Known targets — ChEMBL curated mechanism
ABCC9ABL1ACEACHEACVR1ADORA1ADORA2AADORA2BADORA3ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3AGTR1ALOX5ATP4AATP4BBCRBTKCACNA1ACACNA1BCACNA1CCACNA1DCACNA1ECACNA1FCACNA1GCACNA1HCACNA1ICACNA1SCACNA2D1CACNA2D2CACNA2D3CACNA2D4CACNB1CACNB2CACNB3CACNB4CACNG1CACNG2CACNG3CACNG4CACNG5CACNG6CACNG7CACNG8CALCRLCFBCHRM1CHRM2CHRM3CHRM4CHRM5CHRNA1CHRNB1CHRNDCHRNECHRNGCRBNCUL4ACXCR1CXCR2DDB1DDCDHFRDPP4DRD2DRD3DRD4EGFRERBB2ERBB4ESR1ESR2FDPSFKBP1AFLT1FLT3FLT4GARTGHSRGRIA1GRIA2GRIA3GRIA4GRIK1GRIK2GRIK3GRIK4GRIK5GRIN2AGSK3AGSK3BHDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HTR1AHTR1BHTR1DHTR1EHTR1FHTR2AHTR2BHTR2CHTR3AHTR3BHTR3CHTR3DHTR3EHTR4HTR5AHTR6HTR7IDH1IDH2IMPA1ITGA2BITGB3JAK1JAK2JAK3KCNJ11KCNK3KCNK9KDRKITMEN1METMMP1MMP13MMP7MMP8NANOD2NS5bODC1OPG057OPRD1OPRK1OPRM1PPARP1PARP2PDE3APDE3BPDE4APDE4BPDE4CPDE4DPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PKLRPPARDPPATPTGS1PTGS2RBX1ROCK1ROCK2RRM1RRM2RRM2BSCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASCNN1ASCNN1BSCNN1GSIGMAR1SLC10A2SLC5A2SLC6A2SLC6A3SLC6A4SLC9A3SYKTACR1THRATHRBTOP1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYK2TYMSVDRampCblablaT-3blaT-4blaT-5blaT-6blaUOE-1dacAdacBdacCfolAfolPftsIgyrAgyrBileSmecAmrcAmrcBmrdAparCparEpbp2pbp4pbpApbpFrplArplBrplCrplDrplErplFrplIrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmE2rpmFrpmGrpmG1rpmG2rpmG3rpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUthyAykgMykgO
The experimentally established mechanism targets of Hydrogen Peroxide. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Peroxide SCHEMBL504058 | 1.00 | — | — | |
| Hydrogen Peroxide SCHEMBL8922301 | 1.00 | — | — | |
| Hydrogen Peroxide SCHEMBL5406876 | 0.89 | — | — | |
| Hydrogen Peroxide SCHEMBL901646 | 0.87 | — | — | |
| Hydrogen Peroxide SCHEMBL2254311 | 0.87 | CA1 (0.33) | — | |
| Hydrogen Peroxide SCHEMBL36641 | 0.87 | — | — | |
| Hydrogen Peroxide SCHEMBL2254309 | 0.87 | — | — | |
| Hydrogen Peroxide SCHEMBL137725 | 0.87 | — | — | |
| Hydrogen Peroxide SCHEMBL21065417 | 0.87 | — | — | |
| Hydrogen Peroxide SCHEMBL832812 | 0.87 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 528 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240055271-A1 | SEMICONDUCTOR TEST SAMPLE AND MANUFACTURING METHOD THEREOF | CHANGXIN MEMORY TECHNOLOGIES, INC. (CN) | 2024-02-15 | — | — | US | claimed |
| US-11587875-B2 | Connecting structure and method for forming the same | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2023-02-21 | — | — | US | claimed |
| US-20220051982-A1 | CONNECTING STRUCTURE AND METHOD FOR FORMING THE SAME | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (TW) | 2022-02-17 | — | — | US | claimed |
| CN-110160570-A | A kind of fibre optical sensor being bonded based on sapphire with fiber stub and preparation method | 上海大学 | 2019-08-23 | — | — | CN | claimed |
| CN-109713057-A | A kind of polysilicon wet-method texturing manufacturing process | 武汉风帆电化科技股份有限公司 | 2019-05-03 | — | — | CN | claimed |
| CN-105895510-B | Method for forming semiconductor device and patterning method | 台湾积体电路制造股份有限公司 | 2019-04-12 | — | — | CN | claimed |
| CN-109277357-A | It is the cleaning method of Ceramic component suitable for surface attachments | 深圳仕上电子科技有限公司 | 2019-01-29 | — | — | CN | claimed |
| CN-105679701-B | A kind of method of high-efficiency electroplating filling silicon substrate TSV | 上海交通大学 | 2019-01-11 | — | — | CN | claimed |
| CN-108754515-A | The method for removing titanium and titanium nitride film using ammonium hydroxide hydrogen peroxide solution | 深圳仕上电子科技有限公司 | 2018-11-06 | — | — | CN | claimed |
| CN-108655101-A | A kind of cleaning method of feux rouges GaAs chips | 山东浪潮华光光电子股份有限公司 | 2018-10-16 | — | — | CN | claimed |
| US-7476604-B1 | Aggressive cleaning process for semiconductor device contact formation | ADVANCED MICRO DEVICES, INC. (US) | 2009-01-13 | — | — | US | claimed |
| US-20070123052-A1 | Process sequence for photoresist stripping and cleaning of photomasks for integrated circuit manufacturing | WAFER HOLDINGS, INC. | 2007-05-31 | — | — | US | claimed |
| US-20070045227-A1 | METHOD OF STRIPPING PHOTORESIST | UNITED MICROELECTRONICS CORP. (TW) | 2007-03-01 | — | — | US | claimed |
| EP-1649503-A2 | PROCESS SEQUENCE FOR PHOTORESIST STRIPPING AND/OR CLEANING OF PHOTOMASKS FOR INTEGRATED CIRCUIT MANUFACTURING | Akrion Llc (US) | 2006-04-26 | — | — | EP | claimed |
| WO-2005013002-A2 | PROCESS SEQUENCE FOR PHOTORESIST STRIPPING AND/OR CLEANING OF PHOTOMASKS FOR INTEGRATED CIRCUIT MANUFACTURING | AKRION, LLC (US) | 2005-02-10 | — | — | WO | claimed |
| US-20050026435-A1 | Process sequence for photoresist stripping and/or cleaning of photomasks for integrated circuit manufacturing | AKRION TECHNOLOGIES INC. | 2005-02-03 | — | — | US | claimed |
| US-6725119-B1 | Cleaning-apparatus line configuration and designing process therefor | NEC ELECTRONICS CORPORATION (JP) | 2004-04-20 | — | — | US | claimed |
| US-6165808-A | Low temperature process for sharpening tapered silicon structures | MICRON TECHNOLOGY, INC. (US) | 2000-12-26 | — | — | US | claimed |
| US-6146008-A | System for diluting ultrapure chemicals which is intended for the microelectronics industry | LABEILLE S.A. (FR) | 2000-11-14 | — | — | US | claimed |
| US-5308400-A | Room temperature wafer cleaning process | UNITED MICROELECTRONICS CORPORATION (TW) | 1994-05-03 | — | — | US | claimed |