Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B10 | Q99714 | 6/20 | 0.40 |
| ▸ | TSHR | P16473 | 5/20 | 0.40 |
| ▸ | TTR | P02766 | 3/20 | 0.40 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.40 |
| ▸ | RECQL | P46063 | 3/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.40 |
| ▸ | HPGD | P15428 | 4/20 | 0.37 |
| ▸ | THRB | P10828 | 3/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.37 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.36 |
| ▸ | ALOX12 | P18054 | 3/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.36 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.36 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.36 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | GPR35 | Q9HC97 | 1/20 | 0.35 |
| ▸ | CASP1 | P29466 | 2/20 | 0.35 |
| ▸ | MEN1 | O00255 | 3/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29904874 | 1.00 | HSD17B10 (0.40) | HSD17B10TSHRTTRCYP3A4RECQL | |
| Bithionoloxide SCHEMBL69373 | 0.79 | HSD17B10 (0.56) | HSD17B10TSHRTTRCYP3A4RECQL | |
| SCHEMBL30678712 | 0.71 | TSHR (0.46) | HSD17B10TSHRCYP3A4ALDH1A1HPGD | |
| SCHEMBL3341213 | 0.71 | TSHR (0.46) | HSD17B10TSHRCYP3A4ALDH1A1HPGD | |
| SCHEMBL12786124 | 0.70 | ALDH1A1 (0.45) | HSD17B10TSHRTTRCYP3A4RECQL | |
| SCHEMBL9621812 | 0.70 | HSD17B10 (0.50) | HSD17B10TSHRTTRCYP3A4RECQL | |
| SCHEMBL29904878 | 0.70 | TSHR (0.39) | HSD17B10TSHRTTRCYP3A4RECQL | |
| SCHEMBL3337579 | 0.70 | TSHR (0.39) | HSD17B10TSHRTTRCYP3A4RECQL | |
| SCHEMBL30402191 | 0.67 | ALDH1A1 (0.31) | HSD17B10TSHRALDH1A1HPGD | |
| SCHEMBL29001612 | 0.67 | ALDH1A1 (0.31) | HSD17B10TSHRALDH1A1HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240213072-A1 | LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE | NISSAN CHEMICAL CORPORATION (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20240199924-A1 | LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE | NISSAN CHEMICAL CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| EP-4310157-A1 | LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING MACHINED SEMICONDUCTOR SUBSTRATE | Nissan Chemical Corporation (JP) | 2024-01-24 | — | — | EP | disclosed |
| EP-4309893-A1 | LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE | Nissan Chemical Corporation (JP) | 2024-01-24 | — | — | EP | disclosed |
| CN-117157739-A | Laminate, stripper composition, and method for producing processed semiconductor substrate | 日产化学株式会社 | 2023-12-01 | — | — | CN | disclosed |
| CN-117157738-A | Laminate, stripper composition, and method for producing processed semiconductor substrate | 日产化学株式会社 | 2023-12-01 | — | — | CN | disclosed |
| US-10607876-B2 | Method for processing mold material and method for manufacturing structural body | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-03-31 | — | — | US | disclosed |
| US-10112377-B2 | Supporting member separation method and supporting member separation apparatus | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-10-30 | — | — | US | disclosed |
| US-9837298-B2 | Method for manufacturing laminate, method for manufacturing sealed substrate laminate, sealed substrate laminate, and sealed substrate | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-12-05 | — | — | US | disclosed |
| EP-2757136-B1 | METHOD USING AN ADHESIVE COMPOSITION FOR BONDING WAFER AND SUPPORTING BODY FOR SAID WAFER | TOKYO OHKA KOGYO CO LTD (JP) | 2017-11-01 | — | — | EP | disclosed |
| US-20010044080-A1 | Method for forming a finely patterned photoresist layer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-11-22 | — | — | US | disclosed |
| US-6284428-B1 | FOR FORMING OF ANTIREFLECTION UNDERCOATING LAYER TO INTERVENE BETWEEN SURFACE OF SUBSTRATE AND PHOTORESIST LAYER TO BE PATTERNED IN MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICES | TOKYO OHKA KOGYO CO., LTD, (JP) | 2001-09-04 | — | — | US | disclosed |
| US-20010018163-A1 | Undercoating composition for photolithographic resist | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-08-30 | — | — | US | disclosed |
| US-6268108-B1 | MIXTURE OF COMPOUND FORMING ACID UPON EXPOSURE OF ACTINIC RADIATION, COMPOUND CAPABLE OF CROSSLINKING, DYE AND SOLVENT | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-07-31 | — | — | US | disclosed |
| US-6083665-A | Photoresist laminate and method for patterning using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-07-04 | — | — | US | disclosed |
| US-6071673-A | Method for the formation of resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-06-06 | — | — | US | disclosed |
| US-5948847-A | ACRYLATED ESTER CROSSLINKED WITH NITROGEN CONTAINING ORGANIC COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-09-07 | — | — | US | disclosed |
| US-5925495-A | Photoresist laminate and method for patterning using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-07-20 | — | — | US | disclosed |
| US-5908738-A | Undercoating composition for photolithography | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-06-01 | — | — | US | disclosed |
| US-5756255-A | Undercoating composition for photolithography | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-05-26 | — | — | US | disclosed |