Oxybenzone

Oxybenzone

SCHEMBL550167

COc1ccc(C(=O)c2ccccc2)c(O)c1.O.O.O

nearest known ligand 0.97

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ABCC9ABL1ACEACHEACVR1ADORA1ADORA2AADORA2BADORA3ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3AGTR1ALOX5ATP4AATP4BBCRBTKCACNA1ACACNA1BCACNA1CCACNA1DCACNA1ECACNA1FCACNA1GCACNA1HCACNA1ICACNA1SCACNA2D1CACNA2D2CACNA2D3CACNA2D4CACNB1CACNB2CACNB3CACNB4CACNG1CACNG2CACNG3CACNG4CACNG5CACNG6CACNG7CACNG8CALCRLCFBCHRM1CHRM2CHRM3CHRM4CHRM5CHRNA1CHRNB1CHRNDCHRNECHRNGCRBNCUL4ACXCR1CXCR2DDB1DDCDHFRDPP4DRD2DRD3DRD4EGFRERBB2ERBB4ESR1ESR2FDPSFKBP1AFLT1FLT3FLT4GARTGHSRGRIA1GRIA2GRIA3GRIA4GRIK1GRIK2GRIK3GRIK4GRIK5GRIN2AGSK3AGSK3BHDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HTR1AHTR1BHTR1DHTR1EHTR1FHTR2AHTR2BHTR2CHTR3AHTR3BHTR3CHTR3DHTR3EHTR4HTR5AHTR6HTR7IDH1IDH2IMPA1ITGA2BITGB3JAK1JAK2JAK3KCNJ11KCNK3KCNK9KDRKITMEN1METMMP1MMP13MMP7MMP8NANOD2NS5bODC1OPG057OPRD1OPRK1OPRM1PPARP1PARP2PDE3APDE3BPDE4APDE4BPDE4CPDE4DPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PKLRPPARDPPATPTGS1PTGS2RBX1ROCK1ROCK2RRM1RRM2RRM2BSCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASCNN1ASCNN1BSCNN1GSIGMAR1SLC10A2SLC5A2SLC6A2SLC6A3SLC6A4SLC9A3SYKTACR1THRATHRBTOP1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYK2TYMSVDRampCblablaT-3blaT-4blaT-5blaT-6blaUOE-1dacAdacBdacCfolAfolPftsIgyrAgyrBileSmecAmrcAmrcBmrdAparCparEpbp2pbp4pbpApbpFrplArplBrplCrplDrplErplFrplIrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmE2rpmFrpmGrpmG1rpmG2rpmG3rpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUthyAykgMykgO

The experimentally established mechanism targets of Oxybenzone. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC6A2 known ✓ P23975 2/20 0.97
PDE4A known ✓ P27815 1/20 0.97
HRH1 known ✓ P35367 1/20 0.97
SLC6A3 known ✓ Q01959 1/20 0.97
PDE4D known ✓ Q08499 1/20 0.97
ADORA3 known ✓ P0DMS8 1/20 0.71
CHRM1 known ✓ P11229 1/20 0.71
ADRA1A known ✓ P35348 1/20 0.71
MEN1 known ✓ O00255 2/20 0.65
NOD2 known ✓ Q9HC29 1/20 0.55
HPGD P15428 6/20 0.97
LMNA P02545 6/20 0.97
ALDH1A1 P00352 5/20 0.97
MAPK1 P28482 3/20 0.97
HTT P42858 3/20 0.97
CYP1A2 P05177 2/20 0.97
PGR P06401 2/20 0.97
CYP2C19 P33261 2/20 0.97
CYP2D6 P10635 1/20 0.97
RAB9A P51151 5/20 0.72

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Oxybenzone SCHEMBL29355332 0.98 HPGD (1.00) HPGDLMNAALDH1A1MAPK1HTT
Oxybenzone SCHEMBL15551 0.98 HPGD (1.00) HPGDLMNAALDH1A1MAPK1HTT
Oxybenzone SCHEMBL5161586 0.98 HPGD (1.00) HPGDLMNAALDH1A1MAPK1HTT
Oxybenzone SCHEMBL6674080 0.98 HPGD (1.00) HPGDLMNAALDH1A1MAPK1HTT
Oxybenzone SCHEMBL419361 0.98 HPGD (1.00) HPGDLMNAALDH1A1MAPK1HTT
Oxybenzone SCHEMBL7191990 0.97 HPGD (0.97) HPGDLMNAALDH1A1MAPK1HTT
Oxybenzone SCHEMBL31403363 0.97 HPGD (0.97) HPGDLMNAALDH1A1MAPK1HTT
Oxybenzone SCHEMBL942845 0.97 HPGD (0.97) HPGDLMNAALDH1A1MAPK1HTT
Oxybenzone SCHEMBL7243732 0.97 HPGD (0.97) HPGDLMNAALDH1A1MAPK1HTT
Oxybenzone SCHEMBL11414020 0.97 HPGD (0.97) HPGDLMNAALDH1A1MAPK1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1652891-B1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO LTD (JP) 2012-06-13 EP disclosed
US-8110645-B2 Curable resin composition KONISHI CO., LTD. (JP) 2012-02-07 US disclosed
EP-1788035-B1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE KONISHI CO LTD (JP) 2011-01-19 EP disclosed
US-20090264602-A1 Curable Resin Composition and Cold Setting Adhesive KONISHI CO., LTD. (JP) 2009-10-22 US disclosed
US-7576167-B2 Curable resin composition KONISHI CO., LTD. (JP) 2009-08-18 US disclosed
US-20080312401-A1 Reactive Hot-Melt Resin Composition and Reactive Hot-Melt Adhesive SATO SHINICHI 2008-12-18 US disclosed
US-7449519-B2 Curing resin, method for producing same and curing resin composition KONISHI CO., LTD. (JP) 2008-11-11 US disclosed
EP-1788035-A1 REACTIVE HOT-MELT RESIN COMPOSITION AND REACTIVE HOT-MELT ADHESIVE Konishi Co., Ltd. (JP) 2007-05-23 EP disclosed
US-20060189736-A1 Curable resin composition and cold-setting adhesive KONISHI CO., LTD. (JP) 2006-08-24 US disclosed
EP-1652891-A1 CURABLE RESIN COMPOSITION AND COLD-SETTING ADHESIVE KONISHI CO., LTD. (JP) 2006-05-03 EP disclosed
US-20060079605-A1 Curing resin, method for producing same and curing resin composition KONISHI CO., LTD. (JP) 2006-04-13 US disclosed
EP-1616886-A1 CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION Konishi Co., Ltd. (JP) 2006-01-18 EP disclosed