Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PIK3CD | O00329 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19554731 | 0.88 | MEN1 (0.33) | — | |
| SCHEMBL5442853 | 0.82 | CHRM2 (0.41) | PIK3CD | |
| SCHEMBL8557129 | 0.80 | — | — | |
| SCHEMBL11021303 | 0.80 | LMNA (0.37) | — | |
| SCHEMBL1396230 | 0.78 | — | — | |
| SCHEMBL64624 | 0.77 | LMNA (0.60) | — | |
| SCHEMBL2827756 | 0.76 | — | — | |
| SCHEMBL2928095 | 0.75 | LMNA (0.32) | — | |
| SCHEMBL12120256 | 0.75 | KDM4E (0.33) | — | |
| SCHEMBL14920988 | 0.74 | MEN1 (0.41) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1424 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20190171106-A1 | Silsesquioxane Resin and Oxaamine Composition | DOW SILICONES CORPORATION | 2019-06-06 | — | — | US | claimed |
| WO-2017192345-A1 | SILSESQUIOXANE RESIN AND OXAAMINE COMPOSITION | DOW CORNING CORPORATION (US) | 2017-11-09 | — | — | WO | claimed |
| US-6838019-B2 | Phosphorescent material and electroluminescent device using thereof | RITEK CORPORATION (TW) | 2005-01-04 | — | — | US | claimed |
| US-20030102800-A1 | Phosphorescent material | RITEK CORPORATION (TW) | 2003-06-05 | — | — | US | claimed |
| US-20260086457-A1 | RESIST COMPOSITION AND RESIST PATTERN FORMATION METHOD | TOKYO OHKA KOGYO CO LTD (JP) | 2026-03-26 | — | — | US | disclosed |
| US-20260086458-A1 | RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND POLYMER COMPOUND | TOKYO OHKA KOGYO CO LTD (JP) | 2026-03-26 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| US-20260079394-A1 | RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND AND ACID DIFFUSION CONTROL AGENT | TOKYO OHKA KOGYO CO LTD (JP) | 2026-03-19 | — | — | US | disclosed |
| US-20260079395-A1 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND AND ACID DIFFUSION CONTROL AGENT | TOKYO OHKA KOGYO CO LTD (JP) | 2026-03-19 | — | — | US | disclosed |
| US-12566376-B2 | Resist composition and resist pattern forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2026-03-03 | — | — | US | disclosed |
| US-20260050211-A1 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND INTERMEDIATE THEREOF | TOKYO OHKA KOGYO CO LTD (JP) | 2026-02-19 | — | — | US | disclosed |
| US-20260003277-A1 | NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM | TOKYO OHKA KOGYO CO LTD (JP) | 2026-01-01 | — | — | US | disclosed |
| US-5220023-A | Intermediates for inotropic agents | JANSSEN PHARMACEUTICA N.V. (BE) | 1993-06-15 | — | — | US | disclosed |
| US-5120845-A | Treating congestive heart failure | JANSSEN PHARMACEUTICA N.V. (BE) | 1992-06-09 | — | — | US | disclosed |
| US-5064958-A | CHEMICAL INTERMEDIATES FOR ANTIBACTERIAL COMPOUNDS | PFIZER INC. (US) | 1991-11-12 | — | — | US | disclosed |
| US-5043327-A | Treating mammals with congestive heart failure | JANSSEN PHARMACEUTICA N.V. (BE) | 1991-08-27 | — | — | US | disclosed |
| US-4941940-A | Etching a hydrolyzable polymer, hydrolysis, electroless plating with nickel or copper | JP LABORATORIES, INC. (US) | 1990-07-17 | — | — | US | disclosed |
| US-4939290-A | Bactericides | PFIZER INC. (US) | 1990-07-03 | — | — | US | disclosed |
| EP-0370686-A2 | A process for preparing quinolone carboxylic acid intermediates | PFIZER INC. (US) | 1990-05-30 | — | — | EP | disclosed |
| US-4927970-A | Substituted 3-cyclobutene-1,2-dione intermediates | BRISTOL-MYERS COMPANY (US) | 1990-05-22 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (9 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260086458-A1 | RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND POLYMER COMPOUND | RER1, ITGA1, AR | PIK3CD 3383/4885 |
| US-20260086457-A1 | RESIST COMPOSITION AND RESIST PATTERN FORMATION METHOD | CCND2, CCNA1, CCND1 | PIK3CD 2991/4885 |
| US-20260003277-A1 | NEGATIVE PHOTOSENSITIVE COMPOSITION, AND METHOD FOR PRODUCING PATTERNED CURED FILM | H1-4, H1-10, H1-0 | PIK3CD 1111/4885 |
| US-20260079395-A1 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND AND ACID DIFFUSION CONTROL AGENT | F9, AFF2, AFF1 | PIK3CD 3427/4885 |
| US-20260050211-A1 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND INTERMEDIATE THEREOF | RARG, RXRG, IGF1R | PIK3CD 4671/4885 |
| US-12566376-B2 | Resist composition and resist pattern forming method | RER1, REV1, GAR1 | PIK3CD 4801/4885 |
| US-20260079394-A1 | RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND AND ACID DIFFUSION CONTROL AGENT | DRD1, DRD2, FANCD2 | PIK3CD 2241/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | PIK3CD 241/4885 |
| US-20030102800-A1 | Phosphorescent material | PKD1, RPS6KA1, RPS6KA6 | PIK3CD 489/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.