SCHEMBL5555746

SCHEMBL5555746

Cc1cc(C)c(S(=O)(=O)ON2C(=O)C3CCCCC3C2=O)c(C)c1

nearest known ligand 0.39

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.39
EBP Q15125 4/20 0.39
DHCR7 Q9UBM7 4/20 0.39
KDM4E B2RXH2 2/20 0.38
MAPT P10636 2/20 0.38
NPSR1 Q6W5P4 2/20 0.38
CYP1A2 P05177 1/20 0.38
CYP3A4 P08684 1/20 0.38
HPGD P15428 1/20 0.38
XBP1 P17861 1/20 0.38
CYP2C19 P33261 1/20 0.38
EPHX2 P34913 7/20 0.37
ALDH1A1 P00352 2/20 0.36
F2 P00734 1/20 0.36
KMT2A Q03164 3/20 0.34
MEN1 O00255 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4835081 0.88 MAPT (0.39) GAAEBPDHCR7KDM4EMAPT
SCHEMBL4835204 0.83 MAPT (0.42) GAAEBPDHCR7KDM4EMAPT
SCHEMBL5555744 0.78 VDR (0.55) KDM4EMAPTCYP1A2CYP3A4HPGD
SCHEMBL4834877 0.78 MAPT (0.38) GAAEBPDHCR7KDM4EMAPT
SCHEMBL2734945 0.77 CYP3A4 (0.43) GAAKDM4EMAPTNPSR1CYP1A2
SCHEMBL65774 0.76 PARL (0.50) GAAKDM4EMAPTNPSR1CYP1A2
SCHEMBL11892773 0.76 KDM4E (0.46) GAAEBPDHCR7KDM4EMAPT
SCHEMBL7519092 0.74 MAPT (0.43) GAAKDM4EMAPTNPSR1CYP1A2
SCHEMBL5556202 0.74 KDM4E (0.50) GAAKDM4EMAPTNPSR1CYP1A2
SCHEMBL2734947 0.74 ALDH1A1 (0.36) GAAEBPDHCR7KDM4EMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8173349-B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device FUJIFILM CORPORATION (JP) 2012-05-08 US disclosed
US-20100080963-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2010-04-01 US disclosed
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-20080227024-A1 PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2008-09-18 US disclosed