SCHEMBL50711

SCHEMBL50711

Oc1cccc(Pc2ccccc2)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA12 O43570 4/20 0.52
CA2 P00918 4/20 0.52
CA9 Q16790 4/20 0.52
CA14 Q9ULX7 3/20 0.52
CA1 P00915 3/20 0.52
TDP1 Q9NUW8 2/20 0.52
GLA P06280 1/20 0.52
CA3 P07451 1/20 0.52
CA4 P22748 1/20 0.52
CYP3A4 P08684 3/20 0.50
ALDH1A1 P00352 2/20 0.50
LMNA P02545 1/20 0.50
CA5A P35218 1/20 0.50
HSD17B10 Q99714 1/20 0.50
CA5B Q9Y2D0 1/20 0.50
TSHR P16473 2/20 0.45
HSD17B1 P14061 4/20 0.43
HSD17B2 P37059 4/20 0.43
CA6 P23280 1/20 0.41
CYP2C9 P11712 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Resorcinol SCHEMBL27631551 0.93 CA12 (0.60) CA12CA2CA9CA14CA1
Resorcinol SCHEMBL530454 0.93 CA12 (0.60) CA12CA2CA9CA14CA1
Phenol SCHEMBL28090492 0.87 CA12 (0.69) CA12CA2CA9CA14CA1
Phenol SCHEMBL18486356 0.87 CA12 (0.69) CA12CA2CA9CA14CA1
Resorcinol SCHEMBL2423620 0.83 CA2 (0.48) CA12CA2CA9CA14CA1
Hydroquinone SCHEMBL16266999 0.82 CA12 (0.59) CA12CA2CA9CA14CA1
Hydroquinone SCHEMBL7648401 0.82 CA12 (0.59) CA12CA2CA9CA14CA1
Hydroquinone SCHEMBL9287383 0.82 CA12 (0.59) CA12CA2CA9CA14CA1
Biphenyl SCHEMBL7871046 0.80 MMP3 (0.62) CA12CA2CA9CA14CA1
Phenol SCHEMBL28293387 0.80 CA12 (0.58) CA12CA2CA9CA14CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8148831-B2 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-04-03 US disclosed
US-8129467-B2 Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device HITACHI CHEMICAL CO., LTD. (JP) 2012-03-06 US disclosed
US-7723444-B2 retarding the curing of the epoxy resin by adjusting an amount of the retarder while curing in presence of a curing accelerator cation phosphorus compound; used for semiconductor encapsulation; providing latency; storage stability; resist to soldering without forming cracks by the soldering SUMITOMO BAKELITE CO., LTD. (JP) 2010-05-25 US disclosed
US-7666953-B2 Phosphine-protonated haloaromatic compound accelerator with curing resin and curing agent HITACHI CHEMICAL CO, LTD. (JP) 2010-02-23 US disclosed
US-20090062460-A1 CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, METHOD FOR PRODUCING CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, CURING ACCELERATOR, CURABLE RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE HITACHI CHEMICAL CO., LTD. (JP) 2009-03-05 US disclosed
US-20090023840-A1 LATENT CATALYST FOR EPOXY RESIN, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE HORIMOTO AKIHIRO 2009-01-22 US disclosed
US-20090005480-A1 REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR NAKAMURA SHINYA 2009-01-01 US disclosed
US-20080262135-A1 REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-10-23 US disclosed
US-20070010601-A1 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device SUMOTOMO BAKELITE COMPANY LIMITED (JP) 2007-01-11 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090062460-A1 CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, METHOD FOR PRODUCING CURING ACCELERATING COMPOUND-SILICA COMPOSITE MATERIAL, CURING ACCELERATOR, CURABLE RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE NCAPH, RAD51, H1-2 CA12 2683/4885CA2 2179/4885CA9 3484/4885
US-20090023840-A1 LATENT CATALYST FOR EPOXY RESIN, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE ELL, LTA4H, ESD CA12 2848/4885CA2 3045/4885CA9 1609/4885
US-20090005480-A1 REACTION PRODUCT OF PHOSPHINE AND PROTONATED HALOARYL COMPOUND AND USE AS EPOXY CURING ACCELERATOR HDHD5, EHMT2, HRH2 CA12 3320/4885CA2 3260/4885CA9 3547/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.