SCHEMBL572710

SCHEMBL572710

N#Cc1ccc(OP(=O)(Oc2ccc(C#N)cc2)Oc2ccc(C#N)cc2)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.52
CYP3A4 P08684 1/20 0.52
CA2 P00918 3/20 0.48
CA9 Q16790 2/20 0.48
CA1 P00915 2/20 0.48
PARP15 Q460N3 1/20 0.44
PARP10 Q53GL7 1/20 0.44
PARP2 Q9UGN5 1/20 0.44
MAPT P10636 2/20 0.43
KMT2A Q03164 2/20 0.43
KDM4E B2RXH2 1/20 0.43
MEN1 O00255 1/20 0.43
LMNA P02545 1/20 0.43
POLB P06746 1/20 0.43
PKM P14618 1/20 0.43
MAPK1 P28482 1/20 0.43
RAB9A P51151 1/20 0.43
IL18 Q14116 1/20 0.43
MAOB P27338 1/20 0.42
ALDH1A1 P00352 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28460825 0.92 MAOB (0.50) TSHRCYP3A4CA2CA9CA1
Cyanophos-Oxon SCHEMBL17445283 0.88 CYP3A4 (0.45) TSHRCYP3A4CA2CA9CA1
SCHEMBL17512952 0.83 CA1 (0.55) TSHRCYP3A4CA2CA1PARP15
SCHEMBL8055795 0.83 SRC (0.54) CA2CA9CA1PARP15PARP10
SCHEMBL28757584 0.83 CA2 (0.46) TSHRCYP3A4CA2CA9CA1
SCHEMBL17512951 0.83 CES2 (0.48) CA2CA9CA1PARP15PARP10
SCHEMBL16670711 0.83 CA2 (0.46) CA2CA9CA1PARP15PARP10
SCHEMBL23795067 0.80 MAOB (0.44) TSHRCYP3A4CA2CA9CA1
SCHEMBL11599743 0.79 CYP2C19 (0.53) CA2CA9CA1PARP15PARP10
SCHEMBL2354336 0.79 MMP2 (0.44) CA2CA9CA1PARP15PARP10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110358056-B Semiconductor sealing epoxy resin composition and semiconductor device 信越化学工业株式会社 2024-01-16 CN disclosed
CN-112955302-B Method for manufacturing a laminate with partial curing 斯特拉塔西斯公司 2023-05-02 CN disclosed
CN-112930257-B Three-dimensional inkjet printing of thermally stable objects 斯特拉塔西斯公司 2023-03-24 CN disclosed
CN-112955302-A Method for build-up manufacturing with partial curing 斯特拉塔西斯公司 2021-06-11 CN disclosed
CN-112930257-A Three-dimensional inkjet printing of thermally stable objects 斯特拉塔西斯公司 2021-06-08 CN disclosed
CN-111033640-A Paste composition, semiconductor device, and electrical/electronic component 京瓷株式会社 2020-04-17 CN disclosed
US-9660295-B2 Electrolyte and rechargeable lithium battery including the same SAMSUNG SDI CO., LTD. (KR) 2017-05-23 US disclosed
US-20160056505-A1 ELECTROLYTE AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2016-02-25 US disclosed
WO-2012017443-A1 PROCESS FOR PREPARATION OF HIGHLY PURE DIALKYL PEMETREXED NEON LABORATORIES LTD. (IN) 2012-02-09 WO disclosed
EP-0594644-B1 ANISOTROPIC CONDUCTIVE ADHESIVE FILM MINNESOTA MINING & MFG (US) 1997-03-12 EP disclosed
EP-0347800-B1 Toner for electrostatic images MITSUBISHI GAS CHEMICAL CO (JP) 1995-02-22 EP disclosed
EP-0594644-A1 ANISOTROPIC CONDUCTIVE ADHESIVE FILM. MINNESOTA MINING & MFG (US) 1994-05-04 EP disclosed
WO-1993001248-A1 ANISOTROPIC CONDUCTIVE ADHESIVE FILM MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-01-21 WO disclosed
EP-0347800-A2 Toner for electrostatic images MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1989-12-27 EP disclosed