Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NR3C1 | P04150 | 3/20 | 0.31 |
| ▸ | PGR | P06401 | 3/20 | 0.31 |
| ▸ | NR3C2 | P08235 | 3/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL60073 | 0.82 | CYP1A2 (0.33) | NR3C1PGRNR3C2 | |
| SCHEMBL1088488 | 0.81 | CA1 (0.32) | NR3C1PGRNR3C2 | |
| SCHEMBL3132444 | 0.81 | CA1 (0.32) | NR3C1PGRNR3C2 | |
| SCHEMBL1088937 | 0.81 | NR3C1 (0.34) | NR3C1PGRNR3C2 | |
| SCHEMBL3774828 | 0.79 | — | — | |
| Trifluoromethanesulfonic Acid SCHEMBL546940 | 0.77 | GPR3 (0.43) | NR3C1PGRNR3C2 | |
| SCHEMBL3774822 | 0.75 | MMP13 (0.38) | — | |
| SCHEMBL18008388 | 0.74 | — | — | |
| Lithium Ion SCHEMBL18007875 | 0.74 | — | — | |
| Potassium Ion SCHEMBL18008282 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12338309-B2 | Dielectric film-forming composition | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-06-24 | — | — | US | disclosed |
| US-20240254268-A1 | Dielectric Film-Forming Composition | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2024-08-01 | — | — | US | disclosed |
| US-11945894-B2 | Dielectric film-forming composition | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2024-04-02 | — | — | US | disclosed |
| EP-4176001-A1 | DIELECTRIC FILM-FORMING COMPOSITION | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2023-05-10 | — | — | EP | disclosed |
| EP-4118679-A1 | METAL DEPOSITION PROCESSES | Fujifilm Electronic Materials U.S.A., Inc. (US) | 2023-01-18 | — | — | EP | disclosed |
| WO-2022005783-A1 | DIELECTRIC FILM-FORMING COMPOSITION | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2022-01-06 | — | — | WO | disclosed |
| US-20220002463-A1 | Dielectric Film-Forming Composition | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2022-01-06 | — | — | US | disclosed |
| WO-2021183472-A1 | METAL DEPOSITION PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2021-09-16 | — | — | WO | disclosed |
| US-20210287939-A1 | Metal Deposition Processes | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2021-09-16 | — | — | US | disclosed |
| EP-1257879-B1 | RADIATION SENSITIVE COPOLYMERS, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEMS THEREOF | FUJIFILM ELECTRONIC MATERIALS (US) | 2007-04-18 | — | — | EP | disclosed |
| EP-1257879-A4 | RADIATION SENSITIVE COPOLYMERS, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEMS THEREOF | ARCH SPEC CHEM INC (US) | 2004-03-17 | — | — | EP | disclosed |
| EP-1257879-A2 | RADIATION SENSITIVE COPOLYMERS, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEMS THEREOF | Arch Specialty Chemicals, Inc. (US) | 2002-11-20 | — | — | EP | disclosed |
| WO-2001022163-A2 | RADIATION SENSITIVE COPOLYMERS, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEMS THEREOF | ARCH SPECIALTY CHEMICALS, INC. (US) | 2001-03-29 | — | — | WO | disclosed |
| US-6165682-A | Radiation sensitive copolymers, photoresist compositions thereof and deep UV bilayer systems thereof | ARCH SPECIALTY CHEMICALS, INC. (US) | 2000-12-26 | — | — | US | disclosed |