SCHEMBL5346976

SCHEMBL5346976

C=C(CC)c1ccc(S(=O)(=O)O)cc1.C=CC(=O)OCCO.C=CC(=O)Oc1cccc2cc3ccccc3c(O)c12

nearest known ligand 0.31

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
▸ THRA P10827 1/20 0.31
▸ THRB P10828 1/20 0.31
▸ TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5343028 0.93 THRA (0.34) THRATHRBTSHR
SCHEMBL5339026 0.80 TSHR (0.47) THRBTSHR
SCHEMBL6014779 0.76 TYMS (0.43) THRATHRB
SCHEMBL5349514 0.73 MCL1 (0.36) THRATHRB
SCHEMBL5346974 0.69 MCL1 (0.33) THRATHRB
SCHEMBL11883916 0.65 ALDH1A1 (0.42) THRATHRBTSHR
SCHEMBL5449463 0.65 TSHR (0.51) THRATHRBTSHR
Acrylic Acid Ethyl Ester SCHEMBL5443556 0.65 THRB (0.45) THRATHRB
1-Naphthol SCHEMBL27919570 0.64 TSHR (0.54) THRBTSHR
SCHEMBL2374547 0.63 LMNA (0.45) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7238462-B2 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2007-07-03 — — US disclosed
US-20050074695-A1 Undercoating material for wiring, embedded material, and wiring formation method TOKYO OHKA KOGYO CO., LTD. (JP) 2005-04-07 — — US disclosed
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