SCHEMBL65073

SCHEMBL65073

COc1ccc(S(=O)(=O)O)cc1.O=C1CCC(=O)N1O

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PKM P14618 3/20 0.51
NPC1 O15118 1/20 0.51
PKLR P30613 1/20 0.51
RAB9A P51151 1/20 0.51
MMP2 P08253 6/20 0.51
GAA P10253 2/20 0.51
HTT P42858 2/20 0.49
POLB P06746 1/20 0.49
MMP9 P14780 5/20 0.47
MMP12 P39900 2/20 0.47
MMP14 P50281 2/20 0.47
MMP1 P03956 2/20 0.47
MMP8 P22894 2/20 0.47
MMP13 P45452 2/20 0.47
MMP3 P08254 1/20 0.47
MMP7 P09237 1/20 0.47
MMP16 P51512 1/20 0.47
ADAM17 P78536 1/20 0.47
KDM4E B2RXH2 2/20 0.45
L3MBTL1 Q9Y468 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL286762 0.82 PKM (0.67) PKMNPC1PKLRRAB9AMMP2
SCHEMBL64213 0.81 MMP2 (0.47) PKMMMP2GAAHTTPOLB
Hydrogen Sulfide SCHEMBL27655402 0.80 PKM (0.64) PKMNPC1PKLRRAB9AMMP2
SCHEMBL10497952 0.80 PKM (0.64) PKMNPC1PKLRRAB9AMMP2
Water SCHEMBL8627002 0.80 PKM (0.64) PKMNPC1PKLRRAB9AMMP2
Ammonia Solution, Strong SCHEMBL25386463 0.80 PKM (0.64) PKMNPC1PKLRRAB9AMMP2
Hydrochloric Acid SCHEMBL1328452 0.80 PKM (0.64) PKMNPC1PKLRRAB9AMMP2
Fluoride SCHEMBL27786941 0.80 PKM (0.64) PKMNPC1PKLRRAB9AMMP2
SCHEMBL8627561 0.80 PKM (0.64) PKMNPC1PKLRRAB9AMMP2
SCHEMBL6766191 0.80 POLB (0.45) MMP2GAAPOLBMMP9MMP12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 356 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260008932-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-01-08 US disclosed
EP-4675357-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2026-01-07 EP disclosed
EP-3382453-B1 RESIST UNDERLAYER FILM COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING RESIST UNDERLAYER FILM SHINETSU CHEMICAL CO (JP) 2023-09-20 EP disclosed
EP-2384457-B1 COATING COMPOSITIONS MERCK PATENT GMBH (DE) 2022-07-06 EP disclosed
CN-108693713-B Resist underlayer film material, pattern formation method, and resist underlayer film formation method 信越化学工业株式会社 2022-06-03 CN disclosed
CN-106103396-B Compound, resin, material for forming underlayer film for lithography, pattern formation method, and method for purifying compound or resin 三菱瓦斯化学株式会社 2021-11-30 CN disclosed
CN-107949808-B Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, and method for producing same 三菱瓦斯化学株式会社 2021-10-22 CN disclosed
CN-108137478-B Compound, composition thereof, purification method, resist pattern formation method, and amorphous film production method 三菱瓦斯化学株式会社 2021-09-28 CN disclosed
CN-108693705-B Resist underlayer film material, pattern formation method, and resist underlayer film formation method 信越化学工业株式会社 2021-07-13 CN disclosed
CN-107848983-B Compound, resin, material for forming underlayer film for lithography, resist pattern, method for forming circuit pattern, and method for purifying resist pattern 三菱瓦斯化学株式会社 2021-07-09 CN disclosed
US-6284429-B1 FOR FORMULATING PHOTORESISTS HAVING SENSITIVITY, RESOLUTION, ETCHING RESISTANCE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-09-04 US disclosed
US-6280898-B1 PHOTORESISTS PATTERNS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-08-28 US disclosed
EP-1096318-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-05-02 EP disclosed
EP-1096317-A1 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-05-02 EP disclosed
EP-1085377-A1 Resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-03-21 EP disclosed
EP-1053985-A1 Resist compositions and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2000-11-22 EP disclosed
US-6147249-A ESTER COMPOUND CAPABLE OF FORMING ACID-DECOMPOSABLE POLYMER WHICH CAN BE BLENDED AS BASE RESIN TO FORMULATE RESIST COMPOSITION HAVING HIGHER SENSITIVITY, RESOLUTION AND ETCHING RESISTANCE THAN CONVENTIONAL RESIST COMPOSITIONS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-11-14 US disclosed
EP-1031879-A1 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-08-30 EP disclosed
EP-1004568-A2 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-05-31 EP disclosed
US-5972560-A A CROSSLINKED POLYSILOXANE PHOTOACID GENERATOR HAVING HIGH TRANSPARENCY, HIGH RESOLUTION, IMPROVED LATITUDE OF EXPOSURE, PROCESS ADAPTABILITY, AND FOR PRECISE MICRO-PROCESSING SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-10-26 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260008932-A1 COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, PATTERNING PROCESS, AND RESIST UNDERLAYER FILM FORMATION PROCESS ASH2L, ALKBH2, ITGA1 PKM 4403/4885NPC1 4479/4885PKLR 3843/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.