Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.41 |
| ▸ | CYP2A6 | P11509 | 6/20 | 0.39 |
| ▸ | CYP2B6 | P20813 | 3/20 | 0.39 |
| ▸ | CYP2E1 | P05181 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | ATM | Q13315 | 1/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.36 |
| ▸ | HTR1D | P28221 | 1/20 | 0.36 |
| ▸ | HTR2B | P41595 | 1/20 | 0.36 |
| ▸ | HTR3A | P46098 | 1/20 | 0.36 |
| ▸ | HTR5A | P47898 | 1/20 | 0.36 |
| ▸ | NPC1 | O15118 | 1/20 | 0.35 |
| ▸ | CASP3 | P42574 | 1/20 | 0.35 |
| ▸ | RAB9A | P51151 | 1/20 | 0.35 |
| ▸ | SENP8 | Q96LD8 | 1/20 | 0.35 |
| ▸ | SENP7 | Q9BQF6 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15843096 | 0.71 | LMNA (0.41) | LMNASMN1; SMN2ALDH1A1MAPTATM | |
| SCHEMBL8378973 | 0.69 | MGLL (0.43) | LMNASMN1; SMN2ALDH1A1MAPTATM | |
| SCHEMBL9329758 | 0.69 | MAPT (0.45) | LMNASMN1; SMN2ALDH1A1MAPTATM | |
| SCHEMBL6170485 | 0.65 | CYP2A6 (0.50) | LMNASMN1; SMN2CYP2A6CYP2B6CYP2E1 | |
| SCHEMBL14875080 | 0.65 | NPC1 (0.48) | LMNASMN1; SMN2ALDH1A1MAPTATM | |
| SCHEMBL2785438 | 0.64 | NISCH (0.46) | LMNASMN1; SMN2CYP2A6CYP2B6CYP2E1 | |
| SCHEMBL15842578 | 0.64 | NOS3 (0.37) | LMNASMN1; SMN2ALDH1A1MAPTATM | |
| SCHEMBL31429656 | 0.63 | CYP2A6 (0.38) | CYP2A6CYP2B6CYP2E1CYP3A4CYP2C9 | |
| SCHEMBL16492223 | 0.62 | LMNA (0.43) | LMNASMN1; SMN2ALDH1A1MAPTATM | |
| SCHEMBL3822969 | 0.62 | ALDH1A1 (0.47) | LMNASMN1; SMN2ALDH1A1MAPTATM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12439528-B2 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Atotech Deutschland GmbH & Co. KG (DE) | 2025-10-07 | — | — | US | disclosed |
| CN-113924669-B | Copper foil capable of preventing occurrence of wrinkles, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same | SK纳力世有限公司 | 2025-04-29 | — | — | CN | disclosed |
| US-12245383-B2 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Atotech Deutschland GmbH & Co. KG (DE) | 2025-03-04 | — | — | US | disclosed |
| US-20240341042-A1 | METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER | Atotech Deutschland GmbH & Co. KG (DE) | 2024-10-10 | — | — | US | disclosed |
| US-12063751-B2 | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board | Atotech Deutschland GmbH & Co. KG (DE) | 2024-08-13 | — | — | US | disclosed |
| CN-118215756-A | Electrolytic copper foil with high elongation and high strength characteristics | 乐天能源材料公司 | 2024-06-18 | — | — | CN | disclosed |
| CN-118140015-A | Electrolytic copper foil for current collector of secondary battery | 乐天能源材料公司 | 2024-06-04 | — | — | CN | disclosed |
| CN-118140014-A | Electrolytic copper foil for current collector of secondary battery | 乐天能源材料公司 | 2024-06-04 | — | — | CN | disclosed |
| CN-110997983-B | Crease-resistant copper foil, electrode comprising same, secondary battery comprising same, and method for manufacturing same | SK纳力世有限公司 | 2022-10-21 | — | — | CN | disclosed |
| US-20220304164-A1 | MANUFACTURING SEQUENCES FOR HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARDS AND A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD | Atotech Deutschland GmbH & Co. KG (DE) | 2022-09-22 | — | — | US | disclosed |
| US-20200040039-A1 | PEPTIDE COMPOUND AND METHOD FOR PRODUCING SAME, COMPOSITION FOR SCREENING USE, AND METHOD FOR SELECTING PEPTIDE COMPOUND | FUJIFILM CORPORATION (JP) | 2020-02-06 | — | — | US | disclosed |
| EP-2399281-B1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) | ATOTECH DEUTSCHLAND GMBH (DE) | 2016-04-20 | — | — | EP | disclosed |
| CN-102318041-B | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) | ATOTECH DEUTSCHLAND GMBH | 2014-05-07 | — | — | CN | disclosed |
| EP-2611950-B1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV), WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE | ATOTECH DEUTSCHLAND GMBH (DE) | 2013-11-13 | — | — | EP | disclosed |
| EP-2611950-A1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE | Atotech Deutschland GmbH (DE) | 2013-07-10 | — | — | EP | disclosed |
| CN-103038397-A | Method for electrodepositing chip-to-chip, chip-to-wafer, and wafer-to-wafer copper interconnects in Through Silicon Vias (TSVs) by heating the substrate and cooling the electrolyte | ATOTECH DEUTSCHLAND GMBH | 2013-04-10 | — | — | CN | disclosed |
| US-20120024713-A1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE | ATOTECH DEUTSCHLAND GMBH (DE) | 2012-02-02 | — | — | US | disclosed |
| WO-2012014029-A1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE | ATOTECH DEUTSCHLAND GMBH (DE) | 2012-02-02 | — | — | WO | disclosed |
| CN-102318041-A | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) | ATOTECH DEUTSCHLAND GMBH | 2012-01-11 | — | — | CN | disclosed |
| US-20100206737-A1 | PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) | ATOTECH DEUTSCHLAND GMBH (DE) | 2010-08-19 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20200040039-A1 | PEPTIDE COMPOUND AND METHOD FOR PRODUCING SAME, COMPOSITION FOR SCREENING USE, AND METHOD FOR SELECTING PEPTIDE COMPOUND | VIP, NPPA, NGLY1 | LMNA 3026/4885SMN1; SMN2 3728/4885CYP2A6 4664/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.