SCHEMBL548430

SCHEMBL548430

CC(C)(O)c1cccc(-c2ccccc2)c1

nearest known ligand 0.53

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
RXRA P19793 2/20 0.53
RXRB P28702 2/20 0.53
PTPN1 P18031 4/20 0.52
PTPN5 P54829 4/20 0.52
KIF11 P52732 1/20 0.50
CYP17A1 P05093 1/20 0.46
CYP3A4 P08684 1/20 0.46
NR4A2 P43354 1/20 0.44
KCNH2 Q12809 1/20 0.44
SYK P43405 1/20 0.43
MGLL Q99685 1/20 0.42
MAOA P21397 1/20 0.41
CNR1 P21554 1/20 0.41
CNR2 P34972 1/20 0.41
KMO O15229 1/20 0.41
CYP2C9 P11712 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL548600 0.93 KIF11 (0.50) RXRARXRBPTPN1PTPN5KIF11
SCHEMBL547993 0.89 RXRA (0.51) RXRARXRBPTPN1PTPN5KIF11
SCHEMBL17806549 0.87 KIF11 (0.60) RXRARXRBPTPN1PTPN5KIF11
SCHEMBL6982792 0.87 RXRA (0.53) RXRARXRBPTPN1PTPN5KIF11
SCHEMBL547878 0.87 RXRB (0.49) RXRARXRBPTPN1PTPN5KIF11
SCHEMBL13694196 0.86 RXRA (0.53) RXRARXRBPTPN1PTPN5KIF11
SCHEMBL17795033 0.86 PTPN5 (0.57) RXRARXRBPTPN1PTPN5KIF11
SCHEMBL17806543 0.86 RXRA (0.57) RXRARXRBPTPN1PTPN5KIF11
SCHEMBL4517154 0.85 CYP2C9 (0.48) RXRARXRBPTPN1PTPN5KIF11
SCHEMBL548413 0.84 RXRB (0.46) RXRARXRBPTPN1PTPN5KIF11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
US-11447460-B2 Compounds and compositions for treating conditions associated with NLRP activity NOVARTIS AG (CH) 2022-09-20 US disclosed
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-08 US disclosed
EP-3062151-B1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYPHENOLIC COMPOUND FOR USE IN THE COMPOSITION, AND ALCOHOLIC COMPOUND THAT CAN BE DERIVED THEREFROM MITSUBISHI GAS CHEMICAL CO (JP) 2021-05-05 EP disclosed
EP-3141957-B1 RESIST MATERIAL, RESIST COMPOSITION, AND RESIST PATTERN FORMATION METHOD MITSUBISHI GAS CHEMICAL CO (JP) 2021-03-24 EP disclosed
EP-3279728-B1 RESIST BASE MATERIAL, RESIST COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN MITSUBISHI GAS CHEMICAL CO (JP) 2021-03-17 EP disclosed
US-20200409261-A1 COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-12-31 US disclosed
US-10816898-B2 2020-10-27 US disclosed
US-20200262787-A1 OPTICAL COMPONENT FORMING COMPOSITION AND CURED PRODUCT THEREOF MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-08-20 US disclosed
CN-101528653-A Radiation-sensitive composition MITSUBISHI GAS CHEMICAL CO (JP) 2009-09-09 CN disclosed
EP-2080750-A1 RADIATION-SENSITIVE COMPOSITION Mitsubishi Gas Chemical Company, Inc. (JP) 2009-07-22 EP disclosed
US-20080153031-A1 Resist composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2008-06-26 US disclosed
US-7323284-B2 Negative type radiation sensitive resin composition JSR CORPORATION (JP) 2008-01-29 US disclosed
CN-1942825-A Resist composition MITSUBISHI GAS CHEMICAL CO (JP) 2007-04-04 CN disclosed
EP-1739485-A1 RESIST COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2007-01-03 EP disclosed
US-20030022095-A1 Negative type radiation sensitive resin composition JSR CORPORATION (JP) 2003-01-30 US disclosed
EP-0267759-B1 OXIDATION PROCESS OF AROMATIC COMPOUNDS KUREHA KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1993-03-10 EP disclosed
US-4825007-A Oxidation process of aromatic compounds KUREHA KAGAKU KOGYO K.K. (JP) 1989-04-25 US disclosed
EP-0267759-A2 Oxidation process of aromatic compounds KUREHA KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1988-05-18 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (7 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 RXRA 376/4885RXRB 601/4885PTPN1 4528/4885
US-20200409261-A1 COMPOUND, RESIN, RESIST COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, RESIST PATTERN FORMATION METHOD, METHOD FOR PRODUCING AMORPHOUS FILM, UNDERLAYER FILM FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR FORMING CIRCUIT PATTERN, AND PURIFICATION METHOD C9, C1R, RAD51 RXRA 456/4885RXRB 592/4885PTPN1 2945/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R RXRA 451/4885RXRB 572/4885PTPN1 2886/4885
US-20200262787-A1 OPTICAL COMPONENT FORMING COMPOSITION AND CURED PRODUCT THEREOF TERB1, C5, TERT RXRA 843/4885RXRB 846/4885PTPN1 4556/4885
US-11447460-B2 Compounds and compositions for treating conditions associated with NLRP activity NLRP1, NLRP3, NOD1 RXRA 617/4885RXRB 867/4885PTPN1 678/4885
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R RXRA 451/4885RXRB 572/4885PTPN1 2886/4885
US-10816898-B2 C5, C9, H1-0 RXRA 328/4885RXRB 446/4885PTPN1 3534/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.