SCHEMBL548086

SCHEMBL548086

CC(C)(O)c1cc(O)cc(C(C)(C)O)c1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GABRA1 P14867 1/20 0.65
GABRB2 P47870 1/20 0.65
ESR1 P03372 5/20 0.39
ESR2 Q92731 4/20 0.39
BACE1 P56817 1/20 0.39
HSD17B10 Q99714 4/20 0.38
CYP3A4 P08684 4/20 0.38
HPGD P15428 3/20 0.38
TSHR P16473 2/20 0.38
LMNA P02545 2/20 0.38
TYR P14679 2/20 0.38
AR P10275 1/20 0.38
SLC6A2 P23975 1/20 0.38
SLC6A4 P31645 1/20 0.38
HTR6 P50406 1/20 0.38
ESRRG P62508 1/20 0.38
SLC6A3 Q01959 1/20 0.38
ALDH1A1 P00352 6/20 0.36
ALOX15 P16050 5/20 0.33
TDP1 Q9NUW8 3/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL548187 0.87 GABRA1 (0.45) GABRA1GABRB2ESR1ESR2HSD17B10
SCHEMBL12357876 0.84 GABRA1 (0.48) GABRA1GABRB2ESR1ESR2CYP2C9
SCHEMBL12357795 0.84 GABRA1 (0.48) GABRA1GABRB2HSD17B10TSHRAR
SCHEMBL7764602 0.79 GABRA1 (0.60) GABRA1GABRB2HSD17B10HPGDTSHR
SCHEMBL18268 0.79 GABRA1 (1.00) GABRA1GABRB2ESR1ESR2BACE1
SCHEMBL8985984 0.79 MEN1 (0.42) GABRA1GABRB2ESR1ESR2HSD17B10
SCHEMBL3969052 0.79 GABRA1 (0.60) GABRA1GABRB2HSD17B10HPGDTSHR
SCHEMBL18802839 0.79 ALOX15 (0.46) GABRA1GABRB2ESR1ESR2HSD17B10
SCHEMBL547694 0.79 RXRB (0.40) GABRA1GABRB2ESR1ESR2KDM4E
SCHEMBL13694338 0.78 GABRA1 (0.47) GABRA1GABRB2ESR1ESR2HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 125 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
EP-4270108-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2023-11-01 EP disclosed
US-20230341775-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-26 US disclosed
US-20230341775-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-26 US disclosed
US-11773059-B2 Onium salt, chemically amplified negative resist composition, and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-03 US disclosed
US-11773059-B2 Onium salt, chemically amplified negative resist composition, and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-10-03 US disclosed
CN-110531580-B Chemically amplified negative resist composition and resist pattern forming method 信越化学工业株式会社 2023-08-29 CN disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
US-11548844-B2 Monomer, polymer, negative resist composition, photomask blank, and resist pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-01-10 US disclosed
US-11548844-B2 Monomer, polymer, negative resist composition, photomask blank, and resist pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-01-10 US disclosed
US-20100047709-A1 RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2010-02-25 US disclosed
EP-2080750-A1 RADIATION-SENSITIVE COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2009-07-22 EP disclosed
US-20080153031-A1 Resist composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2008-06-26 US disclosed
US-7323284-B2 Negative type radiation sensitive resin composition JSR CORPORATION (JP) 2008-01-29 US disclosed
EP-1319646-B1 PROCESS FOR PREPARATION OF 3,5-BISALKYLPHENOLS KOWA CO (JP) 2007-04-18 EP disclosed
EP-1739485-A1 RESIST COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2007-01-03 EP disclosed
US-6806395-B2 FOR PRODUCING 3,5- DIISOPROPYLPHENOL OR A SIMILAR COMPOUND, WHICH SERVES AS AN INTERMEDIATE FOR PRODUCING ANTI-INFLAMMATORY AGENTS, PESTICIDES, ETC. KOWA CO., LTD. (JP) 2004-10-19 US disclosed
US-20040044255-A1 Process for preparation of 3,5-bisalkylphenols KOWA CO., LTD. (JP) 2004-03-04 US disclosed
EP-1319646-A1 PROCESS FOR PREPARATION OF 3,5-BISALKYLPHENOLS Kowa Co., Ltd. (JP) 2003-06-18 EP disclosed
US-20030022095-A1 Negative type radiation sensitive resin composition JSR CORPORATION (JP) 2003-01-30 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (6 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 GABRA1 3202/4885GABRB2 4213/4885ESR1 3319/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R GABRA1 3110/4885GABRB2 3518/4885ESR1 446/4885
US-20100047709-A1 RADIATION-SENSITIVE COMPOSITION C1S, C9, RAD51 GABRA1 2429/4885GABRB2 3018/4885ESR1 194/4885
US-11548844-B2 Monomer, polymer, negative resist composition, photomask blank, and resist pattern forming process PARG, PCNA, PLK2 GABRA1 1265/4885GABRB2 599/4885ESR1 216/4885
US-20040044255-A1 Process for preparation of 3,5-bisalkylphenols ACSL3, HACL2, ARL1 GABRA1 3761/4885GABRB2 4267/4885ESR1 655/4885
US-11773059-B2 Onium salt, chemically amplified negative resist composition, and pattern forming process LBR, IDUA, ADORA1 GABRA1 955/4885GABRB2 1852/4885ESR1 1589/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.