRBTOP1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYK2TYMSVDRampCblablaT-3blaT-4blaT-5blaT-6blaUOE-1dacAdacBdacCfolAfolPftsIgyrAgyrBileSmecAmrcAmrcBmrdAparCparEpbp2pbp4pbpApbpFrplArplBrplCrplDrplErplFrplIrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmE2rpmFrpmGrpmG1rpmG2rpmG3rpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUthyAykgMykgO
The experimentally established mechanism targets of Hydrogen Peroxide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Peroxide SCHEMBL8922301 | 1.00 | — | — | |
| Hydrogen Peroxide SCHEMBL504059 | 1.00 | — | — | |
| Hydrogen Peroxide SCHEMBL5406876 | 0.89 | — | — | |
| Hydrogen Peroxide SCHEMBL901646 | 0.87 | — | — | |
| Hydrogen Peroxide SCHEMBL2254311 | 0.87 | CA1 (0.33) | — | |
| Hydrogen Peroxide SCHEMBL36641 | 0.87 | — | — | |
| Hydrogen Peroxide SCHEMBL2254309 | 0.87 | — | — | |
| Hydrogen Peroxide SCHEMBL137725 | 0.87 | — | — | |
| Hydrogen Peroxide SCHEMBL21065417 | 0.87 | — | — | |
| Hydrogen Peroxide SCHEMBL832812 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 261 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11587875-B2 | Connecting structure and method for forming the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2023-02-21 | — | — | US | claimed |
| US-20220051982-A1 | CONNECTING STRUCTURE AND METHOD FOR FORMING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2022-02-17 | — | — | US | claimed |
| CN-109713057-A | A kind of polysilicon wet-method texturing manufacturing process | 武汉风帆电化科技股份有限公司 | 2019-05-03 | — | — | CN | claimed |
| CN-105895510-B | Method for forming semiconductor device and patterning method | 台湾积体电路制造股份有限公司 | 2019-04-12 | — | — | CN | claimed |
| CN-108417650-A | A kind of amorphous silicon membrane improving solar cell photoelectric transformation efficiency | 芜湖孺子牛节能环保技术研发有限公司 | 2018-08-17 | — | — | CN | claimed |
| US-9472414-B2 | Self-aligned multiple spacer patterning process | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2016-10-18 | — | — | US | claimed |
| US-20160240386-A1 | Self-Aligned Multiple Spacer Patterning Process | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2016-08-18 | — | — | US | claimed |
| US-20070045227-A1 | METHOD OF STRIPPING PHOTORESIST | UNITED MICROELECTRONICS CORP. (TW) | 2007-03-01 | — | — | US | claimed |
| US-6725119-B1 | Cleaning-apparatus line configuration and designing process therefor | NEC ELECTRONICS CORPORATION (JP) | 2004-04-20 | — | — | US | claimed |
| US-5308400-A | Room temperature wafer cleaning process | UNITED MICROELECTRONICS CORPORATION (TW) | 1994-05-03 | — | — | US | claimed |
| US-12027624-B2 | Semiconductor devices and methods of manufacturing thereof | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2024-07-02 | — | — | US | disclosed |
| US-20240194749-A1 | SEMICONDUCTOR DEVICES | TAIWAN SEMICONDUCTOR MFG CO LTD (TW) | 2024-06-13 | — | — | US | disclosed |
| US-11990509-B2 | Semiconductor devices having gate structures with slanted sidewalls | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2024-05-21 | — | — | US | disclosed |
| US-11984402-B2 | Semiconductor device and method | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2024-05-14 | — | — | US | disclosed |
| CN-117981054-A | Substrate processing module and substrate processing apparatus provided with same | 大金优科股份有限公司 | 2024-05-03 | — | — | CN | disclosed |
| US-5089441-A | Low-temperature in-situ dry cleaning process for semiconductor wafers | TEXAS INSTRUMENTS INCORPORATED (US) | 1992-02-18 | — | — | US | disclosed |
| US-4567645-A | Method for forming a buried subcollector in a semiconductor substrate by ion implantation | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 1986-02-04 | — | — | US | disclosed |
| US-4396457-A | POSITIONING COPPER OR ALUMINUM FOIL, PUNCHING, ETHCING, BONDING TO SEMICONDUCTOR | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1983-08-02 | — | — | US | disclosed |
| US-4366824-A | PRETREATMENT WITH OZONE, CONTACTING WITH AN ALKALINE HYDROGEN PEROXIDE SOLUTION | PHILIP MORRIS INCORPORATED (US) | 1983-01-04 | — | — | US | disclosed |
| US-4366823-A | TREATMENT OF STEMS WITH A POLYVALENT SALT AND AN ALKALINE HYDROGEN PEROXIDE SOLUTION | PHILIP MORRIS, INCORPORATED (US) | 1983-01-04 | — | — | US | disclosed |