SCHEMBL64454

SCHEMBL64454

COCCOCOCCN(CCOCOCCOC)CCOCOCCOC

nearest known ligand 0.34

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
BLM P54132 1/20 0.34
PMP22 Q01453 1/20 0.34
HSD17B10 Q99714 1/20 0.34
MEN1 O00255 1/20 0.32
POLB P06746 1/20 0.32
KMT2A Q03164 1/20 0.32
CA2 P00918 4/20 0.31
PIK3CD O00329 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20465866 0.93 BLM (0.35) BLMPMP22HSD17B10CA2
SCHEMBL10446249 0.90 BLM (0.37) BLMPMP22HSD17B10MEN1POLB
SCHEMBL10498370 0.89 BLM (0.42) BLMPMP22HSD17B10MEN1POLB
SCHEMBL9359934 0.89 BLM (0.42) BLMPMP22HSD17B10MEN1POLB
SCHEMBL8953515 0.89 BLM (0.42) BLMPMP22HSD17B10MEN1POLB
SCHEMBL24177721 0.89 BLM (0.42) BLMPMP22HSD17B10MEN1POLB
SCHEMBL61362 0.89 BLM (0.42) BLMPMP22HSD17B10MEN1POLB
SCHEMBL9481973 0.89 BLM (0.42) BLMPMP22HSD17B10MEN1POLB
SCHEMBL22517121 0.89 BLM (0.33) BLMPMP22HSD17B10CA2
Bromide SCHEMBL8935205 0.86 BLM (0.41) BLMPMP22HSD17B10MEN1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1463 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2296039-B1 Positive photosensitive composition FUJIFILM CORP (JP) 2013-09-25 EP claimed
US-20260086457-A1 RESIST COMPOSITION AND RESIST PATTERN FORMATION METHOD TOKYO OHKA KOGYO CO LTD (JP) 2026-03-26 US disclosed
US-20260086458-A1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND POLYMER COMPOUND TOKYO OHKA KOGYO CO LTD (JP) 2026-03-26 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
US-20260079394-A1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND AND ACID DIFFUSION CONTROL AGENT TOKYO OHKA KOGYO CO LTD (JP) 2026-03-19 US disclosed
US-20260079395-A1 RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND AND ACID DIFFUSION CONTROL AGENT TOKYO OHKA KOGYO CO LTD (JP) 2026-03-19 US disclosed
US-12566376-B2 Resist composition and resist pattern forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2026-03-03 US disclosed
US-20260050211-A1 RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND INTERMEDIATE THEREOF TOKYO OHKA KOGYO CO LTD (JP) 2026-02-19 US disclosed
US-20260003277-A1 NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-20260003284-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED SILICON-CONTAINING RESIN FILM TOKYO OHKA KOGYO CO LTD (JP) 2026-01-01 US disclosed
US-6117621-A APPLYING A CHEMICALLY AMPLIFIED POSITIVE RESIST OF A POLYMER WITH ACID LABILE GROUPS, A PHOTOACID GENERATOR AND A ORGANIC SOLVENT; RESOLUTION AND FOCAL DEPTH; EXPOSING, BAKING, AND DEVELOPING; CALIBRATION OF EXPOSURES AND DISSOLUTION RATES SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-09-12 US disclosed
EP-1031879-A1 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-08-30 EP disclosed
EP-1004568-A2 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-05-31 EP disclosed
US-6066433-A SILICONE POLYMER CONTAINING PHENOLIC HYDROXYL GROUPS HAVING HYDROGEN ATOMS OF SOME PHENOLIC HYDROXYL GROUPS REPLACED BY ACID LABILE GROUPS, CROSSLINKED AT SOME OF THE REMAINING PHENOLIC HYDROXYL GROUPS WITH GROUPS HAVING ETHER LINKAGES SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-05-23 US disclosed
US-6048661-A POLYMER WITH HYDROXY AND CARBOXY GROUPS AND ETHER ESTER GROUPS FOR PHOTORESISTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-04-11 US disclosed
US-6027854-A ACTINIC RADIATION-SENSITIVE, CROSSLINKED TERPOLYMER CONTAINING STYRENIC GROUPS RING-SUBSTITUTED WITH HYDROXYL, HYDROXYALKYLOXY, CARBOXYALKYLOXY MOIETIES AND ACID LABILE GROUPS; ETCHING AND HEAT RESISTANCE SHIN-ETSU CHEMICAL CO., LTD. 2000-02-22 US disclosed
US-5972560-A A CROSSLINKED POLYSILOXANE PHOTOACID GENERATOR HAVING HIGH TRANSPARENCY, HIGH RESOLUTION, IMPROVED LATITUDE OF EXPOSURE, PROCESS ADAPTABILITY, AND FOR PRECISE MICRO-PROCESSING SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-10-26 US disclosed
EP-0908783-A1 Resist compositions, their preparation and use for patterning processes SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-04-14 EP disclosed
EP-0908473-A1 Styrene polymers, chemically-amplified positive resist compositions, their preparation and use in a patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-04-14 EP disclosed
EP-0887705-A1 Resist compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 1998-12-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (9 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260086458-A1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND POLYMER COMPOUND RER1, ITGA1, AR BLM 1856/4885PMP22 4791/4885HSD17B10 1424/4885
US-20260086457-A1 RESIST COMPOSITION AND RESIST PATTERN FORMATION METHOD CCND2, CCNA1, CCND1 BLM 673/4885PMP22 4076/4885HSD17B10 743/4885
US-20260003284-A1 PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED SILICON-CONTAINING RESIN FILM ASH2L, SEM1, COL1A1 BLM 2446/4885PMP22 4872/4885HSD17B10 1577/4885
US-20260003277-A1 NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM H1-4, H1-10, H1-0 BLM 301/4885PMP22 4738/4885HSD17B10 1672/4885
US-20260079395-A1 RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND AND ACID DIFFUSION CONTROL AGENT F9, AFF2, AFF1 BLM 1246/4885PMP22 4379/4885HSD17B10 2988/4885
US-20260050211-A1 RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND INTERMEDIATE THEREOF RARG, RXRG, IGF1R BLM 929/4885PMP22 3712/4885HSD17B10 2169/4885
US-12566376-B2 Resist composition and resist pattern forming method RER1, REV1, GAR1 BLM 753/4885PMP22 4141/4885HSD17B10 1243/4885
US-20260079394-A1 RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND AND ACID DIFFUSION CONTROL AGENT DRD1, DRD2, FANCD2 BLM 489/4885PMP22 4536/4885HSD17B10 2348/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 BLM 1304/4885PMP22 4771/4885HSD17B10 4119/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.